At the recent TSMC OIP symposium, a collaborative presentation by Synopsys and Xilinx highlighted the importance of incorporating the local FinFET device self-heating temperature increase on the acceleration of device reliability mechanisms.… Read More
Electronic Design Automation
How Virtualization Makes Network Processor Verification Efficient
When Ethernet was introduced in 1983 it ran at 10Mbps and mostly relied on hubs and coaxial cable. Twelve years later a faster speed was introduced, running at 100Mbps. Since then we have seen an acceleration of new data rate introductions. According top the Ethernet Alliance, Ethernet could have 12 speeds before 2020, with 6 of … Read More
Interconnect Watch: 3 Chip Design Merits for Network Applications
The countdown to the end of Moore’s Law is coinciding with the rising complexity in system-on-chip (SoC) designs. And that’s not a mere coincidence. The leverage that has long been coming from shrinking process nodes in terms of cost, performance and power benefits is now increasingly being accomplished through… Read More
Price of Admission $0.00 at Inaugural Silicon Valley Conference
Back in 2002, the Southwest DFT Conference was born and experts on design for test (DFT) and test got together to share ideas and talk to people in this industry that were trying to solve test challenges of the day.… Read More
About That Landauer Limit…
You may have heard of the Landauer principle or the Landauer limit. This defines a lower bound on switching power dissipation in any form of digital circuit. Rolf Landauer first presented this principle in 1961, while working at IBM. It’s not limited by how the circuit is built – you can use FinFETS or spintronics or even dilithium… Read More
IoT chipsets and enterprise emulation tools
When most people talk about the IoT, it is usually all about wearables-this and low-power-that – because everyone is chasing the next huge consumer post-mobile device market. Mobile devices have provided the model. The smartphone is the on-ramp to the IoT for most consumers, with Bluetooth, Wi-Fi, and LTE, and maybe a dozen or … Read More
Learning about 3D Integration of ICs and Systems
We blog a lot about Moore’s Law, and even “More than Moore” where 3D integration of ICs and systems are used to get lower product costs. One big challenge with 3D integration of ICs is that most EDA software was really intended only for abstracting at 2D or 2.5D structures. Over the past several years there have … Read More
Our Own Cadence Amongst the Best Multinational Workplaces!
There were some very happy faces around MemCon this week for a variety of reasons. Paul McLellan was smiling because he now works full time for Cadence and has the best medical benefits ever and of course I was smiling because there was free food! … Read More
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
A Connectivity Verification Idea
A Wirble
In case you hadn’t noticed, I like to write from time to time about EDA product ideas. I assume these are somewhat original, but given the maxim “there’s nothing new under the sun…”, I may well be wrong. In any event, I like to share these ideas if only to demonstrate that innovation in EDA is not stalled because we’ve run out big,… Read More


A Century of Miracles: From the FET’s Inception to the Horizons Ahead