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Xilinx Datacenter on a Chip

Xilinx Datacenter on a Chip
by Paul McLellan on 07-08-2015 at 7:00 am

I talked recently about the Intel acquisition of Altera which seems to be all about using FPGA technology to build custom accelerators for the datacenter. Some algorithms, especially in search, vision, video and so on map much better onto a hardware fabric than being implemented in code on a regular microprocessor.

So if the heart of the future datacenter is a high-performance processor coupled with a programmable fabric then Xilinx just taped out what I think of as a datacenter on a chip, although they call it the industry’s first All Programmable Multi-Processor SoC (MPSoC). It is on TSMC’s 16FF+ process.

Of course this is the initial tapeout. Xilinx is already shipping parts in TSMC’s 28nm and 20nm nodes.

Under the hood are seven processors:

  • A quad-core 64-bit ARM Cortex-A53 processor
  • A dual-core 32-bit ARM Cortex-R5 real-time processing unit
  • An ARM Mali-400 GPU

There are also a suite of integrated peripherals, security features and advanced power management. The All Programmable Zynq UltraScale+ MPSoC enables the development of flexible, standards-based platforms by providing 5X system level performance/watt and any-to-any connectivity with the security and safety required for next generation systems.


With processors and programmable fabric, the parts can obviously be used for a wide range of applications. But Xilinx call out three areas where they have focused. Embedded vision systems especially for advanced driver assistance systems (ADAS) and autonomous vehicles. Industrial internet of things to add a lot of local processing power so decisions can be made accurately and fast. And 5G mobile base stations, including multiple antennas, high data rates, and aggressive power limits.

Automotive
The Zynq UltraScale+ MPSoC is tailored for next-generation embedded vision systems, including industrial machine vision, surveillance, and automotive ADAS systems. For ADAS, the Zynq MPSoC tightly couples highly parallelized hardware image processing and analytics acceleration with software based algorithm configuration and control. With the addition of expanded memory with UltraRAM for video buffering, throughput is maximized and latency is reduced; a critical attribute for ADAS. Finally, to enable real-time safety-critical countermeasure decisions and initiate actuator commands, the Zynq MPSoC ARM with dual core Cortex-R5 engines can be utilized in lockstep mode along with cross-monitoring and diagnostic-protected voting in the programmable fabric. The Zynq MPSoC was designed with automotive ISO-26262 functional safety requirements in mind, while still offering a scalable and highly customizable programmable platform that will future-proof customer designs in the quickly changing ADAS space.

Industrial Internet of Things

For the Industrial Internet of Things, the Zynq UltraScale+ MPSoC family is ideally suited to integrate data acquisition, perform real-time diagnostics, and enable local decision-making for intelligent connected control systems. The combination of the MPSoC processing subsystem, the UltraScale programmable logic fabric, and the new UltraRAM on-chip memory technology create the ideal platform to process the vast quantities of data for analytics and manage real-time machine-to-machine (M2M) communication. With a dedicated security processing unit and dual core Cortex-R5 engines that can be configured for lockstep, the Zynq MPSoC also supports SIL3 functional safety and security requirements.

Next Generation Mobile

Zynq UltraScale+ MPSoC devices support the increased radio and baseband processing requirements of next generation 5G systems. This includes the support of new ‘massive MIMO’ and adaptive beamforming architectures, CloudRAN layer 1 baseband acceleration and associated Fronthaul applications, with flexible support of multiple standards and multiple bands at significantly lower power. The Zynq UltraScale+ MPSoC, with its quad core ARM Cortex-A53 processing subsystem, leverages an integrated fine grain power management system to implement lower power optimal hardware-software design for digital pre-distortion, beamforming control functions, and system management tasks.


Why Automotive IP Portfolio is not just IP

Why Automotive IP Portfolio is not just IP
by Eric Esteve on 07-07-2015 at 7:00 pm

Synopsys is launching a broad IP portfolio to support SoC development dedicated to emerging automotive complexes functions, like Driver Assistance (ADAS), Driver Information, Vehicle Network or Infotainment. I was never involved into IC design for Automotive, but I have designed ASIC for avionics (CFM56 motor control) or for railways (TGV boogies instability) and I can guarantee that the requested level of quality is high, very high. The goal is to guarantee a safety level that you don’t expect for an Application Processor or a Set-Top-Box SoC. Indeed the requested safety level is similar for Automotive than for Avionics or Railways, with the difference that emerging automotive applications are now consumer oriented: TTM plays an important role and OEM wants to differentiate by bringing always more features. We could say: Automotive = Avionics + Consumer!

