Paul Cunningham, CVP and GM of the System Verification Group at Cadence gave the afternoon Keynote on Tuesday at DVCon and doubled down on his verification-throughput message. At the end of the day, what matters most to us in verification is the number of bugs found and fixed per dollar per day. You can’t really argue with that message.… Read More
A Review of Clock Generation and Distribution for Off-Chip Interfacing
At the recent ISSCC conference, Mozhgan Mansuri from Intel gave an enlightening (extended) short course presentation on all thing related to clocking, for both wireline and wireless interface design. [1] The presentation was extremely thorough, ranging from a review of basic clocking principles to unique circuit design … Read More
Features of Short-Reach Interface IP Design
The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces. There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2] (Many of the configurations of interest … Read More
Webinar: Samtec Teams with Otava and Avnet to Tame mmWave Design
mmWave design has traditionally been a boutique technology used in satellite and defense applications. Lately that’s changing. It turns out the complex, high frequency capabilities of mmWave technology are a key enabler for the 5G wireless networks being deployed today. I discussed some of this backstory in a recent post about… Read More
Perforce Embedded DevOps Summit 2021 and the Path to Secure Collaboration on the Cloud
Perforce recently held their virtual Embedded DevOps Summit. There was a lot of great presentations across many disciplines. Of particular interest to me, and likely to the SemiWiki readership as well, was a presentation by Warren Savage entitled Secure Collaboration on a Cloud-based Chip Design Environment. I’ll provide … Read More
Features of Resistive RAM Compute-in-Memory Macros
Resistive RAM (ReRAM) technology has emerged as an attractive alternative to embedded flash memory storage at advanced nodes. Indeed, multiple foundries are offering ReRAM IP arrays at 40nm nodes, and below.
ReRAM has very attractive characteristics, with one significant limitation:
- nonvolatile
- long retention time
- extremely
Webinar: Achronix and Vorago Deliver Innovation to Address Rad-Hard and Trusted SoC Design
Radiation hardening is admittedly not a challenge every SoC design team faces. Methods to address this challenge typically involve a new process technology, a new library or both. Trusted, secure design is something more design teams worry about and that number is growing as our interconnected world creates new and significant… Read More
TSMC ISSCC 2021 Keynote Discussion
Now that semiconductor conferences are virtual there are better speakers since they can prerecord and we have the extra time to do a better job of coverage. Even when conferences go live again I think they will also be virtual (hybrid) so our in depth coverage will continue.
ISSCC is one of the conferences we covered live since it’s… Read More
Probing UPF Dynamic Objects
UPF was created to go beyond what HDL can do for managing on-chip power. HDLs are agnostic when it comes to dealing with supply & ground connections, power domains, level shifters, retention and other power management related elements of SoCs. UPF fills the breach allowing designers to specify in detail what parts of the design… Read More
Samtec Lets You Learn from Home with a Great Webinar Lineup
Work from home (WFH) has become a normal occurrence this past year. “Do you work from home?” “Of course, where else?” Samtec is taking the whole work from home thing up a notch with a new webinar lineup for 2021. Back by popular demand, they are launching a new series of educational webinars. Started last year, the gEEk SpEEk Webinar… Read More
The 2025 Semi Industry Forum: On the Road to a $1 Trillion Industry