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SEMICON Southeast Asia was held this week in Penang, Malaysia. Over 6500 people attended the conference to learn about the latest trends and equipment in semiconductor manufacturing.
Dr. Dan Tracy, Senior Director Industry Research and Statistics at SEMI, presented an optimistic outlook for the semiconductor equipment market… Read More
At the SPIE Advanced Lithography Conference imec published a number of papers on EUV, multi-patterning and other lithography issues. In addition to seeing several of the papers presented I had a chance to sit down with imec’s director of advanced patterning, Greg McIntyre. In this article I will summarize my discussions… Read More
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
I’m developing a taste for user-group meetings. In my (fairly) recently assumed role as a member of the media, I’m only allowed into the keynotes, but from what I have seen, vendors work hard to make these fresh and compelling each year through big-bang product updates and industry/academic leaders talking about their work in bleeding-edge… Read More
I’ve been attending DAC since the late 1980’s and can tell you that it’s an annual highlight for me and anyone else interested in the EDA, IP and semiconductor industries. Where else can you see most of the big and little vendors of EDA software, semiconductor IP and foundries in one place? I recently blogged about… Read More
At the SPIE Advanced Lithography conference I sat down with Mike Lercel, Director of Strategic Marketing for ASML for an update. ASML also presented several papers at the conference and I attended many of these. In this article, I will discuss my interview with Mike and summarize the ASML presentations.… Read More
Designing an IC has both a logical and physical aspect to it, so while the logic in your next chip may be bug-free and meet the spec, how do you know if the physical layout will be reliable in terms of EM (electro-migration), IR (voltage drops) and thermal issues? EDA software once again comes to our rescue to perform the specific type… Read More
As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More
I’ve lived and worked in Silicon Valley for 13 years, but since 1995 I’ve been in the Silicon Rainforest (aka Oregon) where the world’s number one semiconductor company Intel, has a large presence, along with dozens of smaller high-tech firms. In the past year I’ve started to attend events organized … Read More
Much though some of us might wish otherwise, distributed development teams are here to stay. Modern SoC design requires strength and depth in expertise in too many domains to effectively source from one site; competitive multi-national businesses have learned they can very effectively leverage remote sites by building centers… Read More
From the Selfie to Samantha: The Next Trillion-Dollar Behavior