Automotive Grade requirements for IP are multiples, and well documented. To reduce risk and accelerate qualification for automotive SoCs, Synopsys’s IP must comply with these requirements:

  • Automotive Safety Integrity Level (ASIL) B Ready

Accelerate ISO 26262 functional safety assessments to help ensure designers reach ASIL levels

  • AEC-Q100 Testing

Reduce risk & development time for AEC-Q100 qualification of SoCs

  • TS 16949 Quality Management
  • Meet quality levels required for automotive applications

These quality requirements impact the complete above listed IP Portfolio. ASIL B ready IP, including complete safety package documentation, count: ARC EM SEP, Ethernet AVB, LPDDR4 and embedded memories. ASIL B compliance is in progress for HDMI, MIPI CSI-2/DSI, PCIe, mobile storage, data converters, logic libraries, NVM, Sensor & Control Subsystem & EV vision processors.

Synopsys has introduced ARC EM Safety Enhancement Package (SEP) to support ISO 26262 targeted solution. This means that the ARC processor core integrates hardware safety features like parity support, ECC support, user programmable watchdog timer, export state (Lock step), Lock step monitoring system and memory protection unit. Moreover ASIL D ready MetaWare Compiler enables development of ISO-26262-compliant software. When the IP vendor invests upfront for high quality level, the SoC design team benefit from TTM advantage as the software is automatically ISO-26262 compliant.

Synopsys offers as well a 10/100/1G Ethernet QoS Controller safety package. This Ethernet controller may be used for ADAS module-module network traffic and supports IEEE Audio Video bridging specifications. This controller is optimized for synchronized automotive multimedia, supporting safety critical operation features as well as data prioritization, bandwidth reservation, traffic shaping and universal timing. This UNH tested Ethernet controller enables predictable & reliable networks.

The AEC-Q100 industry standard specification outlines the stress tests and reference test conditions for the qualification of automotive grade SoCs. Synopsys is investing in providing IP that meets AEC-Q100 requirements, enabling designers to reduce design risk and development time for SoC level AEC-Q100 qualification. We can appreciate the high level of investment when looking at the above table. The specific test are ranging from fault simulation, accelerated lifetime simulation test, die fabrication reliability test to ESD, latch-up and characterization impacting IP (or Foundry) quality when accelerated environment stress test, EMC, SC and soft error rate (SER) are applying to the SoC only.

All Automotive SoC have to comply with AEC-Q100 standard, offering such an IP port-folio to automotive design team allows shortening qualification effort and reduce Time-To-Market… remember that these emerging automotive applications like ADAS or Infotainment are mixing avionics like requirements with consumer-like TTM!

You will find an exhaustive list of Synopsys Automotive Grade IP HERE.

From Eric Esteve from IPnest


Gary Smith Passed Away Last Friday

Gary Smith Passed Away Last Friday
by Paul McLellan on 07-07-2015 at 1:02 pm

I expect most of you have already heard the sad news through other channels: Gary Smith died last Friday, July 3rd, from pneumonia in Flagstaff, Arizona.

I must have first met Gary back in Dataquest days when I was at VLSI Technology. Gartner then acquired Dataquest and eventually shut down the EDA practice and laid Gary off. He then started his own company, GarySmithEDA. It only took him a couple of quarters and he told me that he was already bringing in more than they had been at Gartner.

Gary was a sort of gate-keeper to the EDA industry and its customers. Nothing happened in EDA without Gary knowing about it. He always wanted to meet a company, no matter how small, although in April and May coming up to DAC his calendar would get insanely full.

In fact for a small EDA company there was a ritual of going to see Gary in spring to make sure that he understood the product. If the planets aligned then you would get on his list of the top 25 companies to see at DAC which would often make a big difference to a startup with a very limited marketing budget, struggling for potential customers to even know they existed. Gary was scrupulously fair about these lists. It didn’t matter if you were a consulting client, or a big company, or a tiny one. If you had interesting and appropriate technology then Gary would send people to check you out.

Also, the company and its product would appear in the right place on the taxonomies of the industry that Gary and his team produced annually.

