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Auto Cyber Security: From Ignorance to Compliance

Auto Cyber Security: From Ignorance to Compliance
by Roger C. Lanctot on 12-02-2018 at 7:00 am

Auto makers have long relied on security by obscurity to get away with not defining or adhering to proper cyber security hygiene. This rationalization had been embraced in the context of low levels of automotive hacking mainly carried out by enthusiasts or so-called “white hat” or ethical hackers.

A new report from Strategy Analytics, highlighting the contributions of Argus Cyber Security, identifies the growing array of standards and regulations governing automotive security. The report points out that auto makers must confront and take responsibility for the vulnerability of their vehicles especially in the context of evolving autonomous vehicle tech.

– Argus Helps Answer the Call for Automotive Cyber security Regulation

In fact, the recent passage, and signing by President Trump, of the Cybersecurity and Infrastructure Security Agency Act of 2018, has established the Cybersecurity and Infrastructure Security Agency within the Department of Homeland Security. The Act and the Department recognize 16 critical infrastructure sectors, one of which is “Transportation Systems.”

– Website of new CISA agency

– Text of Cybersecurity and Infrastructure Security Agency Act of 2018

While the focus of the Act is infrastructure, it is the belief of cyber security professionals that it is only a matter of time before the onset of autonomous vehicles triggers the identification of connected vehicles as part of this critical infrastructure. This perspective was voiced just this week at the Security Summit held at the L.A. Auto Show. Bryson Bort, CEO and founder of Scythe, in particular, emphasized this point.

Bort’s concerns were echoed at the Summit by John Gomez, CEO of Sensato, who focused on ransomware as the most immediate automotive cyber security concern. Gomez identified three types of threats including cyber criminals, cyber spies and cyber terrorists with the motivations being profit, intelligence, and ideology, respectively. Other speakers noted ongoing concerns with privacy and data ownership (Lauren Smith, Future of Privacy Forum) and the vulnerability of app-based car-sharing programs (Mikhail Savushkin, Kapsersky Labs).

Automotive cyber security was long ignored because it had no constituency or business model. Consumers weren’t looking for “secure” cars and car makers weren’t required to make secure cars. That is rapidly changing – especially with the onset of new laws and regulations around the world.

Before theses new laws and regulations, though, there was the famous “Jeep hack” of 2015. This hack, pulled off by Charlie Miller and Chris Valasek, embodied all of the shortcomings of the prevailing cyber security ignorance in the automotive industry at the time.

Miller and Valasek identified a vulnerability in certain Jeep models from FCA. Miller and Valasek likely notified FCA of the problem. They were likely disappointed in FCA’s response – so they created a video demonstrating the potentially horrendous implications of the vulnerability: remote control of certain vulnerable Jeeps.

FCA suffered a massive public relations blow along with absorbing the nine-figure cost of recalling millions of vehicles to correct the security flaw. Finally, the entire industry got the message. (Miller and Valasek now work directly for General Motors after briefly working at Uber.)

The lessons learned:

  • Hackers can be helpful and must not be ignored
  • Car makers cannot rely on hackers to identify and fix vulnerabilities
  • Fixing vulnerabilities in the field is expensive (and embarrassing)
  • Connectivity is essential to identifying, preventing and correcting cyber security vulnerabilities
  • Cyber security must be addressed throughout vehicle design and system integration

The automotive industry is not out of the cyber security woods. The good news is that General Motors has seen fit to elevate cyber security to a Board-level responsibility – a model for other car companies to emulate.

Will there be more automotive hacks? No doubt. Do we have time to prepare for the day when cars are designated critical infrastructure? Yes. Will cars ever be certifiably secure? No


Webinar: Turnkey Bluetooth True Wireless Stereo Earbuds and Speakers

Webinar: Turnkey Bluetooth True Wireless Stereo Earbuds and Speakers
by Bernard Murphy on 12-01-2018 at 7:00 am

When we were first introduced to earbuds, in-ear speakers connected through thin wires to your phone (and earlier portable music devices), they seemed pretty convenient for private entertainment at work, while walking, exercising, doing almost anything. Until we started to realize those long dangly wires weren’t ideal. They’d snag easily, and pull out an earbud, they tie themselves into frustrating bundles of knots when stuffed in a pocket and those skinny wires aren’t very robust. When we’re surrounded by wireless technology, why do we still need wires for earbuds? The same point could be made for home speakers. While wireless communication races ahead, why are audio connections stuck in the dark ages?

Register HERE for the CEVA Webinar at 10 AM CET on December 5[SUP]th[/SUP]. I’m guessing this is primarily for EMEA/Asia audiences. A bit early/late for the US but no matter where you are register anyway and you will get a link to the replay.

