SemiWiki – Page 206 – The Open Forum for Semiconductor Professionals

March 13, 2023March 14, 2023

SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement

SPIE Advanced Lithography Conference 2023 – AMAT Sculpta® Announcement
by Scotten Jones on 03-13-2023 at 8:00 am
Categories: Semiconductor Services, TechInsights
3 Comments

Applied Materials Sculpta Presentation for Media Page 06

The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27^th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing Director and General Manager of the Advanced Products Group and discuss the new tool.

Introduction

The resolution of an exposure system is given by the Rayleigh Criteria:

R = k₁λ/NA

where k₁ is a process related factor, λ is the exposure wavelength and NA is the optical system numerical aperture.

The semiconductor industry is continually driving to smaller dimensions to enable greater transistor/bit density. With EUV delayed for many years, DUV was extended by a variety of techniques where multiple exposures were combined to create a higher resolution pattern than a single exposure could produce. Once EUV entered production multi patterning was in many cases replaced by a single EUV exposure.

From the Rayleigh Criteria the ultimate resolution for the current 0.33 NA EUV systems should be approximately 20nm but we are currently far from realizing that. ASML tests EUV system at the factory to 26nm on a flat wafer with a simple one-dimensional pattern but in production 30nm is the current practical limit and even then, there are circumstances where tight tip-to-tip requirements can require an extra cut or block mask. With a single EUV exposure tip-to-tip spacings are currently limited to approximately 25 to 30nm and a second EUV mask is required to get to a 15 to 20nm tip-to-tip. Next generation processes will require several EUV multi patterning layers. the Sculpta® tool is designed to address this situation.

Applied Materials Presentation

In their presentation Applied Materials describes two common cases where two EUV masks are used to create a pattern. The first is where dense interconnect lines are formed by an EUV mask and then a second EUV mask is used to cut or block the pattern to achieve tight tip-to-tip in the orthogonal direction. The second case is where one EUV mask is used to create an array of elongated contacts and then a second EUV mask is used to create a second array of contacts with tight tip-to-tip spacing relative to the first array. Elongated contacts are desirable for reduced sensitivity to placement errors versus lines.

In their presentation Applied Materials illustrates a simplified Litho-Etch Litho-Etch process flow that uses two EUV masks combined with two etches to create a pattern, see figure 1.

Figure 1. EUV Double Patterning Process Flow.

In figure 1, two litho-etch passes are illustrated. In each pass a deposition step deposits a film, the film is planarized, a lithography pattern is formed and measured, the pattern is etched into the film and then cleaned and measured again. Applied materials characterize each litho-etch pass as costing approximately $70.

I write for SemiWiki as a sideline to my “day job” building cost models for the semiconductor industry. A single EUV exposure cost about 2x the $70 cost listed for the entire litho-etch pass, the overall litho-etch pass cost is several times what Applied Materials is conservatively estimating as $70. Eliminating an EUV exposure with associate processing has a lot of value.

The Sculpta® tool is an etch tool built on the Applied material Centura® platform that uses an angled reactive ribbon beam to elongate a pattern in a hard mask. The two examples discussed were:

Form a grating of lines and spaces with a relatively wide tip-tip spacing then use the Sculpta® tool to shrink the tip-to-tip, see figure 2.
Form a dense array of round contact holes and then use the Sculpta® tool to elongate the contact holes, see figure 3.

In both cases a Litho-Etch – Litho-Etch process with two EUV exposures and associated processing is reduced to a single EUV Litho-Etch process followed by a Scultpa® tool shaping process.

Figure 2. Pattern Shaping of Interconnect Lines.

Figure 3. Pattern Shaping of Contacts.

Figure 4 illustrates the Sculpta® tool, it is a Centura® cluster tool with four ribbon beam etch chambers.

Figure 4. Centura® Sculpta® tool.

Applied Materials stated that the Sculpta® tools is the tool of records for multiple layers at a leading-edge logic customer and they included positive quotes from Intel and Samsung in their press release.