The overture to DAC for years was Gary’s presentation summarizing the state of the EDA industry on Sunday evening. Then a repeat performance to open the show the following morning. If Gary wasn’t wearing his trademark white suit then he would be in his backup trademark orange jacket. Gary was always optimistic about the EDA industry and accurate about where it was going. But sometimes he was too optimistic, predicting the takeoff of some technology such as system design a long time before it actually happened.

Lori Kate Smith, his widow, has asked John Cooley to put together a memories page this week before the funeral so that their 9-year old son can see how Gary was seen by the industry that he worked in. So if you have memories or photos of Gary then email them to John.

A memorial service is in planning for the late morning of Sunday, July 12th in San Jose. In order to allow them to reserve the appropriate facility, would you kindly indicate below the number of people in your party who may attend? Children are welcome. To do this, go here.

Full instructions for exactly what to mail and what subject lines to use for memories and photos are on John’s website here.

GarySmithEDA’s website is here.

UPDATE: memorial service is 11am the the San Jose Doubletree. Wear orange like me. More details in the comments.


SEMICON West Preview

SEMICON West Preview
by Scotten Jones on 07-07-2015 at 7:00 am

Founded in 1971 (2015: 45th year), SEMICON West 2015 is coming to the Moscone Center in San Francisco on from Tuesday, July 14[SUP]th[/SUP] to Thursday, July 16[SUP]th[/SUP]. SEMICON is the premier show for equipment and materials companies supporting the semiconductor, MEMS and solar industries.

The main ways to get value from the SEMICON show:

[LIST=1]

  • You can visit the floors of the exhibit halls stopping in at booths and meeting with people.
  • There is a wide variety of keynote addresses and Tech spots where presentations are given on technology and markets.


    Tuesday

    Tuesday begins with a keynote on “Scaling the walls of sub 14nm manufacturing”. There are also Tech spots that look interesting to me covering the future of MEMS and emerging memory. For people with other interests there will also be sessions on packaging and contamination control.

    Wednesday

    Wednesday begins with a keynote on the Internet of Things. In the Tech spots there will be coverage of 450mm, the secondary equipment market for 200mm, packaging and more.

    Thursday

    Thursday has tech spots on CMP, monetizing the internet of things and disruptive technologies.

    All of the items discussed above are free with your entry badge. There are also paid programs running concurrently with these event each day and of course the nightly receptions if you know the right people at the equipment and materials companies.

    I plan to attend the Tuesday press briefing, Keynote and the MEMS and emerging memory tech spots. Wednesday I plan to attend the keynote and 200mm secondary market tech spot. Thursday I am attending an Axcelis briefing and plan to go to the CMP Tech spot. After the show I will blog about what I saw.

    SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation, to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test). More than semiconductors, SEMICON West is also showcase for emerging markets and technologies born from the microelectronics industry, including micro-electromechanical systems (MEMS), photovoltaics (PV), flexible electronics and displays, nano-electronics, solid state lighting (LEDs), and related technologies.


  • Apple Watch – A Great New Design, Needs More

    Apple Watch – A Great New Design, Needs More
    by Pawan Fangaria on 07-06-2015 at 7:00 pm

    During 52[SUP]nd[/SUP] DAC, there was a special session where a brand new Apple watch was opened and each of its components was shown with a brief description about it. I found this tear down session a great innovative idea coming from DAC organizers; actually two buzzing products, AppleWatch and DJI’s Phantom Drone were opened and their internals shown in this session. Earlier I had also reviewed some of the analysis done by Chipworks about Apple Watch. Since there is so much buzz about the Apple Watch, it’s a natural curiosity to know more about this smartwatch. This could be a turning point in the watch industry.

    The design seemed to be very compact and unique; a package of size 26 mm x 28 mm contained more than 30 components. A common motherboard with all of its components is over-moulded with a packaging compound. Then there are sensor, touch controller, and others in the package. Every component has been sourced from a prominent and reputed vendor in that space.

    There is a 3D digital accelerometer and a 3D digital gyroscope in a LGA (Land Grid Array) package from STMicroelectronics. It has a 6 axis sensor for acceleration and roll, pitch and yaw which is a shift from iPhone 6 where Apple has an Invensense6 axis sensor and a Bosch 3 axis accelerometer.

    There is a capacitive touch screen controller from ADI. The operational amplifier, OPA2376 which has excellent precision, low noise, and low quiescent current is from Texas Instruments. TI also supplied some battery management components. There is an Apple designed processor, manufactured by Samsungat 28nm LP process node. The power management unit is from Dialog. The Codec and audio amplifier are from Maxim; the watch has microphone and call facility. STMicroelectronics also supplied ST32 MCU and optical emitter/sensor encoder die for the Apple watch.