Apple Airpods showed the way with truly wireless earbuds. Others quickly followed with pseudo wireless offerings which didn’t need a wired connection to your phone but did come with a strap between the earbuds, like the granny strap for your glasses. More than a few consumers decided they didn’t need that strap, so they cut it off. Oops. Turns out the strap wasn’t just a fashion statement. One earbud received an audio stream from the phone, played one of the stereo channels and forwarded the other channel to the other earbud through that strap. Truly wireless stereo earbuds are a bit harder, especially if you want them to be usable for several hours (there isn’t a lot of space in those tiny devices for big batteries).

Similar concerns and more apply to home audio systems. When you want to outfit your man-cave/she-shack with surround-sound, having to run cables from speakers to the amplifier just seems so, well, 20[SUP]th[/SUP]-century. Sure you have to power the speakers, but audio streaming should be wireless. There’s another concern here too – synchronizing channels. In a typical room, there’s enough distance between speakers and the source for channel synchronization to become a concern; you don’t want what should be beautiful surround sound to become a confusing jumble. Listen to this webinar to understand how CEVA and Tempow provide a low power, truly wireless stereo experience scaling all the way from wireless earbuds to home audio.

Abstract
A recent market study from the Bluetooth SIG shows that shipments of Bluetooth audio devices are growing steadily, and set to exceed 1.2 billion units annually by 2022. This market is dominated by headsets shipments, with wireless earbuds as one of the hottest devices in the market today. And for wireless earbuds, true wireless stereo is the technology enabling this market. This webinar presents the various solutions available on the market for true wireless stereo, with particular focus on the Tempow – CEVA innovative solution.

Join CEVA and Tempow experts to learn about:

  • Market trends in the Bluetooth audio market
  • Benefits of Bluetooth for audio streaming
  • Overview of existing proprietary true wireless stereo solutions for earbuds and speakers
  • The True Wireless Earbuds joint solution from Tempow & CEVA

Target Audience
Design, system and product engineers targeting Bluetooth SoC for true wireless stereo earbuds and speakers. Smartphone makers interested in designing their own earbuds products

Speakers


Franz Dugand
Sales and Marketing Director, Connectivity BU, CEVA, Inc.


Vincent Nallatamby
CEO, Tempow

Register HEREfor the CEVA Webinar at 10 AM CET on December 5[SUP]th[/SUP]


RISC-V End to End Solutions for HPC and Networking

RISC-V End to End Solutions for HPC and Networking
by Daniel Nenni on 11-30-2018 at 12:00 pm

Semiconductor IP is one of the more exciting and most viewed topics we cover on SemiWiki, it has been that way since we began in 2011 and that trend will continue indefinitely, my opinion.

Semiconductor IP: Total Blogs: 640: Total Views: 3253751: Average: 5084

Based on the design starts we track, Cloud Computing is a leading semiconductor driver so High Performance Computing (HPC) and Networking IP development and deployment will closely follow including High Bandwidth Memory (HMB2) and Serializer-Deserializer (SerDes) IP.

Specifically, higher memory bandwidth at lower power and technical capabilities (2.5D Interposer-based ASIC design in combination with the new JEDEC HBM Gen2 standard). It needs the integration of significant capacities of high-bandwidth (up-to 256GB/s for an 8-channel, 8Gb memory stack implementation) and low latency memory inside the ASIC package. Open-Silicon’s full IP subsystem solution includes an HBM2 controller, PHY and interposer I/O, and completes the critical components needed for the successful integration of HBM2 memory into ASIC system-in-package (SiP) designs.

One of the more exciting emerging IP companies I have come across is Credo (meaning “I believe”). Credo delivers high-performance, mixed-signal semiconductor IP including SerDes and interconnect products for 25G, 50G, and 100G connectivity. Walden International led Credo’s first round of funding in 2015 and if you look at the management profiles you will see deep Marvell Semiconductor experience. I did get a chance to catch up with Jeff Twombly of Credo who is quoted below. Jeff is a long time Silicon Valley semiconductor guy, very approachable, and engaging. I highly recommend getting coffee with Jeff to get the latest on the SerDes business, absolutely.

As you may know I am a big fan of the ASIC business and we have been working with Open-Silicon for the past two years on research, blogs, and we jointly published an eBook on Custom SoCs for IoT. Open-Silicon is now listed as a SiFive Company which we can discuss further in the comments section if you like. Which brings us to the recent announcement by Open-Silicon and Credo which is definitely worth a read:

SiFive, Credo and Open-Silicon Showcase End-to-End Solutions for HPC and Networking Applications at SC18 in Dallas

DALLAS, Texas – November 12, 2018 – SiFive, Credo and Open-Silicon will exhibit complete end-to-end solutions for HPC and networking applications at Supercomputing 2018 (SC18) in Dallas, TX. The co-demonstration illustrates the capabilities of SiFive’s highest performance RISC-V Core IP U7 Series, Open-Silicon’s HBM2 IP subsystem and Credo’s high performance, low power, mixed-signal 112Gbps PAM4 SerDes. Custom SoC solutions and critical IP cores, including Interlaken IP and Ethernet IP subsystems, will also be showcased.