Analysis

The first thing to understand is the Sculpta® tool is addressing tip-to-tip and is not a general resolution enhancement solution. If you need resolution below 30nm today you would still be looking at EUV multi patterning, for example EUV based SADP. Sculpta® does not “fix” the fundamental 0.33 NA EUV limitations and does not eliminate the needs for High-NA EUV tools in the futures. It can however eliminate some EUV masks used to create tight tip-to-tip, this can help alleviate the EUV exposure system shortage and save on cost, process complexity and possibly environmental impact.

This brings up the question of cost savings. A standard 4 chamber cluster tool etcher should have a cost in the ten-million-dollar range. The Sculpta® tool may have specialized chambers that add cost but I would be surprised if it cost more than $15 million dollars (Applied Materials did not provide any guidance on this). For 2022 the average ASP for an EUV system from ASML is nearly $200 million dollars from ASML’s financial reports. Add to that deposition, etch, CMP, cleaning, inspection and metrology equipment and compares that to a Sculpta® tool, some inspection and metrology tools, and possibly a cleaning tool, and the capital cost saving should be substantial. The key question is what the throughput is for the Scupta® tool. I asked Applied Materials about this and was told it depends on the amount of shaping and the hard mask material being used (the pattern shaping is done to the hard mask before the pattern is etched into the final film). Due to the required precision I wouldn’t be surprised if the etch times are relatively long and therefore the tool throughput is relatively low, but it would have to be incredibly slow for the Sculpta® tool not to be a much less expensive option than an EUV Litho-Etch loop. The other questions would be what the practical process limits on the technique are in terms of where it can be applied. The fact that it has already been adopted for multiple layers at – at least at one major logic producer argue that it is a promising solution.

Conclusion

In conclusion I see this as a useful addition to the lithographer’s tool set. It is probably not revolutionary but will nicely augment the capability of EUV tools and could see wide adoption for leading edge logic and DRAM fabrication.

Also Read:

IEDM 2023 – 2D Materials – Intel and TSMC

IEDM 2022 – Imec 4 Track Cell

IEDM 2022 – TSMC 3nm

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson

Podcast EP147: CachQ’s Harnessing of Heterogeneous Compute with Clay Johnson
by Daniel Nenni on 03-10-2023 at 10:00 am

Dan is joined by Clay Johnson, CEO and co-founder of CacheQ Systems. Clay has more than 25 years of executive management experience across a broad spectrum of technologies including computing, security, semiconductors and EDA tools.

Dan discusses the CacheQ QCC development platform with Clay. This platform enables software developers to deploy and orchestrate applications using new compute architectures, such as multicore devices and heterogeneous distributed compute. The result is a significant increase in performance, reduced power and dramatically reduced development time.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

March 10, 2023September 22, 2023

Cadence Hosts ESD Alliance Seminar on New Export Regulations Affecting EDA and SIP March 28

Anyone interested in learning about general trade compliance concepts or how export control and sanction regulations affect the electronic systems design ecosystem will want to attend the upcoming ESD Alliance export seminar. It will be hosted by Ada Loo, chair of the ESD Alliance Export Committee and Cadence’s Group Director and Associate General Counsel and held March 28 at Cadence’s corporate headquarters,

The seminar will feature the Cadence Government and Trade Group, including Ada and William Duffy, Cadence’s Corporate Counsel. They will discuss why and how governments implement trade controls, what “exports” are and how they take place in different business contexts. The seminar will cover common due diligence methods, such as customer screening that U.S. companies use to incorporate regulatory compliance into their business processes. It will also highlight recent regulatory updates that address current issues such as U.S.-China trade relations and anticipated effects of those regulations on the U.S. semiconductor design ecosystem.

Attendees will get an overview of relevant regulators and regulations, including a high-level summary of the U.S. government’s publicly stated policy positions and how they influence the development of export controls that affect the EDA industry. The seminar will focus on the Export Administration Regulations (EAR) with a discussion on the International Trafficking in Arms Regulations (ITAR) and Office of Foreign Assets Control (OFAC) sanctions programs. It will look at what is and is not regulated under the EAR, what constitutes an “export,” “reexport,” “release,” and “transfer,” how tangible and intangible exports differ, and scenarios where exports can take place inadvertently.