    One great aspect of the Apple watch is that it is Apple Pay enabled and one can make calls through the watch. For this there is BroadcomWiFi SoC BCM4334, and a NFC controller from NXP. There also is a NFC signal booster AS3923 from AMS. A few analog components including WiFi LNA (Low Noise Amplifier) and power amplifier are from a fast emerging company, Skyworks.

    All of these components are on a single package; some of the components such as the processor and DRAM contain multiple die. This along with other individual components in the watch such as a Taptic Engine, a Digital Crown and others make it a very compact piece. The watch has an innovative pressure-sensitive display, called Force Touch, which senses how hard users are pressing down the screen. Depending on the strength of the taps on the screen, different functions are activated; that’s an innovative idea to enable a number of functions on that small screen. Summing up everything together, Apple Watch has a great architecture and is a great start to rejuvenate the smartwatch market. However, more needs to be done by Apple for this product market.

    Although the Apple’s Watch launch was heard across the world, the actual sales numbers are yet to be seen. One major concern is about dependence of the Apple Watch on iPhone. Its utility is significantly reduced without an iPhone paired with it. So, the question of need again arises here. If one has an iPhone, then why does he need an Apple Watch? The Apple Watch has to have an independent identity of its own. It needs to work without an iPhone in all scenarios satisfying the needs of people as they expect in it and not by comparing with other watches in the BasselWorld.

    Apple is already considering reducing the dependency of Apple Watch on iPhone. However we need to see how independent the second version of Apple Watch is. We know Apple’s perseverance about improving their products version after version. That being the notion about Apple, many people across the world are waiting for the second and third versions of Apple Watch to appear before jumping to buy Apple Watch.

    The journey for smartwatches to concur the traditional watch industry has begun. I believe Apple will gradually improve their smartwatch to the point what the market desires and that will be the day of smartwatches in the large watch industry.

    Pawan Kumar Fangaria
    Founder & President at www.fangarias.com


    Opportunity NoCs, But Not Without Software

    Opportunity NoCs, But Not Without Software
    by Paul McLellan on 07-06-2015 at 12:29 pm

    It is easy to think that semiconductor IP is all about structures on the silicon. After all, there is “semiconductor” in the phrase “semiconductor IP”. But increasingly the heart is actually software. Sonics’ SGN product is a network-on-chip but to build it you need to use the software that actually builds it, which is called SonicsStudio Director.

    Just before DAC, Sonics released a new version. It has been put together to support both novices and power users. Easy to get started but also with the features needed to get the most out of designers who understand all the details of SonicsGN. When SoCs can contain hundreds of blocks, in multiple power and clock domains, building an NoC is not straightforward. And that is before you worry about the fact that the NoC has to run at a GHz and the whole chip isn’t allowed to consume too much power. The NoC is a crucial part of building a successful chip. More and more of the chip is 3rd party IP (or from a group in the same company in, say, India, which is not that different from a 3rd party) and making an SoC is linking all that barely-understood stuff together. That is where NoCs come in. And not just NoCs but the software that allows you to describe it all. Like I said, it is not just the stuff on the chip it is the software that allows you to design it.

    So what does Studio Director do? It lets you specify all the blocks on the chip and how you want them to communicate. Then it lets you check you didn’t screw up. You can check it, simulate it and more.

    • Design
    • Power
    • Lint
    • RTL generation
    • RLT simulation
    • SystemC generation
    • SystemC simulation
    • Synthesis constraint generation
    • IP-XACT generation

    If you have a NoC then you want to know all sorts of stuff at different levels. At the high level what is the overall bandwidth. At the low level, how long does this block take to communicate with this other block. And everything in-between.

    That’s where StudioDirector comes in. It let’s you ask all those questions without having to build the chip and do it through RTL simulation or something barely practical. You put the NoC together and then you find out whether it actually does all the things you need. QoR stands for Quality-of-Results but it is a catchword for whether or not what you have done is good enough for the design. Whether it is a good balance of performance, power, area and everything else.

    Since the NoC involves pretty much every block on the chip. alternatives are the same. Simulate all the blocks. Or STA all the blocks. Or whatever. Not a trivial task and involving expensive tool licenses. Multiple clocks. Voltage islands. Power down. A modern SoC is not like when I started in this industry and a 10K gate design with a single clock running at 3V was the limit of what anyone did. We hadn’t even got to CMOS.