The SiFive Core IP U7 Series is a high-performance RISC-V applications processor featuring a dual-issue superscalar core with domain-specific customizations required for embedding intelligence from the edge to the cloud. The U7 series microarchitecture optimizes performance and power enabling high throughput systems for diverse compute workloads and form-factors. Credo’s 112G SerDes, silicon proven in advanced 7nm FinFET node, enables rapid build-out of next-generation 100G, 400G and 800G Ethernet cloud networks, and delivers higher bandwidth, lower power and optimum lane count configurations. Open-Silicon’s HBM2 IP subsystem solution, in FinFET technologies, includes an HBM2 controller, PHY and interposer I/O. It provides the highest performance and flexibility for integrating HBM directly into next-generation custom SoC 2.5D SiP solutions.

“The SiFive Core IP U7 Series provides a compelling feature set that includes scalability, extensibility, 64-bit architectures, and a heterogenous coherent combination of real-time and application processors for next generation compute requiring embedded intelligence,” said Jack Kang, VP of Product Marketing, SiFive.

“Credo’s silicon-proven 56G/112G SerDes IPs, combined with Open-Silicon’s SerDes Technology Center of Excellence, minimizes risk and time-to-market for developing next generation HPC and networking custom SoCs,” added Jeff Twombly, Vice President of Marketing and Business Development, Credo.

“This collaborative demonstration with SiFive and Credo is an excellent opportunity to unveil the power of a complete end-to-end solution for next generation custom SoC solutions for high-performance and bandwidth applications,” said Shafy Eltoukhy, SVP of Operations and GM, Open-Silicon.

About SiFive
SiFive is the leading provider of market-ready processor core IP based on the RISC-V instruction set architecture. www.sifive.com

About Credo
Credo is a leading provider of advanced SerDes IP. www.credosemi.com

About Open-Silicon

Open-Silicon, a SiFive company, is a system-optimized custom SoC solution provider. www.open-silicon.com


Security and RISC-V

Security and RISC-V
by Bernard Murphy on 11-30-2018 at 7:00 am

One of the challenges in the RISC-V bid for world domination may be security. That may seem like a silly statement, given that security weaknesses are invariably a function of implementation and RISC-V doesn’t define implementation, only the instruction-set architecture (ISA). But bear with me. RISC-V success depends heavily on implementors not yielding to the temptation of non-standard extensions in the pursuit of differentiation. It also depends heavily on a perception that, where it matters, implementations are at least as secure as equivalent ARM offerings.

Whatever you may think of the ARM hegemony, you can’t deny that they are putting a lot of work into security, from the device-level all the way up to the total system. Especially in the IoT, wherever the security floodgates break (when we will really wake up to the importance of security) security-lite RISC solutions are not going to do well. Recognizing this, the RISC-V Foundation has formed a security standing committee, chaired by Dr. Helena Handschuh of Rambus.

The technical goals of the standard continue to be in ISA refinement, so this committee will be considering extension to the privilege specification as well as extensions in support of cryptography. And of course they have a promotional goal to encourage adoption of and to further innovation around the RISC-V standard particularly with respect to security. About 25 companies are represented on the committee, from security specialists to IP vendors and large semiconductor vendors.

One of these companies is Tortuga Logic, who I have written about before. I talked to Jason Oberg, CEO of Tortuga, about their role in this activity. Tortuga’s whole objective is security, particularly against side-channel attacks, so they should be able to add real value to the committee. Naturally they have a business interest. When they’re aligned with the standard, their tools and IP should become attractive in guiding design for anyone implementing or using RISC-V. Which should in turn provide objective measures of security and therefore build confidence around using these implementations. A virtuous cycle with Tortuga making some money along the way. (I asked Jason what they plan to do in the spirit of open support. He said they’re thinking of possibly releasing an open threat-model for RISC-V.)

If you’re plugged into the RISC-V world, you’ll know that there is a summit next week, December 4th-5th at the Santa Clara convention center. Jason will be presenting in the afternoon of the 5th on a security verification framework for RISC-V, also Tortuga will have a booth in the exhibit hall. Their demo should be pretty interesting; they have applied their technology to analysis of the open Rocket core and will show a number of side-channel issues they found in that implementation. You might want to check out the demo if only to better understand how your current verification strategy will probably miss these kinds of problem and to realize that those deficiencies may not be easy to fix through better testbenches or more formal verification.

You can register for the summit HERE and learn more about Tortuga Logic HERE.