General prohibitions and regulated activities under the EAR will be covered, as will the facts that compliance officers should almost always know or be willing to ask about any given transaction. Business implications that they must consider when evaluating transactions and instituting effective processes to backstop compliance will be addressed.

Another topic will be how business operations can and should be structured to accommodate export compliance regulations, including questions that compliance personnel should frequently ask themselves and business partners. The seminar will examine where export compliance considerations affect sales, operations, customer support and product development and evaluate effective compliance programs as described by the Bureau of Industry and Security (BIS) compliance guidelines. It will offer ways to identify red flags in customer behavior and how companies can protect themselves by asking the right questions, having the right contract clauses, and by asking for the right assurances from uncertain customers. The implications of falling short in compliance and how to investigate potential escapes internally and with outside counsel will be discussed.

The breakfast meeting will be held Tuesday, March 28, from 8:30am until 11:30am at Cadence’s corporate headquarters in San Jose.

Member tickets are $100 each and $125 per non-member. Member pricing is offered for individuals or companies that are active SEMI members. Visit the ESD Alliance website to register: www.esd-alliance.org

Please contact me if your company is interested in learning about the The ESD Alliance, a SEMI Technology Community, and the range of our programs. We represent members in the electronic system and semiconductor design ecosystem that addresses technical, marketing, economic and legislative issues affecting the entire industry. We act as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. I can be reached at bsmith@semi.org.

The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry.

Follow SEMI ESD Alliance:

www.esd-alliance.org

ESD Alliance Bridging the Frontier blog

Twitter: @ESDAlliance

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Also Read:

2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli

ESDA Reports Double-Digit Q3 2021 YOY Growth and EDA Finally Gets the Respect it Deserves

ESD Alliance Reports Double-Digit Growth – The Hits Just Keep Coming

March 9, 2023March 10, 2023

AAA Hypes Self-Driving Car Fears

AAA Hypes Self-Driving Car Fears
by Roger C. Lanctot on 03-09-2023 at 10:00 am
Categories: Automotive
3 Comments

The AAA (U.S. auto club) must have AGHD (attention-getting deficit disorder). The headline from the organization’s latest research is: “Fear of Self-Driving Cars is on the Rise.” That should straighten things out, right?

The survey was conducted across a representative sample of U.S. households, according to the reported methodology. This was an effective way to enhance the “fear factor” by not focusing the survey specifically on the drivers themselves or whether they own vehicles or intend to buy a vehicle soon. The “fear” that the AAA is targeting is presumably some sort of widespread anxiety among the general population.

Fear is an effective emotion to grab the attention of the press and consumers. There isn’t much else that turns our heads these days and all forms of media – broadcast, print, online – routinely turn to fear to increase ratings, viewers, and stimulate reactions: likes, shares, thumbs up.

Fear also has a deadening or muffling effect. It is overwhelming and obscuring. Fear means different things to different people and fear isn’t always the right word for how people really feel.

I just returned from the Mobile World Congress in Barcelona. Was I afraid of being pickpocketed or otherwise becoming a victim of some petty crime? Not really afraid. No. “Concerned” would be a better term or “aware” of my surroundings – as I would be in any urban environment. Those feelings would be slightly elevated due to Barcelona’s reputation. Definitely not “afraid.”

AAA could have performed a much more useful public service if it had surveyed specific consumer groups – which, of course, would have been more complicated and expensive. Car makers and the general public would probably appreciate an education as to how current car owners feel about self-driving cars or how likely car buying intenders feel.

Saying consumers, in general, are afraid of self-driving cars reminds me of an old Monty Python’s Flying Circus animation of “killer cars” terrorizing London. The cars in the animation eat pedestrians – it seemed funny at the time.

By hyping the fear factor, though, AAA is missing the bigger picture. A more accurate description of the state of consumer attitudes toward cars generally and self-driving in particular would reflect intense curiosity, some concern, and, in some circles, broad-based enthusiasm.