    So what does the latest version of StudioDirector give you:

    • Schematic and context-sensitive text editor
    • Real-time feedback for quick-fix
    • Excel-like spreadsheet for import/export
    • Full Tcl support

    Intel 10nm delay confirmed by Tick Tock arrhythmia leak-"The Missing Tick"

    Intel 10nm delay confirmed by Tick Tock arrhythmia leak-"The Missing Tick"
    by Robert Maire on 07-06-2015 at 7:00 am

    Our 6/15 report of more 10nm Intel delays confirmed by leaked info…
    The delay appears to have interrupted Intel’s Tick Tock cadence…
    Kabylake replaces Skylake – Cannonlake pushed out over horizon?

    The news we broke is now confirmed…
    On 6/15 we put out a report that broke the news of further delays at Intel 10nm. This appears to now be supported by a report of leaked Intel documents on 6/23 by the website benchlife.info which shows specifications for a new line of processors for 14nm called Kaby Lake to replace Skylake (14nm) and precede Cannon lake at 10nm.

    http://benchlife.info/cannon-lake-postpone-and-kaby-lake-will-replace-skylake-in-2016-06232015/

    The information shows another 14nm processor family called Kaby Lake which is to follow Skylake which follows Broadwell. Skyline was originally supposed to be followed by Cannon Lake at 10nm process. It would now appear that Cannon Lake has been pushed far enough into the future to be beyond the visible horizon.

    Tick Tock skips a beat.. “The case of the missing Tick”….
    Intel has been doing what it has called “Tick Tock” changes in technology, with a “Tick” being a node shrink and a “Tock” being an architectural improvement at the same technology node.

    Broadwell was a “Tick” down in technology nodes to 14nm with Skylake a “Tock” at 14nm but with a new architecture. Cannon Lake was supposed to be a “Tick” down to 10nm but instead we are getting a second “Tock” of Kaby Lake at 14nm.

    Broadwell = Tick
    Skylake = Tock
    Kaby lake = Tock
    Cannonlake = Tick

    Maybe Intel can fix this by calling Kaby Lake a Toke. Warmed over Kaby Lake marks time while waiting for real Tick to 10nm Cannonlake. It seems rather obvious that Intel has come up with a bit of a stop gap excuse while waiting on 10nm. Not only does it upset the cadence they have set in the market but it clearly reduces manufacturers desire to use Kaby Lake as its obviously less of an improvement over previous models of product.

    Imagine a car manufacturer having problems with their 2016 model car for some reason and they decide to put out a 2015 and a half model year as a stop gap. Probably not going to get a lot of buyers. People will stop buying and wait for the real thing at 10nm.

    10nm delay must be very significant…

    We can’t imagine that Intel would go to all this trouble if 10nm were right around the corner or didn’t have a significant delay. This is clear evidence of a longer than expected delay.

    Not only is it a replay of 14nm but could be worse as 20nm did not have an extra Tock thrown in while waiting for 14nm. You are not going to do Kaby Lake for a 3-6 month delay…its more like a year.

    Energizing TSMC & Samsung..
    In the continuous LeMans race of technology, TSMC and Samsung have perennially eaten the exhaust of the long time leader Intel, usually from a good distance. Now, not only are they closing the gap and up on Intel’s bumper but smoke may be coming out from under the lead car.

    It could be that TSMC & Samsung experience the same issues as Intel at 14nm and 10nm but so far 14nm does not appear as much as a problem for them as it was for trail blazer Intel.

    If we were in their shoes we would likely be stepping on the gas as hard as possible. As we mentioned in our prior note this does not bode well for Intel’s mobile aspirations nor its foundry hopes as the only advantage Intel had was its technology lead.

    Collateral Impact…

    As expectations for Intel’s Capex have continued to fall this news is not likely much of a surprise. However for those expecting an uptick in 2016 spending by Intel we think the odds of that are low given that not only has 10nm been pushed deeper into 2016 but it has probably started to roll into 2017 at this point.

    We don’t expect 10nm to get out of Intel’s R&D fab until the first half of 2016 which probably translates into equipment deliveries starting mid 2016 at best and rolling forward.