On-Chip Networks at the Bleeding Edge of ML

On-Chip Networks at the Bleeding Edge of ML
by Bernard Murphy on 11-29-2018 at 7:00 am

I wrote a while back about some of the more exotic architectures for machine learning (ML), especially for neural net (NN) training in the data center but also in some edge applications. In less hairy applications, we’re used to seeing CPU-based NNs at the low end, GPUs most commonly (and most widely known) in data centers as the workhorse for training, and for the early incarnations of some mobile apps (mobile AR/MR for example), FPGAs in applications where architecture/performance becomes more important but power isn’t super-constrained, DSPs in applications pushing performance per watt harder and custom designs such as the Google TPU pushing even harder.


At the high end, there is no pre-agreed set of “best” architectures. Everyone is experimenting to find the best performance per watt for their application. This is tricky. There are some needs in common with conventional computing – you want to quickly read in data, process computations, access and store to memory. However, maximally exploiting the spatially distributed nature of NN algorithms for performance and power pushes architects to distributed compute, most commonly in grids, rings or tori. These also exploit memory hierarchies, also distributed, and high-bandwidth memory (HBM) for bulk memory off-chip (or off-die in 2.5/3D packaging).

These architectures naturally push chip size, in the example above to 400mm[SUP]2[/SUP] and larger sizes are not uncommon. So now you have a hard problem in getting to timing closure across that big die. And if that wasn’t enough, ML typically requires massive amounts of data to be broadcast for image map and weight updates. So bandwidth demand in these systems can be huge, creating potentially massive traffic congestion and power problems.

Arteris IP has been working for many years with customers using ML technology, supporting near real-time inferencing at the edge with the likes of Mobileye, NXP, HiSilicon and others. But now they’re finding multiple companies wanting to support training at the edge, one very active direction for them coming from camera makers. And they’re seeing more activity around ML training acceleration in the datacenters. Of customers Arteris IP has announced, Baidu seems like an obvious fit here. Which in itself is interesting. After all, don’t NVIDIA dominate this space? Again, everyone’s looking for differentiation, not something you’re going to find if you’re just using the same platform everyone else is using. Not that Tegra isn’t a great solution but if you want to be at the bleeding edge, adding your own secret hardware sauce to your ML pipeline can be a way to pull ahead.

So what does all of this take? First, if you have distributed compute, you’re going to need an on-chip network to connect all of those compute nodes and the on-chip memory hierarchy and the off-chip memory. But it’s not quite as push-button as generating the grid in the opening graphic. In a strong NoC solution maybe you can dial in rings and tori, but these architects need more. Performance (and power) depends on very tightly coupled memory, so they want to embed local caches in the configuration. But there’s no fixed formula for where; they want to experiment to understand latencies and PPA implications. Those architects want to be to interact with network generation, to control where they want holes in the grid for memory blocks.


This goes further. High-end ML architects even want to tune the routers in the network they build, for example to add pipeline stages or FIFOs, or change the number of masters or slaves for a router or just one of the corner routers. All of these needs have implications for the architecture of the NoC generator. The standard method is compiler-centric. You dial in a bunch of parameters, interact through an interface to control details and generate. Which works very well in the processor and IP centered world for which this flow has been optimized over many years. But ML architects don’t have a standard recipe. They want to fool with almost everything, but they still want the benefit of automated generation, with all the flexibility of being able to customize the topology and the routers through that interface.

This is the first of 3 advances offered in Arteris IP’s just-announced AI package, available as an option to their recent FlexNoC4 release. They told me they have been working on this (and other features I mention below) for multiple years with their ML-driven customers. Kurt Shuler (VP Marketing) tells me these they’ve been responding to their customer ML needs, polishing and productizing this stuff for quite a while.

So, flexible network architecture (both logical and physical) while preserving the benefits of automating generation? Check. What about the big-die/timing closure problem? In general, timing closure across huge die isn’t a new problem. It’s very difficult to balance a clock tree across the full span of the design, so the standard solution is to use some kind of globally asynchronous, locally synchronous design technique. A popular solution is source-synchronous clocking; you forward the clock along with the data between locally synchronous domains. FlexNoC 4 includes support for a very lightweight approach that achieves this goal while minimizing congestion. The technology also provides support for multiplexing wires over long distances (again to mitigate congestion) using something they call VC-Links. Incidentally this solution is integrated with the Arteris IP PIANO timing closure package, so an architect can see where obstructions are and add virtual channels as needed.

Finally, there’s the bandwidth problem. One aspect is broadcast; how do you distribute lots of data to many destinations without dragging the whole system down? Through intelligent distribution is the Arteris IP answer. Distribute to a limited number of broadcast stations close to the destinations, then have those stations distribute locally. Obvious when you see it, but this requires a solution that supports architecting those broadcast stations into the network.

