As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Author: Kalar Rajendiran
Synopsys – TSMC Collaboration Unleashes Innovation for TSMC OIP Ecosystem
Disaggregated Systems: Enabling Computing with UCIe Interconnect and Chiplets-Based Design
The world of computing is evolving rapidly, with a constant demand for more powerful and efficient systems. Generative AI has driven exponential growth in the amount of data that is generated and processed at very high data speeds and very low latencies. Traditionally, computing systems have been built using monolithic designs,… Read More
proteanTecs On-Chip Monitoring and Deep Data Analytics System
State-of-the-art electronics demand high performance, low power consumption, small footprint and high reliability from their semiconductor products. While this imperative is true across many different market segments, it is critical for applications such as the automotive/autonomous driving and data centers. As electronic… Read More
Transformers Transforming the Field of Computer Vision
Over the last few years, transformers have been fundamentally changing the nature of deep learning models, revolutionizing the field of artificial intelligence. Transformers introduce an attention mechanism that allows models to weigh the importance of different elements in an input sequence. Unlike traditional deep learning… Read More
Cyber-Physical Security from Chip to Cloud with Post-Quantum Cryptography
In our interconnected world, systems ranging from smart cities and autonomous vehicles to industrial control systems and healthcare devices have become everyday components of our lives. This fusion of physical and digital systems has led to a term called cyber-physical system (CPS). Ubiquitous connectivity is exposing the… Read More
Water Sustainability in Semiconductor Manufacturing: Challenges and Solutions
Water, the planet’s lifeblood, remains a finite and precious resource. The Earth’s total water supply has remained relatively constant over millennia. However, it is the uneven distribution of freshwater and the challenges of providing access to clean water that are causing stress in various parts of the world.… Read More
Successful Inter-Op Verification of Enterprise Flash Controller with ONFI 5.1 PHY IP
In an era defined by digital transformation and data-intensive applications, the solid-state device (SSD) market has emerged as a critical player in reshaping storage solutions. While there are several types of non-volatile memories, each with its own unique characteristics and use cases, Flash memory is increasingly overtaking… Read More
Synopsys Expands Synopsys.ai EDA Suite with Full-Stack Big Data Analytics Solution
More than two years ago, Synopsys launched its AI-driven design space optimization (DSO.ai) capability. It is part of the company’s Synopsys.ai EDA suite, an outcome of its overarching AI initiative. Since then, DSO.ai has boosted designer productivity and has been leveraged for 270 production tape-outs. DSO.ai uses machine… Read More
ISO 21434 for Cybersecurity-Aware SoC Development
The automotive industry is undergoing a remarkable transformation, with vehicles becoming more connected, automated, and reliant on software. While these advancements promise convenience, comfort and efficiency to the consumers, the nature and complexity of the technologies also raise concerns for functional safety … Read More
Key MAC Considerations for the Road to 1.6T Ethernet Success
Ethernet’s continual adaptation to meet the demands of a data-rich, interconnected world can be credited to the two axes along which its evolution has been propelled. The first axis emphasizes Ethernet’s role in enabling precise and reliable control over interconnected systems. As industries embrace automation… Read More
Facing the Quantum Nature of EUV Lithography