The design of an SRAM array requires focus on the key characteristics of readability, writeability, and read stability. As technology scaling has enabled the integration of large (cache) arrays on die, the sheer number of bitcells has necessitated a verification methodology that focuses on “statistical high-sigma” variation… Read More
Author: Tom Dillinger
Improvements in SRAM Yield Variation Analysis
Key Takeaways from the TSMC Technology Symposium Part 2
In Part 1, we reviewed four of the highlights of the recent TSMC Technology Symposium in San Jose. This article details the “Final Four” key takeaways from the TSMC presentations, and includes a few comments about the advanced technology research that TSMC is conducting.… Read More
Analog Mixed-Signal Layout in a FinFET World
The intricacies of analog IP circuit design have always required special consideration during physical layout. The need for optimum device and/or cell matching on critical circuit topologies necessitates unique layout styles. The complex lithographic design rules of current FinFET process nodes impose additional restrictions… Read More
Key Takeaways from the TSMC Technology Symposium Part 1
TSMC recently held their annual Technology Symposium in San Jose, a full-day event with a detailed review of their semiconductor process and packaging technology roadmap, and (risk and high-volume manufacturing) production schedules.… Read More
DDR4 is a complex interface to verify — assistance needed!
The design of parallel interfaces is supposed to be (comparatively) easy — e.g., follow a few printed circuit board routing guidelines; pay attention to data/clock/strobe signal lengths and shielding; ensure good current return paths (avoid discontinuities); match the terminating resistances to the PCB trace impedance;… Read More
Top Ten Insights on the EDA and Semiconductor Industry
I recently had the opportunity to chat with Anirudh Devgan, senior vice president and general manager at Cadence, who leads the Digital and Signoff Group. We discussed recent product development initiatives at Cadence, and talked about future EDA and semiconductor market opportunities. His insights and comments were keen … Read More
Early Structural Reliability Analysis of a Chip-Package-System design is a must!
2015 will be remembered as the year when chip-package-system (CPS) physical co-design and electrical/thermal analysis methodologies took center stage.… Read More
Pathfinding to an Optimal Chip/Package/Board Implementation
A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More
Expanding 3D EM Simulation Access to All
James Clerk Maxwell’s eponymous equations are the basis for simulating electromagnetic wave propagation. In school, EE majors tended to fall into two camps: (a) those that thoroughly enjoyed their fields and waves classes, who liked doing surface integrals, and who were adept at demonstrating the “right hand rule”, and (b) … Read More
HSPICE – 35 and looking good!
A maturetool. A legacytool. A tool that’s a little long in the tooth. We have all used these terms to refer to an EDA product that has not been able to keep up with technical challenges of model complexity, performance, or new features required by current SoC and system design requirements.… Read More
Real men have fabs!