For traffic jams at HBM, the package provides methods to maintain high utilization of all connections into the memory controller through interleaving between initiators and targets, reorder buffers, traffic aggregation and data width conversions and support for very wide (1024 bits) connections where needed. Arteris IP have also added optimizations for datapaths, supporting up to 2048 bits wide.

All of which reinforces that design for AI/ML is not the same as design for traditional SoC components. The challenges are different and they require significantly enhanced solutions. You can learn more about FlexNoC 4 and the AI package HERE.


Designer babies are here ready or not!

Designer babies are here ready or not!
by Vivek Wadhwa on 11-28-2018 at 12:00 pm

A Chinese scientist from a university in Shenzhen claims he has succeeded in creating the world’s first genetically edited babies. He told the Associated Press that twin girls were born earlier this month after he edited their embryos using CRISPR technology to remove the CCR5 gene, which plays a critical role in enabling many forms of the HIV virus to infect cells.

Whether the claims are true or false, one thing is clear: We are entering an era of designer babies. Scientists will soon be able to edit human embryos with the aim of eliminating debilitating disease, selecting physical traits such as skin and eye color, or even adding extra intelligence. Our understanding of the effects of the technology is in its infancy, however.

The technology is CRISPR: clustered regularly interspaced short palindromic repeats. Discovered by scientists only a few years ago, CRISPRs are elements of an ancient system that protects bacteria and other single-celled organisms from viruses, acquiring immunity to them by incorporating genetic elements from the virus invaders. CRISPRs evolved over millions of years to trim pieces of genetic information from one genome and insert it into another. And this bacterial antiviral defense serves as an astonishingly cheap, simple, elegant way to quickly edit the DNA of any organism in the lab.

Until recently, experimenting with DNA required sophisticated labs, years of experience, and millions of dollars. The use of CRISPRs has changed all that. CRISPRs work by using an enzyme — Cas9 — that homes in on a specified location in a strand of DNA. The process then edits the DNA to either remove unwanted sequences or insert payload sequences. CRISPRs use an RNA molecule as a guide to the DNA target. To set up a CRISPR editing capability, a lab only needs to order an RNA fragment and purchase off-the-shelf chemicals and enzymes, costing only a few dollars.

Because CRISPR is cheap and easy to use, it has both revolutionized and democratized genetic research. Thousands of labs all over the world are experimenting with CRISPR-based editing projects. There are few regulations worldwide, even in the United States, largely because regulators don’t understand what has become possible. China has taken the lead because it puts scientific progress ahead of all concerns. It has made the most astonishing breakthroughs.

In 2014, Chinese scientists announced they had successfully produced monkeys that had been genetically modified at the embryonic stage. In April 2015, another group of researchers in China published a paper detailing the first ever effort to edit the genes of a human embryo. The attempt failed, but it shocked the world: this wasn’t supposed to happen so soon. And then, in April 2016, yet another group of Chinese researchers reported it had succeeded in modifying the genome of a human embryo in an effort to make it resistant to HIV infection.

The intentions may be good, but this has transgressed a serious boundary. We know too little to predict the broader effects of altering or disabling a gene. In the 1960s, we imagined rather naïvely that as time went by we would understand with increasing precision the role of each gene in making us what we are. The foundation of genetics for decades, once biology’s Central Dogma, was the hypothesis that each gene codes for a single protein. Knowing the correspondences, we would have tools useful not only for research but also for curing and preventing disease with a genetic basis and perhaps for augmenting human evolution.

The one-gene-one-protein Central Dogma, though it continues to pervade our common beliefs about genetics, underwent conversion when scientists realized many proteins comprise several polypeptides, each of which was coded for by a gene. The Dogma therefore became one gene, one polypeptide. But what sounded the entire Dogma’s death knell was the discovery in the early 1970s that a single gene can code for more than one protein. The discovery that the human genome contains only about 30,000 genes to code for some 90,000 proteins brought that home; but what makes our understanding appear spectacularly inadequate is the discovery in 2000 that a single gene can potentially code for tens of thousands of proteins.

In a nutshell, we don’t know the limits of the new technologies, can’t guess what lifetime effects a single gene alteration will have on a single individual, and have no idea what effects alteration of genes in sperm or ova or a fetus will have on future generations. For these reasons, we have no knowledge of whether a particular modification of the human germline will be ultimately catastrophic, and no basis for considering that tampering with heritable genes can be humane or ethical.

With an awareness of our ignorance in this area, the 2015 announcement of genetic modification of a human embryo led to global debate, and a handful of governments temporarily banned gene editing of live human embryos as well as the genetic modifications of the human germline (the DNA that will create future generations) for imparting beneficial traits such as height or intelligence. But in February 2017, an advisory body from the National Academy of Sciences announced its support for using CRISPR to edit the genes of embryos to remove DNA sequences that cause serious heritable diseases. And the Chinese are clearly proceeding with experimentation too, as the announcement by Shenzhen researchers showed.

