You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 50
[name] => Events
[slug] => events
[term_group] => 0
[term_taxonomy_id] => 50
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 1450
[filter] => raw
[cat_ID] => 50
[category_count] => 1450
[category_description] =>
[cat_name] => Events
[category_nicename] => events
[category_parent] => 0
[is_post] =>
)
Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.
Dassault’s Synchronicity… Read More
Last Friday I attended a breakfast seminar organized by SEMI in Hillsboro, Oregon with fascinating speakers from several high-tech companies: Qorvo, Intel, Oregon Angel Fund, Kimera, Moonshadow Mobile and Yole Development. I recalled that Qorvo was created from the merger of TriQuint Semiconductor and RF Micro Devices back… Read More
I’m a believer in product life-cycle management (PLM) for semiconductor design. It’s not an attention-grabbing topic like faster verification or improved PPA in implementation, but now massive IP-based design is routine, IP’s are sourced from multiple suppliers each cycling though multiple revisions and now that design … Read More
SEMICON Southeast Asia was held this week in Penang, Malaysia. Over 6500 people attended the conference to learn about the latest trends and equipment in semiconductor manufacturing.
Dr. Dan Tracy, Senior Director Industry Research and Statistics at SEMI, presented an optimistic outlook for the semiconductor equipment market… Read More
At the SPIE Advanced Lithography Conference imec published a number of papers on EUV, multi-patterning and other lithography issues. In addition to seeing several of the papers presented I had a chance to sit down with imec’s director of advanced patterning, Greg McIntyre. In this article I will summarize my discussions… Read More
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
I’m developing a taste for user-group meetings. In my (fairly) recently assumed role as a member of the media, I’m only allowed into the keynotes, but from what I have seen, vendors work hard to make these fresh and compelling each year through big-bang product updates and industry/academic leaders talking about their work in bleeding-edge… Read More
I’ve been attending DAC since the late 1980’s and can tell you that it’s an annual highlight for me and anyone else interested in the EDA, IP and semiconductor industries. Where else can you see most of the big and little vendors of EDA software, semiconductor IP and foundries in one place? I recently blogged about… Read More
At the SPIE Advanced Lithography conference I sat down with Mike Lercel, Director of Strategic Marketing for ASML for an update. ASML also presented several papers at the conference and I attended many of these. In this article, I will discuss my interview with Mike and summarize the ASML presentations.… Read More
Designing an IC has both a logical and physical aspect to it, so while the logic in your next chip may be bug-free and meet the spec, how do you know if the physical layout will be reliable in terms of EM (electro-migration), IR (voltage drops) and thermal issues? EDA software once again comes to our rescue to perform the specific type… Read More
Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business