Hybrids on BeO then, 3D-IC in silicon now

Hybrids on BeO then, 3D-IC in silicon now
by Don Dingee on 10-21-2012 at 8:10 pm

Once upon a time (since every good story begins that way), I worked on 10kg, 70 mm diameter things that leapt out of tubes and chased after airplanes and helicopters. The electronics for these things were fairly marvelous, in the days when surface mount technology was in its infancy and having reliability problems in some situations.… Read More


12m FPGA prototyping sans partitioning

12m FPGA prototyping sans partitioning
by Don Dingee on 10-16-2012 at 9:30 pm

FPGA-based prototyping brings SoC designers the possibility of a high-fidelity model running at near real-world speeds – at least until the RTL design gets too big, when partitioning creeps into the process and starts affecting the hoped-for results.

The average ASIC or ASSP today is on the order of 8 to 10M gates, and that includes… Read More


The Middle is A Bad Place to Be if You’re a CPU Board

The Middle is A Bad Place to Be if You’re a CPU Board
by Don Dingee on 10-09-2012 at 10:45 pm

In a discussion with one of my PR network recently, I found myself thinking out loud that if the merchant SoC market is getting squeezed hard, that validates something I’ve been thinking – the merchant CPU board market is dying from the middle out.… Read More


Over-under: Apple, 52M iPhones in 4Q

Over-under: Apple, 52M iPhones in 4Q
by Don Dingee on 09-20-2012 at 8:15 pm

I’m in a Twitter conversation with some friends, with the subject: how many phones can Apple ship in the 4th quarter?

A respected analyst said 52M is “an easy mark” for Apple; others are saying 58M is the target for just the iPhone 5 in 4Q. However, the start for the iPhone 5 has been anything but easy. Oh, the orders… Read More


Is DDR4 a bridge too far?

Is DDR4 a bridge too far?
by Don Dingee on 09-11-2012 at 8:30 pm

We’ve gone through two decades where the PC market made the rules for technology. The industry faces a question now: Can a new technology go mainstream without the PC?

By now, you’ve certainly read the news from Cadence on their DDR4 IP for TSMC 28nm. They are claiming a PHY implementation that exceeds the data rates specified for … Read More


Built to last: LTSI, Yocto, and embedded Linux

Built to last: LTSI, Yocto, and embedded Linux
by Don Dingee on 09-06-2012 at 8:30 pm

The open source types say it all the time: open is better when it comes to operating systems. If you’re building something like a server or a phone, with either a flexible configuration or a limited lifetime, an open source operating system like Linux can put a project way ahead.

Linux has always started with a kernel distribution,… Read More


Smart mobile SoCs: Made in China

Smart mobile SoCs: Made in China
by Don Dingee on 08-29-2012 at 2:00 pm

One of the comments to previous installments of this series was that there isn’t much left for the merchant suppliers of smart mobile SoCs, considering Apple and Samsung have majority share and design their own parts. The theory is this makes it hard for many suppliers to continue investing at the resource levels needed to bring … Read More


IP Wanna Go Fast, Core Wanna Not Rollover

IP Wanna Go Fast, Core Wanna Not Rollover
by Don Dingee on 08-23-2012 at 8:15 pm

At a dinner table a couple years ago, someone quietly shared their biggest worry in EDA. Not 2GHz, or quad core. Not 20nm, or 450mm. Not power, or timing closure. Call it The Rollover. It’s turned out to be the right worry.

Best brains spent inordinate hours designing and verifying a big, hairy, heavy breathing processor core to do … Read More


Ex ante: disclose IP before, not after standardization

Ex ante: disclose IP before, not after standardization
by Don Dingee on 08-17-2012 at 3:46 pm

Many of the audience here are involved in standards bodies and specification development, so the news from the Apple v. Samsung on the invocation of ex ante in today’s testimony is useful.

I worked with VITA, the folks behind the VME family of board-level embedded technology, on their ex ante policy several years ago, and … Read More