The reality is that we have arrived at a Rubicon. Humans are on the verge of finally being able to modify their own evolution. The question is, can we use this newfound superpower in a responsible way that will benefit the planet and its people — or will this be a race for scientific glory and profit?

This article is partly derived from my bookThe Driver in the Driverless Car: How Our Technology Choices Will Create the Future.


Achronix Assists Academics

Achronix Assists Academics
by Tom Simon on 11-28-2018 at 7:00 am

In every semiconductor related field, innovation is the name of the game. Academic, non-profit and government research has been a consistent source of innovation. Look back at the US space program, basic science research and even military programs to see where much of the foundation of our current technological age came from. Indeed, you might not be sitting in front of your computer on the internet now, had it not been for ARPA’s work in developing internet hardware and protocols. Fortunately, there is a long tradition of leading technology companies helping facilitate advanced research.

Achronix, a company with a potentially game changing product for embeddable FPGA fabric, just announced a program to give access for their technology to academic and research entities. Their Research eFPGA Accelerator Program will allow researchers to use preconfigured Speedcore eFPGA IP for their research projects. While a commercial company would probably want a fully configurable and optimized Speedcore block, researchers can work with preconfigured blocks. This helps Achronix by lowering support costs and allowing the process run more quickly.

I recently spoke to Steve Mensor, VP of Marketing at Achronix, about this program to better understand what they want to accomplish. He said that because embeddable FPGA is new, there are lot of interesting problems that it can solve. He sees this program as a win-win. Achronix can learn from new usage scenarios that researchers devise, at the same time researchers benefit from being able to apply new technology. He is hoping that this program leads to many new ideas.

It’s also safe to say that once students and researchers learn how eFPGA and the tools used in the flow work, down the road they may find other new applications, either academic or potentially even commercial. Steve says that this will be a big benefit to users that have low volumes and could not afford the cost of developing new instances. Using preconfigured IP is cost effective for everyone involved, and there is no real penalty in area – due to the low volumes.

Achronix will supply fully qualified and characterized, silicon proven blocks on TSMC 16 FF+. They anticipate that AI/ML will be a big application area. eFPGA offers low latency, programmability and acceleration of parallel processing for AI/ML designs.

In addition to purely academic users, Achronix also has announced a program called the Test-Chip eFPGA Accelerator Program will help startups and small companies, and others, by making it easy to try out new architectures in silicon that use eFPGA fabrics. This program will let companies produce evaluation volumes of SOCs that use their eFPGA fabric. Just like the academic program, it will use pre-verified silicon blocks on TSMC 16 FF+.

Steve is betting that once institutions and companies try out eFPGA and their ACE tool set, they will see significant benefits. In the case of commercial users, this creates a lower cost and safe means to start building products with eFPGA. The Achronix website has full details on how to participate in both of these new programs.


Is IP SoC 2018 Still Alive? Better than Ever!

Is IP SoC 2018 Still Alive? Better than Ever!
by Eric Esteve on 11-27-2018 at 12:00 pm

The 21[SUP]st[/SUP] IP-SoC Days conference will be held in Grenoble, France, on December 5-6, 2018. IP-SoC is now the unique IP centric conference, with presentations reflecting the complete IP ecosystem: IP suppliers and foundries, external IP or internal reuse managers. Look at the program, you will see the hot topics covered during the conference, like Security, AI and Safety, Edge Computing and IoT, new trends in IP (eFPGA, Analog IP reuse), IP tracking or IP management. And like a new mantra, low power and energy efficiency!

When I remember 5 years back, in 2013, IP-SoC was taking place in a large auditorium (for the keynotes and main sessions), plus a few rooms for the other sessions. The problem was that the auditorium was far to be full, and the attendees had the perception of a declining conference. We must insist on the word “perception”, and this perception was coming from the fact that the auditorium was just too large. Pr. Gabriele Saucier, founder of D&R and running IP-SoC, was cleaver enough to get the point and find the right solution. It was to organize IP-SoC in another place and make the conference more focused. Last year, the room was full and the audience very attentive.

It’s even more important for the IP ecosystem to rely on the IP-SoC days for networking when you hear the rumors about the DAC future! Don’t expect me to comment these rumors. Being part of the DAC IP Committee, it wouldn’t be wise, moreover, I don’t know the outcome about the next DAC.

Listing some presentations to be given at IP-SoC, I will start with “Design IP Status & 5 Years Growth”, as the presentation is from IPnest and I will present it. IPnest customers and Semiwiki readers will recognize the first 3 slides, extracted from the Design IP Survey and the Interface IP 2013-2022 Survey. Starting from the next slide, IPnest will propose a new forecasting method, in order to provide an accurate 5 years, or even 10 years total IP market Forecast.

