On the Tuesday of DAC I moderated a panel session on Hardware Assisted Verification in 10 Years: More Need, More Speed. Although this topic obviously could include FPGA-based prototyping, in fact we spent pretty much the whole time talking about emulation. Gary Smith, on Sunday night, actually set up things by pointing out that… Read More
Custom Physical IC Design update from Cadence
Custom IC design and layout is becoming more difficult at 20nm and smaller nodes, so the EDA tools have to get smarter and work harder for us in order to maintain productivity with the fewest iterations to reach our specs. Dave Stylesand John Stabenow of Cadence met with me last Monday in Austin at the DAC exhibit area.
John Stabenow… Read More
DAC: Tempus Lunch
I had time for lunch on Monday. That is to say, there was a Cadence panel session about Has Timing Signoff Innovation has become and Oxymoron? What Happened and How Do We Fix It?
The moderator was Brian Fuller, lately of EE Times but now Editor-in-Chief at Cadence (I’m not sure quite what it means either). On the panel were Dipesh… Read More
The Only DM Platform Integrated with All Major Analog and Custom IC Design Flows
As I have mentioned before, Cliosoft is the biggest little company in EDA with the most talked about products on SemiWiki. At DAC, ClioSoft will introduce integrated SOS design management (DM) solutions providing revision control, design management and multi-site team collaboration for Aglient Technologies’ Advanced Design… Read More
Transistor-Level Update from Cadence at DAC
My 8 years as an IC circuit designer were at the transistor-level, so if that interests you as well then consider what there is to see from Cadence at DAC this year. IC design technology is changing quickly, so keeping up to date is important for your job security and continual education goals.
Here’s what I would recommend attending… Read More
Tempus: Cadence Takes On PrimeTime
Today Cadence announced Tempus, their new timing signoff solution. This has been in development for at least a couple of years and has been built from the ground up to be massively parallelized. Not just that different corners can be run in parallel (which is basically straightforward) but that large designs can be partitioned … Read More
Cadence Technical Sessions @ #50DAC (Free Food!)
Cadence is a DAC anchor, everyone will visit their booth, so lets look at their technical sessions and put our agendas together. Lets start with the breakfast/lunch sessions because Cadence usually puts out quite a spread, we all gotta eat and free food tastes even better:
Has “Timing Signoff Innovation” Become an Oxymoron? What… Read More
Design IP round #2: after road-test, time for the race
Design IP, at least Interface IP, is about 15 years old, but the market was made of one large provider – Synopsys- with many small vendors around. Chip makers were not very comfortable with this picture, especially the Tier 1 considering that the risk (to see the big one being acquired by one of their direct competitor, say Samsung… Read More
How To Design a TSMC 20nm Chip with Cadence Tools
Every process node these days has a new “gotcha” that designers need to be aware of. In some ways this has always been the case but the changes used to be gradual. But now each process node has something discontinuously different. At 20nm the big change is double patterning. At 14/16nm it is FinFET.
Rahul Deokar and John… Read More
CDN Live 2013 in Munich: what’s the next acquisition? Evatronix!
It was definitely a good idea to go to Munich to listen to the keynote talk from Lip-Bu Tan. Did I learned in direct live the name of the next acquisition from Cadence in 2013, after Tensilica and Cosmic Circuits? Yes and the winner is… Evatronix! And cadence as well as Evatronix is enjoying more than 600 customers worldwide, thanks … Read More