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Semiconductor companies are looking for ways to keep their business profitable by managing expenses on both the design and test side of electronic products, which is quite the challenge as the trends show increases in test pattern count and therefore test costs. Scan compression is a well-known technique first created over 15… Read More
Automotive ICs have to operate in a very demanding environment in terms of both temperature and voltage ranges, along with the ability to withstand g-forces and be sealed from the elements. Not an easy design challenge. For many consumer ICs we see output drive currents on the IO pins measured in mA, however in automotive if you want… Read More
After reading the Cadence blog post –“Dracula, Vampire, Assura, PVS: A Brief History” – Dr. Andrew Moore has written the below article where he helps readers get a sense as to what “the year of hell” was like, from one of the key individuals who lived it. Andrew also addresses and corrects some of the “urban legends”… Read More
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
I cycle for fitness five days per week and use the Strava.com site to post my rides, analyze the ride data and chat with other cyclists, however in February this year the Amazon Web Services went down which crashed Strava, making me sad and nervous at the same time. Of course, there are alternatives to Amazon Web Services and the engineers… Read More
Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More
The diamond jewelry industry encourages customers to focus on the 4C’s — cut, clarity, color, and carats. At the recent PCB Forum conducted by Mentor (a Siemens business) in Santa Clara, I learned that current system design flows also require an emphasis on the 4C’s — collaboration, concurrency, consistency… Read More
I read at least one hour of news every day to keep informed, and I’ve read so many stories about autonomous vehicles that the same, familiar company names continue to dominate the thought leadership. What really caught my attention this month was an announcement about autonomous vehicle technology coming from Mentor Graphics… Read More
It seems like I have written a lot about SRAM lately. Let’s face it SRAM is important – it often represents large percentages of the area on SOC’s. As such, SRAM yield plays a major role in determining overall chip yields. SRAM is vulnerable to defect related failures, which unlike variation effects are not Gaussian in nature. Fabrication… Read More
One serious challenge to the early promise of accelerating verification through emulation was that, while in theory the emulator could run very fast, options for driving and responding to that fast model were less than ideal. You could use in-circuit emulation (ICE), connecting the emulation to real hardware and allowing you… Read More
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