As I have recently read some data from analyst predicting that the IP market will weight $10 billion by 2022, I realized that we (the industry) need to have access to realistic data. Realistic data means that you search for a solid methodology, use the IP market know-how to fine tune the equation. By this means, IPnest comes to $6 billion in 2022 for the IP market (already +50% compared with 2017).

I am sorry if $6B doesn’t sound as amazing as $10B, but that’s the result coming from an innovative method (very similar with the EDA market size evaluation as given by Wally Rhines in Semiwiki in this post). I don’t say much, as I prefer to keep the exclusivity to IP-SoC attendees and IPnest loyal customers… (please note that I will NOT post the presentation on the conference web site, you will have attend to it live!).

If you come to Grenoble, you will have the opportunity to attend to 20 presentation on December 5[SUP]th[/SUP], the first day, enjoy wine testing on the evening (and a banquet!) and the next day to watch another 14 presentations and a panel. This panel will discuss about technology transfer from research center to the industry, taking as an example the FD-SOI success story. If you read Semiwiki since 2013, you know about the numerous articles written about FD-SOI (300 000 views in total).

Most interesting topics, to my opinion, (extracted from the ten sessions):

 

  • Security IP
  • Low Power Challenge and Power Management
  • RISC-V Ecosystem
  • New IP Trends
  • Analog Design

IP-SoC 2018 will be as usual an high level conference, where complexes engineering topics are addressed by industry experts, not just a marketing fest! That’s why the conference is not only still alive, but better than ever!

IP-SoC conference will be located on December 5-6 in Hôtel EUROPOLE, 29 rue Pierre-Sémard, Grenoble France,

And you can register here

See you on Wednesday 5[SUP]th[/SUP] December in Grenoble

From Eric Esteve from IPNEST


The Disconnect Between Semiconductor and Semiconductor Equipment Revenues

The Disconnect Between Semiconductor and Semiconductor Equipment Revenues
by Robert Castellano on 11-27-2018 at 7:00 am

Historically, the semiconductor and semiconductor equipment industry were inextricably linked due to the cyclical nature of the chip industry. An increase in semiconductor revenues was followed within a short period with an increase in equipment revenues, as semiconductor companies purchased equipment to make more chips to increase capacity. In down years, semiconductor companies stopped purchasing unneeded equipment.

Chart 1 illustrates the cyclical nature of the industry between January 1991 and the end of December 2010.


Chart 1

Chart 2 shows that since 2011, this link between semiconductor and equipment revenues has been broken. Semiconductor revenues (red line) have continued to increase unabated, while equipment revenues (blue line) have begun a steep drop since June 2018.


Chart 2

If we compare Chart 1 with Chart 2 and focus on the trendlines, between 1991 and 2010 (Chart 1), semiconductor revenues growth was significantly more positive than equipment revenues. However, between January growth between the two sectors has been nearly identical, despite the cessation of the concurrent peaks and valleys of a cycles. This suggests that the semiconductor and equipment industry, although still cyclical, are independent of each other.

This presents a conundrum for analysts, including myself. The disconnect between semiconductor equipment capex spend by semiconductor companies presents a challenge in forecasting equipment growth based on semiconductor growth – something I’ve been done since I started The Information Network in 1985.

As seen in Chart 2, both semiconductor and equipment revenues rocketed starting in 2017. According to WSTS, the semiconductor consortium, memory chip revenues grew 61.5% in 2017 compared to just 21.6% for the entire semiconductor industry. In 2018, the memory chip revenues are projected to grow 30.5% compared to 15.7% for the entire semiconductor industry. However, memory chip revenues are projected to grow just 4.6% compared to 5.2% for the entire semiconductor industry in 2019.

NAND companies are migrating technology to 96-layer 3D NAND chips. For DRAMs, Samsung Electronics is currently migrating to the 1ynm process, while SK Hynix and Micron are switching to the 1xnm process

These transitions are proving difficult to achieve with high yields. Also, these migrations increase the number of processing steps used to make the chip, resulting in what is termed a “natural decline” in wafer throughput. In general, movement from one node to the next results in a 5-10% decline in capacity.

To counteract this “natural decline,” capacity needs to be increased, which is achieved by building new fabs and lines and purchasing equipment. Thus, the 60% increase in equipment purchases exhibited in 2017 did not result in comparable increases in unit shipments (Chart 3) but it did result in an increase in bit growth (Chart 4).


Chart 3


Chart 4

We are now witnessing a slowdown in equipment revenues. One reason for the slowdown in memory revenues is a drop in NAND and DRAM ASPs. This has prompted memory companies Samsung Electronics and SK Hynix to push out and delay further capex spend.

