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Cadence Announces Quantus Next Generation Extraction

Cadence Announces Quantus Next Generation Extraction
by Paul McLellan on 07-14-2014 at 7:00 pm

Today Cadence announced their next generation extraction solution called Quantus QRC. Actually they are technically announcing it tomorrow, since it is being announced at CDNLive in Korea where it is already Tuesday morning.

As with the other recently announced tools that end in -us, Tempus (timing signoff) and Voltus (power… Read More


So Easy To Learn VIP Integration into UVM Environment

So Easy To Learn VIP Integration into UVM Environment
by Pawan Fangaria on 07-02-2014 at 7:30 am

It goes without saying that VIPs really play a Very Important Part in SoC verification today. It has created a significant semiconductor market segment in the fabless world of SoC and IP design & verification. In order to meet the aggressive time-to-market for IPs and SoCs, it’s imperative that readymade VIPs which are proven… Read More


PCI Express 4 specification just released for PCI-SIG DevCon

PCI Express 4 specification just released for PCI-SIG DevCon
by Eric Esteve on 07-01-2014 at 4:45 am

I have been alerted by a blog from Moshik Rubin from Cadence: PCI-SIG has finally released the PCIe 4.0 rev 0.3 specification for members’ review, on time for the PCI-SIG developers conference last June in Santa Clara. Since the early days of PCI Express in 2005, Denali (at that time, now Cadence) has positioned the PCIe VIP… Read More


What’s New with Circuit Simulation for Cadence?

What’s New with Circuit Simulation for Cadence?
by Daniel Payne on 06-26-2014 at 11:53 am

Every year at DAC I enjoy making the rounds to see what’s new with SPICE circuit simulators, so on June 3rd I met with Xiuya Liand Dan Zhuof Cadence in San Francisco to get an update about their Spectre tool. There’s plenty of competition in the SPICE area from Mentor Graphics (Analog FastSPICE, Eldo, ADiT), Synopsys … Read More


Intel Invests in the Fabless Ecosystem!

Intel Invests in the Fabless Ecosystem!
by Daniel Nenni on 06-22-2014 at 11:00 am

During my illustrious career one of the most useful axioms that I use just about everyday day is: “Understand what people say but also understand why they are saying it.” This certainly applies to press releases so let’s take a look at what Intel unleashed during #51DAC (in alphabetical order):

ANSYS And Intel Collaborate
Read More


Embedded Vision Summit

Embedded Vision Summit
by Paul McLellan on 06-05-2014 at 2:32 pm

I was a the embedded vision conference last week. Jeff Beir, the founder of the embedded vision alliance gave an introduction to the field. The conference was much bigger than previous years and almost everyone is designing some sort of vision product. Half of your brain is used for vision so it goes without saying that vision requires… Read More


Ceaseless Field Test for Safety Critical Devices

Ceaseless Field Test for Safety Critical Devices
by Pawan Fangaria on 06-03-2014 at 3:00 am

While focus of the semiconductor industry has shifted to DACin this week and unfortunately I couldn’t attend due to some of my management exams, in my spare time I was browsing through some of the webpages of Cadenceto check their new offerings (although they have a great list of items to showcase at DAC) and to my pleasure I came across… Read More


Cadence Go (war-game) strategy

Cadence Go (war-game) strategy
by Eric Esteve on 05-26-2014 at 8:19 am

I was attending to CDN-Live in Munich last week, so I was expecting Cadence to announce new IP related acquisition like Lip-Bu Tan did last year (Cosmic Circuit, Evatronix and Tensilica). In fact, Lip-Bu was not in Munich and Charlie Huang, SVP Worldwide Field Operations and System & Verification Group, was holding the morning… Read More


A Collaborative Approach Yields Better PI for PCBs

A Collaborative Approach Yields Better PI for PCBs
by Pawan Fangaria on 05-18-2014 at 10:30 am

The power integrity (PI) of a system is an extremely important aspect to be looked at all levels – chip, package and PCB for overall reliability of the system. At the PCB level, a DC analysis, usually based on IR drop, must ensure that adequate DC voltage, satisfying all constraints of current density and temperature, is delivered… Read More


Panel: Strategies for Next Generation Semiconductor IP Management

Panel: Strategies for Next Generation Semiconductor IP Management
by Holly Stump on 05-16-2014 at 7:00 am

I just returned from the “Semiconductor Executive Briefing: Strategies for Next Generation Semiconductor IP Management” panel,held at the Computer History Museum, sponsored by Dassault Systèmes.

(Left to right) Moderator: Warren Savage, President and CEO, IPextreme, with panelists John Tam, Director of Business Development,Read More