TechInsights has conducted this research and found skepticism on the decline and interest in self-driving technology on the rise. The latest study, conducted in 2022 by TechInsights, found that at least 20% of car owners in China would pay more for any automated driving or parking feature, a figure that falls to 10% in Western Europe and 15% in the U.S.

A third of customers in China would pay more for fully autonomous driving capabilities. This figure does not exceed 18% in the West. This is certainly not what one would describe as fear.

Chinese consumers are most interested in automated parking. U.S. and Western European customers are more likely to pay more for parking assistance, followed by fully autonomous driving.

Missing this more nuanced part of the story is the greatest failing of the AAA study. In fact, enthusiasm for and interest in self-driving is a major contributor to Tesla’s ability to not only sell hundreds of thousands of cars equipped with its Autopilot technology (which still requires driver engagement), but has also fueled widespread consumer willingness to pay as much as $15,000 for so-called Full Self-Driving technology which is being blamed and investigated for crashes and mocked for its limitations.

In essence, AAA appears to be trying to stimulate fear rather than simply measure it. That, ultimately, is the weakness of the AAA study. Instead of lighting a candle, AAA has turned on the high beams blinding news consumers to the realities of the evolving driver assistance landscape. Consumers are actually quite interested in cars enhanced with driver assistance technology. Don’t let the fear mongers at AAA fool you.

Also Read:

IoT in Distress at MWC 2023

Modern Automotive Electronics System Design Challenges and Solutions

Maintaining Vehicles of the Future Using Deep Data Analytics

ASIL B Certification on an Industry-Class Root of Trust IP

March 9, 2023April 17, 2023

Deep thinking on compute-in-memory in AI inference

Deep thinking on compute-in-memory in AI inference
by Don Dingee on 03-09-2023 at 6:00 am
Categories: AI, Expedera, IP

Neural network models are advancing rapidly and becoming more complex. Application developers using these new models need faster AI inference but typically can’t afford more power, space, or cooling. Researchers have put forth various strategies in efforts to wring out more performance from AI inference architectures, most notably placing parallelized execution and memory resources closer together. Compute-in-memory takes memory locality to the extreme by combining memory accesses and execution in a single operation – however, it comes with the risks and complexity of analog design and fabrication. Expedera’s new white paper examines compute-in-memory in AI inference and explores the tradeoffs versus its all-digital compute-near-memory solution optimizing all neural network processing elements.

Motivation for compute-in-memory technology

What’s the most expensive operation for a CPU? Moving data. It keeps operations from running and forms nasty bottlenecks if too much flows simultaneously. Manycore solutions like GPUs help multiplier performance but don’t eliminate the data movement penalties. Neither CPUs nor GPUs are efficient for AI inference, opening a door for the NPU (neural processing unit), seeking balance for efficient parallel execution with effective data access.

Instead of placing execution cores over here, a pile of memory over there, and a bus in between, one path to faster data access is locality – for which three basic strategies exist:

Compute-near-memory spreads smaller blocks of memory nearby blocks of execution units but not necessarily partitioned in a one-to-one relationship.
Compute-at-memory tightly couples an execution unit with its supporting memory, forming a co-processor unit that can be stepped and replicated for scale.
Compute-in-memory changes the memory structure by physically embedding a multiplier unit in a customized unit, so a memory read fetches a pre-multiplied result.

Saying compute-in-memory “changes the structure” may be understated. Both compute-near-memory and compute-at-memory use a conventional digital multiplier. Compute-in-memory relies on an incoming digital word triggering analog technology for multiplication and current summing. An analog-to-digital converter is required to get the result back to digital.

Conceptually, the neural network weight coefficients stay put in a compute-in-memory scheme and are always at hand for rapid multiplication with the data of interest. Cutting out data movements and streamlining operations trims AI inference time, and fewer transistors in action can mean lower power consumption. Those are good outcomes, right?

Throughput is only one factor for compute-in-memory in AI inference

Unsurprisingly, some tradeoffs arise. Some issues are inherent to the compute-in-memory structure, and some relate to the overall design and fabrication cycle.