Companies such as Applied Materials and Lam Research, with a large exposure to memory chips through deposition and etch tools utilized in NAND production, should experience long term headwinds that will last until 2020.


Catapult Design Checker Finds Coding Errors Before High Level Synthesis

Catapult Design Checker Finds Coding Errors Before High Level Synthesis
by Camille Kokozaki on 11-26-2018 at 12:00 pm

In a recent whitepaper Gagandeep Singh, Director of Engineering at Mentor, a Siemens Business outlines a flow using Catapult Design Checker that helps in early detection of coding errors as many companies are turning to High-Level Synthesis (HLS) methodology. This requires that high -level C++ models are correct, that ambiguities in the language be detected and addressed during simulation and that sub-optimal coding generates unintended hardware after synthesis. Deficiencies there lead to simulation mismatches between HSL and RTL or even worse failure to detect design problems.

Some of the defects in a C++ model can be pointed out by static software analysis tools but these tools are meant for general purpose software and do not understand the hardware intent of the model. Software checking tools, like linters, on C++ source code, do not understand hardware.

Some hardware-aware issues for software checking tools include the fact that checkers:

  • Only work for C++ code and do not support SystemC
  • Do not understand bit-accurate data types
  • Only employ static analysis that can generate many false positives
  • Do not understand that some code can produce sub-optimal or incorrect hardware
  • Do not produce counter-example test-benches

What design and verification teams really need is a tool to quickly and easily check for coding bugs and suboptimal code before synthesizing to RTL. Teams also need to avoid simulation mismatches between C++ and RTL simulation. Checks need to be performed on C++ or SystemC source code before downstream tools are used.

The Catapult® HLS Platform provides a complete C++ verification solution that interfaces with Questa® for RTL verification as shown in the diagram.

The Catapult verification solution includes:

  • The C++ (or SystemC) source code with Assert and Cover statements is input into the Catapult Design Checker (CDesign Checker) which uses formal analysis and lint techniques to find language and coding bugs.
  • Catapult Code Coverage (CCOV) provides hardware-aware coverage analysis of the C++ code.
  • Catapult synthesizes the source into power-optimized RTL that is verification ready.
  • The flow generates test infrastructure using Catapult SCVerify for RTL simulation using Questa.
  • As a final step, the sequential logic equivalence checking tool SLEC-HLS formally verifies that the C++ exactly matches the generated RTL.

While a design might simulate at the C++ level with no apparent issues, ambiguities in the C++ description can lead to simulation mismatches during RTL simulation. These issues are often hard to debug and can be time-consuming to fix. Design Checker employs both static and state of the art formal verification techniques to find problems, like uninitialized memory reads, before RTL simulation. The tool can check the source code without any simulation framework, such as test-benches, to provide designers with information about coding issues that might cause problems after synthesis and during RTL simulation. The Figure below shows the steps for using Design Checker.
The design checking flow consists of:

1. Optionally, choose which checks to run. By default, all checks run.
2. Run Design Checker on the design.
3. If there are no violations, proceed to run Catapult synthesis to generate the RTL.
4. If there are violations:

  • Interactively make code corrections
  • Optionally waive code
  • Optionally run counter-example test-benches that the tool generates to replicate violations
  • Repeat the flow

Waivers allow designers to alter checking results for specific areas of code. Using a separate file, designers can specify the file and line numbers to filter specific check violations out of the violation report. Design Checker can generate counter-example test-benches that contain stimulus sequences that trigger the violation. The team can use these to independently show that a violation does occur due to the associated issues in the source code.

The whitepaper discusses examples of design checking errors with solutions addressing them.
Two examples are listed below:

1. An incomplete switch or case statement is an error that can create unintended logic during high-level synthesis. This check looks at all possible values in the conditional code within switch and case statements and reports an error if all the values are not covered. These violations typically lead to the design entering an undefined state. During synthesis, the tool uses the specified case/switches as the only legal conditions, meaning that if the missing condition occurs in the design, the results are unpredictable.

2. It is possible to write C++ that does not synthesize to optimal hardware. To prevent this, the designer must understand the ramifications of writing code in a particular way in order to get the expected RTL results. To help with this, Mike Fingeroff at Mentor created the “High-Level Synthesis Blue Book” that explains how to code for hardware. An electronic copy of this book and all its examples are available in the install directories for the tool. Design Checker incorporates checks that support optimized coding, like those found in the book.

Catapult Design Checker is a unique tool within the Catapult High-Level Synthesis Platform that combines state of the art static analysis with patented formal analysis to find coding errors, code that can create unintended hardware, and code that creates sub-optimal hardware during synthesis. Design Checker is part of the complete high-level synthesis platform of tools that provides an ecosystem that enables C++/SystemC level verification signoff.

To learn more about the Catapult verification solution, view this website.