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International Workshop on Logic and Synthesis

International Workshop on Logic and Synthesis
by Paul McLellan on 04-20-2014 at 12:54 am

There are always a number of other events that are colocated with DAC. One this year is the 23rd International Workshop on Logic and Synthesis (IWLS) that is held the weekend before DAC on May 30th and June 1st. Strictly speaking it is not colocated since it is in the Galleria Park Hotel on Sutter Street a few blocks away whereas DAC itself… Read More


EUV Slips a Year Per Year…Or More

EUV Slips a Year Per Year…Or More
by Paul McLellan on 04-19-2014 at 1:54 am

I was at EDPS in Monterey the last couple of days. It is one of the most interesting conferences to attend. Go next year since you already missed it this year. It is not big but the quality of the content is high. Historically the dinner in the middle is in the Monterey Yacht Club and there is a keynote speech. A few years ago it was me but this… Read More


Power and Thermal Simulation in ESL Verification Flows

Power and Thermal Simulation in ESL Verification Flows
by Daniel Payne on 04-18-2014 at 8:11 pm

At the recent DVcon there was a keen focus on design verification and validation. Much of the attention is on Logic/circuit design verification, UVM, and IP verification. At the system level functional verification has improved to comprehend complex hardware and software interaction using Virtual Platforms/SystemC and Transaction… Read More


Signoff Accurate Timing Analysis at Improved Run-time & Capacity

Signoff Accurate Timing Analysis at Improved Run-time & Capacity
by Pawan Fangaria on 04-18-2014 at 4:30 pm

The semiconductor design sizes, these days, can easily be of the order of several hundred millions of cells, adding into the complexity of verification. Amid ever growing design sizes, it’s a must that the timing verification is done accurately. Normally Static Timing Analysis (STA) is done to check whether all clocks and signals… Read More


Does Processor IP still get the Lion’s share in 2013?

Does Processor IP still get the Lion’s share in 2013?
by Eric Esteve on 04-17-2014 at 1:00 pm

I think that the answer is pretty obvious, but the interesting point is to figure out which processor type, and which part of revenues, up-front license or royalties? One of my customers, let’s call him Mr. X, ask me to clarify this point. Mr. X has bought the excellent report from Gartner “Market Share: Semiconductor Design Intellectual… Read More


Customization can add extraordinary power to your tool

Customization can add extraordinary power to your tool
by Pawan Fangaria on 04-16-2014 at 4:30 pm

In EDA arena we often find companies providing customization platforms along with the tools they offer to their customers. I admire such companies because they equip the end users of a tool to extend its functionality as they like according to their environment, thus increasing the designer productivity significantly. And I’m… Read More


Will IoT Drive the Next Semiconductor Revolution?

Will IoT Drive the Next Semiconductor Revolution?
by Daniel Nenni on 04-14-2014 at 9:00 pm

To further my quest to comprehend the latest trends in the semiconductor industry continues, I spent the morning with SEMI at the “The Silicon Valley Breakfast Forum: Internet of Things (IoT) – Driving the Microelectronics Revolution” seminar. I’m a big fan of the breakfast seminar concept. I’m up early anyway and it is … Read More


Show Me How To Get Better DRC and LVS Results For My SoC Design

Show Me How To Get Better DRC and LVS Results For My SoC Design
by Daniel Payne on 04-14-2014 at 3:30 pm

Most IC engineers learn best by hands-on experience when another more experienced person can show us what to do. If you cannot find that experienced person, then the next best thing is a video from an expert. I was surprised to find out that video was so important today that the #2 most viewed web site on the Internet was www.youtube.comRead More


Fast & Accurate Thermal Analysis of 3D-ICs

Fast & Accurate Thermal Analysis of 3D-ICs
by Pawan Fangaria on 04-14-2014 at 11:00 am

As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More


A Brief History of Functional Verification

A Brief History of Functional Verification
by Paul McLellan on 04-13-2014 at 3:00 pm

Usually these brief history pieces are totally written by the SemiWiki blogger whose name is at the top. Often me since that was how I prototyped book chapters (buy). Well, OK, I did actually write this but it is completely cribbed from a presentation earlier this week by Wally Rhines who gave a sort of keynote at the announcement of… Read More