A significant advantage of digital circuitry is noise immunity. Moving operations back into analog reintroduces noise factors and analog variation that limit realizable bit precision; researchers seem confident in 4-bit implementations. Lower AI inference precision raises demands on AI training, with more cycles required for reliable inference. Achieving higher precision, say int8, also introduces problems. The analog transistor array becomes much more complex, as does the analog-to-digital converter needed. Area and power consumption savings are offset, and the chance for bit errors rises as analog step width shrinks.

It’s certainly possible to size, interconnect, and optimize a compute-in-memory array for a particular inference model or group of similar complexity models. But, as we’ve discussed elsewhere, that removes flexibility, and the risk grows if a different model is needed. Other hits on flexibility are locking into specific, transistor-level modifications in a selected memory technology, and placement and routing constraints may appear at the system-on-chip level.

Moving into analog also means moving into a mixed-signal foundry process. Advanced nodes may be entirely off the table for some time. It also means analog expertise and tools are required, and it is difficult to scale layouts with analog circuitry.

Achieving better performance gains in all-digital NPU IP

Substantial engineering effort is often necessary to wring the last percentage points of performance out of an application unless conditions align perfectly where a bit more is possible. Use cases for compute-in-memory in AI inference will probably look like this:

Models with large numbers of weight coefficients, fully connected layers, and sparse activations
Int4 precisions where extended AI training is feasible and analog noise immunity is better
Scale compatible with mature mixed-signal process technology and wafer costs

Still, we’re not talking about something like a 4x performance gain with compute-in-memory compared to all-digital NPU IP. Remember that compute-in-memory is only one small part of a complete NPU solution, and performance improvements are available at other points around the core multiply operation. But are they worth the risks and costs of the analog environment?

Expedera’s value proposition is straightforward. Using high-efficiency all-digital NPU IP, combining scalable hardware with packet-based sequencing directed by compiler software, Expedera teams working with OEMs deliver better performance gains in a complete AI inference solution. As Expedera’s IP evolves and process technology advances, it gets faster, smaller, and more power efficient, and it can be customized for OEM requirements.

Compute-in-memory and Expedera NPU IP are independent of each other – both will exist in the market once compute-in-memory gains more adoption. There’s more to read about both approaches in the full Expedera white paper; simple registration gets a download.

Architectural Considerations for Compute-in-Memory in AI Inference

Also Read:

Deep thinking on compute-in-memory in AI inference

Area-optimized AI inference for cost-sensitive applications

Ultra-efficient heterogeneous SoCs for Level 5 self-driving

CEO Interview: Da Chuang of Expedera

March 8, 2023April 17, 2023

WEBINAR: Secure messaging in a post-quantum world

WEBINAR: Secure messaging in a post-quantum world
by Don Dingee on 03-08-2023 at 10:00 am
Categories: Events, PQShield, Quantum Computing, Security

Pairwise bandwidth cost in Signal secure messaging protocol

In a recent marketing campaign, WhatsApp (and by extension, its parent company Meta) mocks the ubiquitous but unsecure messaging vehicle, SMS, saying anyone can read plain texts and mobile users should use some means of secure messaging. Apps like WhatsApp, Messenger, iMessage, and WeChat have each attracted over 1 billion users with the promise of security. But what happens to secure messaging in a post-quantum world? Those numbers make messaging apps a lucrative target for quantum computer cracking.

PQShield cryptography researchers are teaming with other experts worldwide to get ahead of what could be a huge problem for mobile users. In a recently archived webinar, Thomas Prest of PQShield presents his case for applying post-quantum cryptography to secure messaging apps, and it’s a fascinating discussion. He summarizes the challenge this way:

We often see discussion around one of those dimensions, but this is the first time I’ve seen someone take on the bigger picture where a solution must address all three simultaneously. Let’s quickly dive into some key points in each of those three areas.

Messaging crypto has run into interoperability inertia

Interoperability is a prerequisite for messaging apps to work. It gets much more difficult when parties have no specific prior knowledge of each other. Underneath several popular messaging apps is the Signal secure messaging protocol, which has built inertia.