    15 ASML EUV tools likely pushed out….
    It was already clear that Intel wasn’t going to use EUV at 10nm and they also said they had a clear path to 7nm without EUV as well so we found it odd to hear about a 15 tool order as we thought it was clearly not written in stone.
    Well the 15 tool order may turn out to be written in the sand if Intel pushes its schedule out for 10nm. This is a significant negative turn of events for ASML given that the order was announced not that long ago.

    On the other hand this likely increases the time available for ASML to get EUV to work as recent progress seems to have slowed a bit.

    Other Impact…
    Obviously the delay helps multi patterning companies with Lam being at the top of that list followed by AMAT. Further delays at Intel do not help metrology and yield management companies as Intel tends to be heavier in this spending area than most others. It may be made up for by Samsung and TSMC stepping on the gas but its not yet clear.
    Coupled with DRAM issues we think this makes 2016 look relatively flat overall as Intel and DRAM weakness is offset by 3D and NAND spend.

    The challenges are unclear yet clear…
    We have not heard much about the problems Intel is having as it is deeply under wraps. It could be a combination of technical and financial issues at work…we just don’t know.

    We would like nothing more than to see Cannon Lake come out on time and wake up to find Kaby Lake and 10nm delays to be just a passing nightmare….but we don’t think thats the case.

    The issue of 10nm is more problematic than the embarrassment of the 14nm delay as Intel is in a more critical situation with both its competitors and its markets than before at the 14nm node. Pulling this off will test the mettle of management.

    “Bad companies are destroyed by crisis, Good companies survive them, Great companies are improved by them.” Andy Grove

    Robert Maire
    Semiconductor Advisors LLC

    Also Read: Further Delays for Intel 10nm?


    Trends in Automotive Electronics at #52DAC

    Trends in Automotive Electronics at #52DAC
    by Daniel Payne on 07-05-2015 at 4:00 pm

    The coolest and most expensive car at DAC this year had to be the McLaren P1, priced at $1,150,00 and powered by a 903 hp gas/electric hybrid. Electronics are used in autos to provide safety features, infotainment, motor control and performance.

    Also at DAC this year there was an Automotive Village with more cars and experts from both EDA and IP vendors on hand to explain how up to 25% of a new car’s cost comes from electronic systems.

    Related – Noise-Coupled analysis for Automotive ICs at DAC

    Ravi Ravikumar from ANSYS organized an automotive track with three invited speakers from Infineon, Freescale and Tesla.

    Ajay Kashyap from Infineon presented on: Achieving Power and Reliability Sign-off for Automotive Semiconductor Designs. Consider that driving in a car we use an anti-lock brake system (ABS) to help us stop safely, an airbag system in case of a collision, electrically powered steering (EPS) or even Advanced Driver Assistance Systems (ADAS) like parallel parking. Ensuring high quality typically means that engineers have to look at reliability metrics like power and timing while effected by dynamic voltage drops within an IC.

    Engineers at Infineon have used a design methodology to check and fix dynamic voltage drop issues by analyzing VDD and VSS levels that affect data integrity, and the effects on switching and non-switching signals.

    Related – Will your next SoC fail because of power noise integrity in IP blocks?

    The speaker from Freescale was Jehoda Refaeli and his talk was on: Thermal Integrity and Thermal-aware EM Reliability Check for 3D Stacked Dies in Automative Application. Freescale has been designing automotive ICs like multi-core MCUs to control systems like the powertrain, safety, motor and battery control. Stacking a memory chip on top of an SoC in 3D fashion can benefit power consumption and communication speeds, but engineering needs to verify that thermal issues are under control and don’t cause reliability issues.

    Freescale engineers use a design flow that includes a Chip Thermal Model (CTM) for each die in a 3D stack. They use a concurrent simulation for power thermal convergence to analyze and avoid thermal run-away. EM reliability is impacted by the temperature, so a thermal analysis is performed to understand self-heating effects.

    The CTM has a thermal profile and adding wire temperatures allows for a thermally-aware EM reliability check. Finite Element Model (FEM) analysis is used to calculate a wire’s temperature rise and 3D decay. Engineers now can understand both thermal and EM reliability for a 3D stacked die.

    Related –A Key Partner in the Semiconductor Ecosystem


    The most famous Electric Vehicle (EV) company for luxury cars has got to be Tesla, and Dr. Jenna Pollock Sr. talked about: High-Frequency, High-Power Magnetic Design with Maxwell 3D – from Geometry Creation to Component Optimization. Keeping the weight low for an EV is a big design goal, because it limits the driving capacity per charge. Component weight was minimized by using the ANSYS Maxwell tool on high-frequency magnetic cores.

