3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More
A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products
Integrated circuits, or chips, lie at the heart of today’s electronic systems that are mission critical for almost every sector of the economy – from healthcare, to banking, military equipment, cars, planes, telecommunications, and the internet itself. The data flowing through these systems is the lifeblood of modern… Read More
Ansys and NVIDIA Collaboration Will Be On Display at DAC 2024
Highlights:
- NVIDIA will be demonstrating Ansys solutions running on NVIDIA GPU hardware in the Ansys booth
- Ansys CTO Prith Banerjee will speak at the DAC panel on EDA and Disruptive Technologies titled “Why Is EDA Playing Catchup to Disruptive Technologies Like AI? What Can We Do to Change This?”.
- Register for the 6 Ansys’ Customer
Don’t Settle for Less Than Optimal – Get the Perfect Inductor Every Time
The meaning of the word “Veloce” is “blazing fast”. It is the inspiration behind the name of the Ansys VeloceRF electromagnetic (EM) passive device synthesis platform that has been a favorite among RF and high-speed integrated circuit (IC) designers for more than 15 years. VeloceRF is a name that designers automatically connect… Read More
Simulation World 2024 Virtual Event
ANSYS Simulation World is an annual conference hosted by ANSYS, Inc., a leading provider of engineering simulation software. The event typically brings together engineers, designers, researchers, and industry experts from around the world to discuss the latest advancements, best practices, and case studies in engineering… Read More
2024 Outlook with John Lee, VP and GM Electronics, Semiconductor and Optics Business Unit at Ansys
We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More
Unleash the Power: NVIDIA GPUs, Ansys Simulation
In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.
Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More
Ansys and Intel Foundry Direct 2024: A Quantum Leap in Innovation
In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The … Read More