Fun fact #1: the method for securely exchanging cryptographic keys over a public channel dates back to a 1976 paper by Whit Diffie and Martin Hellman, which identified what is now broadly known as Diffie-Hellman key exchange.

Fun fact #2: Signal uses a more recent extension, the triple elliptic-curve Diffie-Hellman (3-DH) handshake, in conjunction with the Double Ratchet algorithm and 256-bit encryption primitives. Signal was first proposed in 2013, grew with several revisions, and was blessed secure by several independent efforts in 2016 and 2017.

Prest describes updating the handshake to PQ X3DH, replacing Diffie-Hellman 3-DH with a post-quantum hardened key encapsulation mechanism (KEM) plus ring signatures on top of the symmetric crypto primitives. Similarly, he wants a KEM-based PQ Double Ratchet update.

Pairwise messaging blows up data requirements

The exponential growth in network traffic between a large cloud of pairwise interconnected points is well understood. Latency gets gnarly when encryption layers on top of every connection, and device complexity must rise to keep pace.

Scalability means rethinking how much mobile data moves in supporting encryption. Prest advocates moving to one channel with a single shared secret key for the whole group, combined with one signature and one private encryption key to authenticate. Compressing ciphertexts then becomes possible, cutting network bandwidth costs.

Metadata is collected all over social networks

While the messages may be secure, sadly, the metadata isn’t. Recent revelations show US law enforcement agencies can strip metadata from monitored social network conversations in real-time. There’s also the server-in-the-middle consideration, with the question of whether a server can be trusted during a conversation and not give up details later.

“Hiding” a device from a server is a logical approach, but if done improperly, a messaging network falls prey to some problems. Encrypting all packages with a key can enable one user to upload garbage to an entire group. Encrypting everything except the signature allows linking a signature back to a sender. Prest illustrates a post-quantum solution where a signature keypair is derived from a key, and group members authenticate anonymously.

Facing the prospect of instant obsolescence

Why should the semiconductor community care about how secure messaging evolves? It’s an excellent example of a use case for post-quantum crypto IP. SoCs and devices in design now may become obsolete instantly at some point soon if they don’t incorporate post-quantum technology. There’s a risk that some algorithms and protocols are still in flux. PQShield is thinking through the landscape and how its IP helps designers stay updated.

This archived webinar on secure messaging in a post-quantum world is a 32-minute presentation, followed by a 13-minute Q&A session where researcher Shuichi Katsumata joins his co-author Prest to elaborate on concepts they published together. Viewers can see the event here; no registration is required.

PQShield WEBINAR: Secure messaging in a post-quantum world

Also Read:

NIST Standardizes PQShield Algorithms for International Post-Quantum Cryptography

Post-quantum cryptography steps on the field

CEO Interviews: Dr Ali El Kaafarani of PQShield

March 8, 2023December 27, 2023

DSP Innovation Promises to Boost Virtual RAN Efficiency

DSP Innovation Promises to Boost Virtual RAN Efficiency
by Bernard Murphy on 03-08-2023 at 6:00 am
Categories: 5G, Ceva, IP

5G is already real, though some of us are wondering why our phone connections aren’t faster. That perspective misses the real intent of 5G – to extend high throughput (and low latency) communication to a vast number and variety of edge devices beyond our phones. One notable application is Fixed Wireless Access (FWA), promising to replace fiber with wireless broadband for last mile connectivity. Consumers are already cutting their (phone) landlines; with FWA they may also be able to cut their cable connections. Businesses can take this further, installing FWA base stations around factories, offices, hospitals, etc., to support many more smart devices in the enterprise.

An essential business requirement to enable this level of scale-out is much more cost-effective wireless network infrastructure. Open Radio Access Network (Open RAN) and virtualized RAN (vRAN) are two complementary efforts to support this objective. Open RAN standardizes interfaces across the network, encouraging competition between network component suppliers. vRAN improves throughput within a component by more efficiently exploiting a fixed hardware resource for multiple independent channels. We know how to do this with standard multi-core processor platforms, through dispatching tasks to separate cores or through multi-threading. Important functions in the RAN now run on DSPs, which also support multi-core but not multi-threading. Is DSP innovation possible to overcome this drawback?

