For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More
Chiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
eFPGA Enabled Chiplets!
With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
Opinions on Generative AI at CadenceLIVE
According to some AI dreamers, we’re almost there. We’ll no longer need hardware or software design experts—just someone to input basic requirements from which fully realized system technologies will drop out the other end. Expert opinions in the industry are enthusiastic but less hyperbolic. Bob O’Donnell, president, founder… Read More
Chiplet Modeling and Workflow Standardization Through CDX
Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More
Chip War without Soldiers
Every country realizes the importance of producing skilled chip designers who could decide their success as soldiers by creating advanced AI chips for winning the Chip War. Also, every country is now gearing up to build a good semiconductor manufacturing ecosystem to balance the global semiconductor supply chain that could … Read More
Chiplet Q&A with Henry Sheng of Synopsys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.
Are we
… Read MoreAlphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More
Anirudh Keynote at Cadence Live
Anirudh is an engaging speaker with a passion for technology. Acknowledging the sign of the times, he sees significant value-add in AI but reminded us that it is a still supporting actor in system design and other applications where star roles will continue to be played by computational software that’s founded in hard science, … Read More
TSMC 2023 North America Technology Symposium Overview Part 4
TSMC covered their specialty technologies in great detail. Specialty is what we inside the ecosystem used to call weird stuff meaning non-mainstream and fairly difficult to do on leading edge processes. Specialty technologies will play an even more important part of semiconductor design with the advent of chiplets where die… Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?