    Tesla engineers created a scripting library with fully parametric models, and then ran optimization routines to get the best size, weight and performance from their magnetic cores.

    Summary
    Automotive is a big market for electronic systems design, and I’m glad to see that the DAC organizers have been able to grow this new area and that users of ANSYS are having success at making our automobiles safer, more reliable and use alternatives like electric and hybrid vehicles.

    Related – ANSYS Event to Highlight Cutting Edge Technology Development


    Cellphones on the Path of Extinction

    Cellphones on the Path of Extinction
    by Pawan Fangaria on 07-05-2015 at 4:00 am

    Semiconductor based electronics has continuously improved lives of people through various kinds of technology upgrades in the gadgets for our daily use. Imagine the journey from a mechanical typewriter to a laptop computer connected through a laser printer, transition from black & white photography to exotic coloured photographs on your finger tips, all kinds of banking transactions from anywhere on your phone, tablet, or laptop, and so on. Although the first handheld mobile phone was produced at Motorola in 1973, analog cellular networks evolved in 1980s giving way for further evolution of cellular networks into digital in 1990s. The digital cellular networks boosted data communication with 1G, 2G, 3G broadband and now 4G. One can do much more than just talking with a handheld mobile device from anywhere, anytime; see a whole movie on your smartphone. The data communication was the real catalyst for transition from cellphones to smartphones. Add to it the power of several ‘Apps’ to ease different functions for daily use in our lives.

    Now it’s more than 30 years we still have commercially working cellphones in some parts of the world. The cellphones are already replaced by smartphones in the developed world and are being rapidly replaced in the developing countries. Thanks to the low-cost smartphone providers in China and India. How long do we think it will take for cellphones to become extinct? Let’s see some data from IC Insights report on smartphone market trends.

    From the above graph, it appears that in last 2+ years the smartphone share of shipment in the total cellphone shipment has increased from 50% to 80%. It’s expected that the smartphone share will surpass much beyond 90% in next 3 – 5 years; IC Insights forecast says 93% by 2018. Can we see elimination of cellphones from the market post 2020? Make a guess from the following chart.

    We can see a continuous decline in non-smart cellphone shipment and also almost stable to less than 5% growth in total number of cellphones. The net result will be complete elimination of cellphones from the market in next 5 years or so.

    Although Appleand Samsungdominated the smartphone market in 2013 and 2014, both appear to lose market share to Chinese smartphone makers such as Xiaomi, Yulong/Coolpad, TCL and Huawei. The top six smartphone suppliers in China had increased their worldwide market share from 21% in 2013 to 29% in 2014. In Q1 2015, the top six China-based smartphone suppliers had a 25% market share though.

    Today, a key factor in the smartphone market is replacement of cellphones by smartphones in the emerging markets like China, India and other developing countries. If a cellphone can be replaced by an smartphone in less than $200, people can happily afford it. In fact an smartphone can come for even less than $100 in these countries. And they have almost all functions of a low-end smartphone.

    I had bought an Android1 Micromax Canvas, an Indian company smartphone for about $100 for my daughter. In normal day-to-day working, if I compare that smartphone with my Google Nexus, I do not see any appreciable difference. So wait for five years, all remaining cellphones in the worldwide market will be replaced by smartphones!

    For detailed reading of IC Insights report, you can get it HERE.

    Pawan Kumar Fangaria
    Founder & President at www.fangarias.com


    When it comes to High-Sigma verification, go for insight, accuracy and performance

    When it comes to High-Sigma verification, go for insight, accuracy and performance
    by Michael Pronath on 07-04-2015 at 7:00 am

    There are three critical goals that designers of custom digital designs and memories look to achieve with high sigma verification:

    (1) obtaining accurate results,
    (2) achieving results with good run-time (efficiency), and
    (3) gaining proper insight into how their circuit is behaving along with an understanding of failure modes that most affect high-sigma performance. Problems can then be identified and optimization tools can then be employed for tuning circuits to correct those problems.

    A “black-box” approach taken by methods based on sampling and response surface models looks easy at first glance but falls short in all three categories: they introduce significant sampling errors, suffer from long runtimes, and provide little insight into the circuit’s different failure modes. In particular, there is no verifiability in black-box modeling methods. The user gets easily lulled into a sense of security by sample plots, but is not aware how unsafe these plots are as they show only a tiny fraction of data points chosen by a model. MunEDA tools offer to the designer added insight into their circuit behavior at extreme levels of variation rather than using a very limited “trust-us” approach.

