OpenCL hits FPGA-based prototyping modules

OpenCL hits FPGA-based prototyping modules
by Don Dingee on 11-30-2016 at 4:00 pm
Categories: FPGA, S2C Prodigy

OpenCL brings algorithm development into a unified programming model regardless of the core, working across CPUs, GPUs, DSPs, and even FPGAs. Intel has been pushing OpenCL programming for some time, particularly at the high end with “Knights Landing” processors. Where other vendors are focused on straight-up C high-level … Read More

November 16, 2016June 14, 2019

FPGAs allow customization of SEU mitigation

FPGAs allow customization of SEU mitigation
by Don Dingee on 11-16-2016 at 4:00 pm
Categories: Automotive, EDA, FPGA, Synopsys

Teams working on avionics, space-based electronics, weapons delivery systems, nuclear generating plants, medical imaging equipment, and other applications where radiation leads to single-event upsets (SEU) are already sensitive to functional safety requirements. What about automotive applications?

With electronic… Read More

November 9, 2016November 22, 2019

One chip and the MCU variant challenge disappears

One chip and the MCU variant challenge disappears
by Don Dingee on 11-09-2016 at 4:00 pm
Categories: eFPGA, Flex Logix, FPGA, IoT, IP

Merchant microcontrollers are usually made available in a wide range of variants based on one architecture with different peripheral payloads and packaging options. A couple of companies, notably Cypress with their PSoC families and Silicon Labs with the EFM8 Laser Bee… Read More

November 2, 2016November 20, 2019

Protium for the win in software development

Protium for the win in software development
by Don Dingee on 11-02-2016 at 4:00 pm
Categories: Cadence, EDA, Prototyping

Cadence Design Systems is a long-standing provider in hardware emulation, but a relative newcomer to FPGA-based prototyping. In an upcoming lunch and learn session on November 11 in San Jose, Cadence teams will be outlining their productivity strategy. What’s different with their approach and why is this worth a lunch?… Read More

October 31, 2016June 14, 2019

Behind the 3DEXPERIENCE for silicon

Behind the 3DEXPERIENCE for silicon
by Don Dingee on 10-31-2016 at 4:00 pm
Categories: Dassault Systemes, EDA

We’ve been covering the Dassault Systèmes “Silicon Thinking” platform for a while here, but, as I’m often prone to do, I wanted to explore the backstory to uncover more about the concept. With over 25M users of their product lifecycle management (PLM) solutions, why is Dassault Systèmes becoming so interested in semiconductor… Read More

October 28, 2016June 14, 2019

Can one flow bring four domains together?

Can one flow bring four domains together?
by Don Dingee on 10-28-2016 at 4:00 pm
Categories: EDA, IoT, Mentor, a Siemens Business

IoT edge device design means four domains – MEMS, analog, digital, and RF – not only work together, but often live on the same die (or substrate in a 2.5D process) and are optimized for power and size. Getting these domains to work together effective calls for an enhanced flow.

Historically, these domains have not played together … Read More

October 26, 2016June 14, 2019

Automation for managed system-of-systems design

Automation for managed system-of-systems design
by Don Dingee on 10-26-2016 at 4:00 pm
Categories: EDA, Mentor, a Siemens Business

Anybody who has done any bus & board system design knows the problem. Merchant boards typically have standardized pinouts (after years of haggling in standards organizations) for the backplane bus, and a group of user-defined pins for daughtercard I/O. Homegrown systems usually have a just-as-carefully defined proprietary… Read More

October 24, 2016June 14, 2019

FPGAs for a few thousand devices more

FPGAs for a few thousand devices more
by Don Dingee on 10-24-2016 at 4:00 pm
Categories: Aldec, Automotive, EDA, FPGA, IoT, Xilinx

An incredibly pervasive trend at last year’s ARM TechCon was the IoT, and I expect this year to bring even more of the same, but with a twist. Where last year was mostly focused on ultra-low power edge devices and the mbed ecosystem, this year is likely to show a better balance of ideas across all three IoT tiers. I also expect a slew of … Read More

October 19, 2016

S2C adds support for Juno ARM dev platform

S2C adds support for Juno ARM dev platform
by Don Dingee on 10-19-2016 at 4:00 pm
Categories: ARM, FPGA, IP, S2C Prodigy

We’ve had several blogs introducing the Juno ARM Development Platform as a vehicle for ARMv8-A software development. S2C has jumped in with a module connecting their FPGA-based prototyping platform to the Juno, enabling more advanced IP… Read More

October 17, 2016

There is more than C to worry about

There is more than C to worry about
by Don Dingee on 10-17-2016 at 4:00 pm
Categories: IoT

We periodically see that “software ate the world” line – I’m pretty sure I’ve used it a couple times myself. The fact is, software doesn’t run itself; never has, never will. Somewhere there has to be an underlying computer. First it was on beads, then in gears, then in tubes.… Read More

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Recent Forum Threads

Texas Instruments Maintains Firm Grip As World’s Top Analog IC Supplier

started by Daniel Nenni on May 28, 2020
TSMC 5nm+ volume production Q420

latest reply by Daniel Nenni on May 28, 2020

started by kh812000 on May 28, 2020
Hspice wrong output

latest reply by ashueda on May 28, 2020

started by ashueda on May 27, 2020
GlobalFoundries Pulls Out of Chengdu

latest reply by Daniel Nenni on May 27, 2020

started by clhende on May 26, 2020
China, IP, Tech, Taiwan, Politics Forever Changed, Opportunity

latest reply by Arthur Hanson on May 26, 2020

started by Arthur Hanson on May 18, 2020
Taiwan Semiconductor Expected to Announce Arizona Factory as soon as Friday per WSJ

latest reply by Portland on May 25, 2020

started by kh812000 on May 14, 2020

Cost Analysis of the Proposed TSMC US Fab
GF has clearly answered that -- they stopped developing 7nm -- and have shown no ability (and clearly wouldn't have…

— ChrisGar on May 28, 2020
Our US chip foundry comments confirmed by WSJ
It is a shrewd political move by TSMC but I would not say it is a 100% done deal. There…

— Daniel Nenni on May 28, 2020
Design in the Time of COVID
I hope we can actually benefit and learn from the coronavirus the benefits of good health. Over half the people…

— Arthur Hanson on May 28, 2020
Cost Analysis of the Proposed TSMC US Fab
Your point underscores the necessity for US semi to compete. Today, Intel and Globalfoundries are behind and falling further behind.…

— nickw on May 27, 2020
Effect of Design on Transistor Density
What complicates this even more is that these numbers ignore cell utilisation (total cell area/total area) which is worse for…

— IanD on May 27, 2020
eFPGA – What’s Available Now, What’s Coming and What’s Possible!
Thanks much for your prompt response. That clarifies!!!

— gauravjalan on May 26, 2020

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