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Putting the Ten in Tensilica

Putting the Ten in Tensilica
by Paul McLellan on 10-17-2013 at 3:55 pm

Chris Rowen of Cadence’s Tensilica announced the tenth generation of the Xtensa customizable processor at the Linley Microprocessor Conference yesterday. Chris was one of the founders of Tensilica…back in 1997. I believe that the first version was released in 1999. Over the years the Tensilica business changed.… Read More


Spectre from Cadence Goes FastSPICE

Spectre from Cadence Goes FastSPICE
by Daniel Payne on 10-09-2013 at 2:31 am

Transistor-level circuit designers have an insatiable appetite to run numerous SPICE circuit simulations in order to determine circuit speed, current and power across Process, Voltage and Temperature (PVT) conditions. Just look at the number of PVT corners increasing as the technology nodes go to 16nm:

The good news today … Read More


Cadence’s System-to-Silicon Verification Summit

Cadence’s System-to-Silicon Verification Summit
by Randy Smith on 10-06-2013 at 6:00 pm

At this year’s DAC, I spoke with several friends at Cadence. I got the distinct impression that something at Cadence had changed. There was a sense of pride and accomplishment that it seems to me had drifted away over the years. Now employees were speaking with true conviction about the accomplishments of the product development… Read More


Cadence Grows VIP Business – What’s New?

Cadence Grows VIP Business – What’s New?
by Pawan Fangaria on 10-04-2013 at 10:00 am

VIPs (Verification IPs) are really important in this complex world of SoCs which involve various IPs, interfaces and continuously evolving protocols and standards, thus making the task of verifying an overall system extremely challenging. And the verification must be done in minimum possible run-time and memory consumption.… Read More


A Mixed-Signal IC Summit in San Jose

A Mixed-Signal IC Summit in San Jose
by Daniel Payne on 10-03-2013 at 9:26 am

Analog and mixed-signal ICs are tougher to design and verify compared to digital, so if you want to learn more about best practices from actual AMS engineers then consider attending a summitthat is sponsored by Cadence Design Systems next Thursday, October 10th in San Jose from 8:00AM until 6:30PM.

They’ve lined up an interesting… Read More


Who is Blogging at Cadence?

Who is Blogging at Cadence?
by Daniel Payne on 09-20-2013 at 1:31 pm

As a blogger in the EDA industry I get to write every week, however I also end up reading every blog on SemiWiki plus multiple other sites to keep current on what’s happening in our business. I thought that it would be informative to look at Cadence Design Systems and how they are using blogging to talk not just about their own EDA… Read More


Emerging Trend – Choose DRAM as per Your Design Need

Emerging Trend – Choose DRAM as per Your Design Need
by Pawan Fangaria on 09-11-2013 at 7:00 pm

Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More


Cadence Introduces Palladium XP II

Cadence Introduces Palladium XP II
by Paul McLellan on 09-09-2013 at 8:00 pm

Well, despite all the arguments in the blogosphere about what process node palladium’s silicon is, and whether the design team is competent, and why it reports into sales…Cadence has announced their latest big revision of Palladium. Someone seems to be able to get things done. Of course it is bigger and faster and … Read More


Did you miss Cadence’s MemCon?

Did you miss Cadence’s MemCon?
by Eric Esteve on 09-05-2013 at 4:42 am

That’s too bad, as you have missed latest news about the Hybrid Memory Cube (presentation by Micron), Wide I/O 2 standard, as well as other standards like LPDDR4, eMMC 5.0, and LRDIMM,the good news is that you may find all these presentations on MemCon proceedings web site.
I first had a look at Richard Goering excellent blog: wideI/ORead More


20nm IC production needs more than a ready Foundry

20nm IC production needs more than a ready Foundry
by Pawan Fangaria on 08-23-2013 at 11:00 am

I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More