At DAC in June I first blogged about Symicabecause they offered a Fast SPICE circuit simulator, and today I discovered a free version so I decided to write up a mini-review for you.… Read More
Author: Daniel Payne
An FPGA Design Flow with Aldec Tools
I’ve used FPGA vendor-supplied tools from both Xilinxand Lattice Semibefore, so I wanted to see what EDA tools Aldec has to offer for FPGA design. I read the Aldecwhite paper, Corporate Standardization of FPGA Design Flow, and summarize what I found.… Read More
Mixed-Signal Methodology Guide: Design Management
I reviewed the book Mixed-Signal Methodology Guidein August of this year published by Cadence, and decided to follow up with one of the authors, Michael Henrie from ClioSoft, to learn more about the importance of Design Management for AMS. Michael is a Software Engineering Manager at ClioSoft and has worked at Zarlink Semi, Legerity,… Read More
Variation-Aware Design: A Hands-on Field Guide
IC designers using advanced nodes are acutely aware of how variation effects in the silicon itself are causing increased analysis and design efforts in order to yield chips at acceptable levels. Four authors from Solidoare so passionate about this topic that they combined their years of experience into a book that I had a chance… Read More
AMS IC Design at Rohde & Schwarz
I met Frank Wiedmann on LinkedIn because we are both members of the Analog Mixed Signal group, and he has an interesting background in AMS IC design.
Since he lives in Munich we conducted our interview by email.… Read More
ASIC Prototyping: Dini Group and Tektronix
Collaboration in EDA is nothing new, however you may not be aware of how the Dini Group and Tektronix have worked together on an FPGA prototyping platform to address issues like debugging with full visibility across an entire multi-FPGA design. At SemiWiki we’ve blogged a couple of times so far about the new debug approach… Read More
Internet of Things, My Bluetooth Headset
A catchy phrase used by bloggers and journalists these days is “Internet of Things“, or IoT if you prefer acronyms. All of this is made possible by EDA tools in the hands of SoC designers to create useful products like my Jawbone ICON bluetooth headset. Tonight I discovered that I could customize my bluetooth headset… Read More
What I Learned About FPGA-based Prototyping
Today I attended an Aldec webinar about ASIC and SoC prototyping using the new HES-7 Board. This prototyping board is based on the latest Virtex-7 FPGA chips from Xilinx.
You can view the recorded webinar here, which takes about 30 minutes (should be available in a few days). I first blogged about the HES-7 two months ago, ASIC Prototyping… Read More
Static Timing Analysis for Memory Characterization
Modern SoC (System On Chip) designs contain a larger number of RAM (Random Access Memory) instances, so how do you know what the speed, timing and power are for any instance? There are a couple of approaches:
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Chip On Wafer On Substrate (CoWoS)
Our EDA industry loves three letter acronyms so credit the same industry for creating a five letter acronym CoWoS. Two weeks ago TSMC announced tape-out of their first CoWoS test chip integrating with JEDEC Wide I/O mobile DRAM interface, making me interested enough to read more about it. At the recent TSMC Open Innovation Platform… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot