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Using IC Data Management Tools and Migrating Vendors

Using IC Data Management Tools and Migrating Vendors
by Daniel Payne on 01-23-2013 at 10:50 am

Non-volatile memory is used in a wide variety of consumer and industrial applications and comes in an array of architectures like Serial Flash and CBRAM (Conductive Bridging RAM). I caught up with Shane Hollmer by phone this week to gain some insight into a recent acquisition of Atmel’s serial flash components, and how that… Read More


Verdi: No Requiem for Openness

Verdi: No Requiem for Openness
by Paul McLellan on 01-22-2013 at 8:10 pm

I sat down last week for lunch with Michael Sanie. Mike and I go back a long way, working together at VLSI Technology (where his first job out of school was to take over the circuit extractor that I’d originally written) and then in strategic marketing at Cadence. Now Mike has marketing for (almost?) all of Synopsys’s … Read More


New PCI Express 3.0 Equalization Requirements

New PCI Express 3.0 Equalization Requirements
by Eric Esteve on 01-22-2013 at 9:18 am

PCI Express 3.0 increased the supported data rate to 8 Gbps, which effectively doubles the data rate supported by PCI Express 2.0. While the data rate was increased, no improvement was made to the channels. As such, an 8 Gbps channel in PCIe 3.0 experiences significantly more loss than one implemented in PCIe 2.0. To compensate for… Read More


First Time, Every Time

First Time, Every Time
by SStalnaker on 01-21-2013 at 7:10 pm

While this iconic advertising phrase was first used to describe the ink reliability of a ballpoint pen, it perfectly summarizes the average consumer’s attitude toward automobile reliability as well. We don’t really care how it’s done, as long as everything in our car works first time, every time. Even when that includes heated… Read More


Double Patterning for IC Design, Extraction and Signoff

Double Patterning for IC Design, Extraction and Signoff
by Daniel Payne on 01-21-2013 at 3:27 pm

TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More


What did CES 2013 mean for #SemiEDA?

What did CES 2013 mean for #SemiEDA?
by Don Dingee on 01-18-2013 at 4:55 pm

CES is the preeminent gadget show, and in the LVCC South Hall a wave has been building for some time. It’s now the place where chipsets are introduced, and this year saw a wide range of introductions from Atmel, Bosch, Broadcom, Intel (OK, they’re still in Central Hall), InvenSense, Marvell, NVIDIA, Qualcomm, Samsung, ST-Ericsson,… Read More


Yawn… New EDA Leader Results Are Coming

Yawn… New EDA Leader Results Are Coming
by Randy Smith on 01-18-2013 at 4:00 pm

We will soon start to see the quarterly financial reporting installments of the “Big 3” public EDA companies. I predict they will be as boring as usual. I am not sure if I would want it any differently though.

Back in the 90s there were times when it was truly interesting to wait to see what Cadence, Mentor, or later Synopsys, might announce.… Read More


Oasys Has a New CEO

Oasys Has a New CEO
by Paul McLellan on 01-18-2013 at 2:21 pm

Scott Seaton is the new CEO of Oasys Design Systems. Paul van Besouw, the CEO since the company’s founding, becomes the CTO. I met Scott last year when I was doing some consulting work for Carbon Design where he was VP of sales (the new VP sales at Carbon is Hal Conklin, by the way).

I talked to Scott about why he had joined Oasys. … Read More


Buying DDRn Controller IP AND Memory Model to the same IP vendor gives real TTM advantage

Buying DDRn Controller IP AND Memory Model to the same IP vendor gives real TTM advantage
by Eric Esteve on 01-17-2013 at 10:52 am

We all know the concept of “one stop shop”, becoming popular in the Design IP market. The topic we will address today is NOT the “one stop shop”, even if it looks similar, but rather that we could call “consistent design flow”.

What does that means? Simply that, if your SoC design is integrating a DDRn (LPDDR2, DDR3 or even DDR4, let’s… Read More


Fixing Double-patterning Errors at 20nm

Fixing Double-patterning Errors at 20nm
by Paul McLellan on 01-16-2013 at 10:54 pm

David Avercrombie of Mentor won the award for the best tutorial at the 2012 TSMC OIP for his presentation, along with Peter Hsu of TSMC, on Finding and Fixing Double Patterning Errors in 20nm. The whole presentation along with the slides is now available online here. The first part of the presentation is an introduction to double … Read More