    MunEDA provides a fully-scriptable environment where each circuit preparation, analysis, optimization and reporting step can be programmed into a completely automatable flow (think Matlab and other industry-standard programming environments). MunEDA employs worst-case analysis (WCA) to rapidly locate the most-likely failure modes of your memory, clock-tree, analog, and mixed-signal circuits.

    MunEDA WCA is based on the concept of most probable points (MPP), widely used for engineering reliability analysis and reliability-based design [1]. By virtue of their efficiency, accuracy, and providing insight into the analyzed problem, MPP-based methods are very popular for high-sigma verification tasks. WCA is an extension of MPP that simultaneously solves for worst-case corner and worst-case mismatch.

    In [2], Intel engineers explain how MPP works and why it is their method of choice for verifying and optimizing yield, area, and power of register files and bitcells in microprocessors. A large number of different registers and bitcells is used in a CPU; for each one, high-sigma analysis is run many times, swept over process variants, corners, Vcc_min, etc. In [3], Intel engineers apply MPP method to carefully consider two failure modes of interest in their sequential logic circuit.

    Due to the large number of required MC runs, efficiency of WCA is key. Typical runtimes of WCA-based 6 sigma analysis today are in the range of only 150 simulation runs compared to the requisite minimum 500 billion runs of standard MC to achieve the same accuracy.

    Being able to run high-sigma efficiently is also important for designers who need to run it inside of an optimization loop. Due to mixed effects between operating conditions, corners, local variation, and device geometries, high-sigma analysis has to be executed multiple times during one optimization run.

    One interesting property of embedding WCA into MunEDA’s environment is how analyzing different failure modes gives valuable insight into circuit behavior, which cannot be achieved using black-box sampling methods.

    Figure 1: Multiple failure modes in Mux circuit

    Take the example of the multiplexer circuit shown in Figure 1 above. As often happens with other types of circuits there are multiple failure modes of concern. Turning a black-box analysis tool loose on the circuit without providing input as to where to look will risk locating only one failure mode and maybe not the one of most critical interest. It’s especially problematic if a failure mode has a steep transition cliff, such as the nFET contention problem shown in figure 1.

    Using MunEDA’s professional-grade environment for analyzing circuits with multiple failure modes, designers can consider all of their failure modes in succession and be sure not to miss one.
    Figure 2 shows a run flow within the environment for analyzing multi-level failure modes in the arena of high-sigma analysis.

    Figure 2: Multi-Level Worst-Case Analysis Example in MunEDA

    Another application for WCA is in evaluating timing and race conditions along delay paths in clock circuits and other timing circuits. This approach gives valuable insight into circuit behavior, which cannot be achieved using black-box sampling methods. MunEDA’s modular and fully-scriptable analysis canvas provides the ability to analyze and attain confidence in timing solutions. Consider the example shown in Figure 3, which shows a delay-path circuit.

    Figure 3: Robustness analysis for a race condition using WiCkeD

    To truly understand circuit behavior at high-sigma and ultra high-sigma it is necessary to use professional-quality tools that allow designers to really understand the circuit, tools that MunEDA provides. MunEDA tools for circuit migration, analysis, optimization and modelling have been proven in thousands of silicon tape outs with many of the top semiconductor companies worldwide. Please follow this link to see customers who are using MunEDA’s “WiCkeD” platform: https://muneda.com.

    [1] X. Du et al.: “Most Probable Point-Based Methods.”
    In : A. Singhee, R. A. Rutenbar (ed.): Extreme Statistics in Nanoscale Memory Design. Springer, 2010.

    [2] K. Anshumali et al.: “Circuit and Process Innovations to Enable High-Performance and Power and Area Efficiency on the Nehalem and Westmere Family of Intel Processors”. Intel Technology Journal, vol.14 no.3, p.112-114.
    http://www.intel.com/content/www/us/en/research/intel-technology-journal/2010-volume-14-issue-03-intel-technology-journal.html

    [3] CH. Chen, K. Bowman, C. Augustine, Z. Zhang, J. Tschanz. “Minimum Supply Voltage for Sequential Logic Circuits in 22nm Technology”. IEEE Symposium on Low Power Electronics and Design. 2013, pp. 181-186.