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Capture the Light with Integrated Photonics

Capture the Light with Integrated Photonics
by Mitch Heins on 07-03-2017 at 7:00 am


I wrote up a quick article in the weeks before the Design Automation Conference (DAC) letting readers know that Integrated Photonics were indeed coming to DAC again this year. As a follow up, I attended the DAC presentation, ‘Capture the Light. An Integrated Photonics Design Solution from Cadence, Lumerical and PhoeniX Software’,… Read More


The Official SemiWiki #54DAC Party Guide!

The Official SemiWiki #54DAC Party Guide!
by Daniel Nenni on 06-13-2017 at 12:00 pm

With the premier conference for semiconductor design enablement just around the corner I would like to take this time and space to talk about what is really happening at the #54DAC and that would be the parties! Granted the DAC parties are nothing like we used to have in the 1980s and the 1990s since we have matured as an industry but … Read More


Cadence Design Systems @ #54DAC!

Cadence Design Systems @ #54DAC!
by Daniel Nenni on 06-11-2017 at 8:00 am

This year Cadence Design Systems is showcasing system design enablement in their booth, capitalizing on the industry shift from naked chip design to system level chip design. Apple started it with making the chips inside the iProducts as part of the system and now other systems companies are looking to take more control over their… Read More


Photonics at DAC – Integrated Electronic/Photonic Design Flow to be Presented at Cadence Theater

Photonics at DAC – Integrated Electronic/Photonic Design Flow to be Presented at Cadence Theater
by Mitch Heins on 06-09-2017 at 12:00 pm


I recently wrote an article on SemiWiki talking about the integrated Electronic/Photonic Design Automation (EPDA) flow that is being developed by Cadence Design Systems, Lumerical Solutions and PhoeniX Software and how that flow is now expanding into the system level through SiP (system in package) techniques.

Up till recently,… Read More


System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs

System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs
by Tom Dillinger on 06-08-2017 at 4:00 pm

Regular Semiwiki readers are aware of the rapid emergence of various (multi-die) advanced package technologies, such as: FOWLP (e.g., Amkor’s SWIFT, TSMC’s InFO); 2D die placement on a rigid substrate (e.g., TSMC’s CoWoS); and, 2.5D “stacked die” with vertical vias (e.g., any of the High Bandwidth Memory,… Read More


Getting to IP Functional Signoff

Getting to IP Functional Signoff
by Bernard Murphy on 06-01-2017 at 7:00 am

In the early days of IP reuse and platform-based design there was a widely-shared vision of in-house IP development teams churning out libraries of reusable IP, which could then be leveraged in many different SoC applications. This vision was enthusiastically pursued for a while; this is what drove reusability standards and … Read More


CPU, GPU, H/W Accelerator or DSP to Best Address CNN Algorithms?

CPU, GPU, H/W Accelerator or DSP to Best Address CNN Algorithms?
by Eric Esteve on 05-25-2017 at 7:00 am

If you read an article dealing with Convolutional Neural Network (CNN), you will probably hear about the battle between CPU and GPU, both off-the-shelf standard product. Addressing CNN processing needs with standard CPU or GPU is like having to sink a screw when you only have a hammer or a monkey wrench available. You can dissert… Read More


System-Level Power Estimation

System-Level Power Estimation
by Bernard Murphy on 05-09-2017 at 7:00 am

When I first saw that Rob Knoth (Product Director at Cadence) had proposed this topic as a subject for a blog, my reaction was “well, how accurate can that be?” I’ve been around the power business for a while, so I should know better. It’s interesting that I jumped straight to that one metric for QoR; I suspect many others will do the same.… Read More


EDA CEO Outlook 2017

EDA CEO Outlook 2017
by Daniel Nenni on 04-28-2017 at 7:00 am

A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More


Lip-Bu on Opportunity

Lip-Bu on Opportunity
by Bernard Murphy on 04-27-2017 at 7:00 am

Given a chance to talk with someone as connected as Lip-Bu Tan (President and CEO of Cadence and Chairman of the VC firm Walden International), it is tempting to ask all the usual questions about industry growth and directions in cloud, automotive, IIoT, AI and so on. I wanted to try something different. If you make a living (or plan… Read More