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The Latest in Static Timing Analysis with Variation Modeling

The Latest in Static Timing Analysis with Variation Modeling
by Tom Dillinger on 03-30-2016 at 12:00 pm

In many ways, static timing analysis (STA) is more of an art than a science. Methodologists are faced with addressing complex phenomena that impact circuit delay — e.g., signal crosstalk, dynamic I*R supply voltage drop, temperature inversion, device aging effects, and especially (correlated and uncorrelated) process… Read More


Bridging Design Environments for Advanced Multi-Die Package Verification

Bridging Design Environments for Advanced Multi-Die Package Verification
by Tom Dillinger on 03-28-2016 at 12:00 pm

This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More


IC Design Optimization for Radiation Hardening

IC Design Optimization for Radiation Hardening
by Daniel Payne on 03-28-2016 at 7:00 am

I was born in 1957, the same year that the Soviets launched the first satellite into Earth orbit, officially starting the Space Race between two global super powers. Today there are many countries engaged in space research and I just read about how engineers at IEAv (Institute for Advanced Studies) in Brazil did their IC design optimization… Read More


Improvements in SRAM Yield Variation Analysis

Improvements in SRAM Yield Variation Analysis
by Tom Dillinger on 03-27-2016 at 12:00 pm

The design of an SRAM array requires focus on the key characteristics of readability, writeability, and read stability. As technology scaling has enabled the integration of large (cache) arrays on die, the sheer number of bitcells has necessitated a verification methodology that focuses on “statistical high-sigma” variation… Read More


Webinar: A Tool for Process and Device Evaluation

Webinar: A Tool for Process and Device Evaluation
by Tom Simon on 03-24-2016 at 12:00 pm

Not only are foundries continuing to introduce processes at new advanced nodes, they are frequently updating or adding processes at existing nodes. There are many examples that illustrate this well. TSMC now has 16FF, 16FF+ and now 16FFC. They are also announcing 10nm and 7nm processes. In addition, they are going back to older… Read More


SystemC and Adam’s Law

SystemC and Adam’s Law
by Bernard Murphy on 03-24-2016 at 7:00 am

At DVCon I sat in on a series of talks on using higher-level abstraction for design, then met Adam Sherer to get his perspective on progress in bringing SystemC to the masses (Adam runs simulation-based verification products at Cadence and organized the earlier session). I have to admit I have been a SystemC skeptic (pace Gary Smith)… Read More


What SOC Size Growth Means for IP Management

What SOC Size Growth Means for IP Management
by Tom Simon on 03-22-2016 at 12:00 pm

Whether or not in the past you believed all the of rhetoric about exploding design complexity in SOC’s, today there can be no debate that SOC size and complexity is well beyond something that can be managed without some kind of design management system. As would be expected, development of most larger designs relies on a data management… Read More


Analog Mixed-Signal Layout in a FinFET World

Analog Mixed-Signal Layout in a FinFET World
by Tom Dillinger on 03-20-2016 at 12:00 pm

The intricacies of analog IP circuit design have always required special consideration during physical layout. The need for optimum device and/or cell matching on critical circuit topologies necessitates unique layout styles. The complex lithographic design rules of current FinFET process nodes impose additional restrictions… Read More


Can Qualcomm avoid repeating Motorola’s fate?

Can Qualcomm avoid repeating Motorola’s fate?
by Don Dingee on 03-18-2016 at 4:00 pm

NPR had an interesting guest this morning: Edward Luce, author of “Time to Start Thinking: America in the Age of Descent”. I’m not about to turn SemiWiki into a politics blog, but there is some precedent in the technology business. I’ve caught myself saying more than once recently that “Motorola is no longer the company I worked 14… Read More


Custom IC Design Flow with OpenAccess

Custom IC Design Flow with OpenAccess
by Daniel Payne on 03-18-2016 at 12:00 pm

Imagine being able to use any combination of EDA vendor tools for schematic capture, SPICE circuit simulation, layout editing, place & route, DRC, LVS and extraction. On the foundry side, how about creating just a single Process Development Kit (PDK), instead of vendor-specific kits. Well, this is the basic premise of a recent… Read More