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Intel Invests in the Fabless Ecosystem!

Intel Invests in the Fabless Ecosystem!
by Daniel Nenni on 06-22-2014 at 11:00 am

During my illustrious career one of the most useful axioms that I use just about everyday day is: “Understand what people say but also understand why they are saying it.” This certainly applies to press releases so let’s take a look at what Intel unleashed during #51DAC (in alphabetical order):

ANSYS And Intel Collaborate
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ARC EM DSP supports Always-on Devices

ARC EM DSP supports Always-on Devices
by Eric Esteve on 06-22-2014 at 3:01 am

The ARC EM family is the low-power, embedded and low footprint processor part of the larger ARC processor. To target the ultra low-power markets like wearable and IoT, Synopsys has added DSP capabilities to EM5D and EM7D. To be specific, these cores are optimized for ultra low-power control and DSP, thanks to:

  • Energy-efficient
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Enabling Technologies that Will Shape the next Wearables

Enabling Technologies that Will Shape the next Wearables
by Daniel Nenni on 06-21-2014 at 10:00 am

One of the benefits of spending the last 30 years working in Silicon Valley and publishing a fabless semiconductor book is that I get invitations to speak at events I would normally be attending. Being on the other side of the podium is truly a unique experience and one worth pursuing, absolutely. This month I spoke at #51DAC about … Read More


Noise-Coupled Analysis for Automotive ICs at DAC

Noise-Coupled Analysis for Automotive ICs at DAC
by Daniel Payne on 06-20-2014 at 2:00 pm

My favorite method to learn about EDA tools at DAC is by listening to actual IC designers, so on June 3rd I heard Jacob Bakker from NXP talk about his experience with noise coupled analysis for advanced mixed-signal automotive ICs.… Read More


Intel & Ansys Enable 14nm Chip Production

Intel & Ansys Enable 14nm Chip Production
by Pawan Fangaria on 06-20-2014 at 10:00 am

In the semiconductor industry, it feels great to hear about the process technology shrinking to lower nodes along with innovative transistor structures that offer major gains in PPA (Power, Performance and Area). However, it requires huge investment of capital, time and effort from foundries to conceptualize, prototype and… Read More


Workshop: Embedded Applications and Kernels

Workshop: Embedded Applications and Kernels
by Daniel Payne on 06-19-2014 at 6:13 pm

Design Automation Conference Workshop on Suite of Embedded Applications and Kernels

In June, the first Suite of Embedded Applications and Kernels, or SEAK, workshop at the 2014 Design Automation Conference in San Francisco introduced a new Defense Advanced Research Projects Agency program in the area of embedded system benchmarking… Read More


SpyGlass CDC: A Comprehensive solution for addressing CDC issues

SpyGlass CDC: A Comprehensive solution for addressing CDC issues
by Pawan Fangaria on 06-19-2014 at 7:30 am

About a decade ago, semiconductor designs had just a few asynchronous clocks which were easily managed by designers through the process of manual design reviews. The situation today is completely different. An SoC can have hundreds of asynchronous clocks, driving different complex functions, spread across various IPs, supplied… Read More


Aldec Can Ensure Smooth System Integration

Aldec Can Ensure Smooth System Integration
by Luke Miller on 06-17-2014 at 9:00 pm

Tools, tools, tools. Designs are rapidly changing, JESD204b, Hybrid Memory cube and all other Gigabit serialization schemes are here to stay. RIP DDR. This means board level simulations with respect to firmware (FPGA) are going to be more challenging than ever. Why? you ask, especially if the board layout is simpler? True, but… Read More


Five Things You Don’t Know About MunEDA

Five Things You Don’t Know About MunEDA
by Paul McLellan on 06-17-2014 at 3:00 pm

So first the one thing that you do know. MunEDA are based in Munich which makes them German. I have to confess that until I got involved helping them a bit with some marketing stuff that that was about all I knew about them too.

So now five things that you might not know:

1. MunEDA have a much wider customer list that you know and would even… Read More


FinFET Based Designs Made Easy & Reliable

FinFET Based Designs Made Easy & Reliable
by Pawan Fangaria on 06-15-2014 at 11:00 am

Although semiconductor manufacturing has taken off with FinFET based process technology which provides lucrative payoffs on performance improvement, power reduction and area saving in devices for high density and high performance SoC demand of modern era, apprehensions remain about its reliability due to reduced noise … Read More