What’s the solution?

Existing RAN infrastructure components – specifically processors used in baseband and backhaul– support virtualization / multithreading and are well established for 4G and early 5G. Surely network operators should stick to tried-and-true solutions for Open RAN and vRAN?

Unfortunately, existing components are not going to work as well for the scale-out we need for full 5G. They are expensive, power hungry (hurting operating cost), competition in components is very limited, and these devices are not optimized for the signal processing aspects of the RAN. Operators and equipment makers have enthusiastically switched to DSP-based ASICs to overcome those issues, especially as they get closer to the radio interface and user equipment, where the RAN must offer massive MIMO support.

A better solution would be to continue to leverage the demonstrated advantages of DSP-based platforms, where appropriate, while innovating to manage increasing high-volume traffic more efficiently in a fixed DSP footprint.

Higher throughput, less DSPs

Multi-core DSP system are already available. But any one of those DSP cores is handling just one channel at a time. A more efficient solution would also allow for multi-threading within a core. Commonly, it is possible to split a core to handle two or more channels at one time, but this fixed threading is a static assignment. What limits more flexibility is the vector compute unit (VCU) in each DSP core. VCUs are major differentiators between DSPs and general-purpose CPUs, handling all the signal-intensive computation – beamforming, FFT, channel aggregation and much more – in the RAN processing path between infrastructure and edge devices. VCUs consume significant footprint in DSP cores, an important consideration in multi-core systems during times when software is executing scalar operations and the VCU must idle.

Utilization can be improved significantly through the dynamic vector threading architecture illustrated in the figure above. Within one DSP core, two scalar processors support 2 channels in parallel; this does not add significantly to the footprint. The VCU is common to both processors and provides vector compute functions and a vector register file for each channel. So far this looks like the static split solution described earlier. However, when only one channel needs vector computation at a given time, that calculation can span across both compute units and register files, doubling throughput for that channel. This is dynamic vector threading, allowing two channels to use vector resource in parallel when needed, or allowing one channel to process a double-wide vector with higher effective throughput when vector need on the other channel is inactive. Naturally the solution can be extended to more than two threads with obvious hardware extensions.

Bottom line, such a system can both process with multiple cores and dynamically multi-thread vector compute within each core. At absolute peak load the system will still deliver effective throughput. During more common sub-peak loads it will deliver higher throughput for a fixed number of cores than a traditional multi-core system. Network operators, businesses and consumers will be able to get more out of installed hardware for longer, before needing to upgrade.

Talk to CEVA

CEVA have been working for many years with the big names in infrastructure hardware, consumer and business edge products. They tell me they have been actively guided by those customers towards this vector multi-threading capability, suggesting dynamic vector threading is likely to debut in products within the next few years. You can learn more about CEVA’s XC-20 family architecture offering dynamic vector threading HERE.

March 7, 2023July 18, 2025

Multi-Die Systems Key to Next Wave of Systems Innovations

Multi-Die Systems Key to Next Wave of Systems Innovations
by Kalar Rajendiran on 03-07-2023 at 10:00 am
Categories: Chiplet, EDA, IP, Synopsys

Shift to Multi Die Systems is Happening Now

These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing yield issues. This obviously translated to an economic issue and highlighted the fact that Moore’s Law benefit which had stood the test of time for more than five decades had started to flatten. While this is certainly true, there are lot more benefits for moving to chiplets-based designs. This “More than Moore” aspect is what will drive the chiplets adoption even faster.

I recently had a conversation on this topic, with Shekhar Kapoor, senior product line director at Synopsys. Shekhar shared Synopsys’ view on what is behind the move to multi-die systems , the challenges to overcome and the solutions that are needed to successfully support this wave.

More Than Just The Yield Benefit

Multi-die systems can accelerate the scaling of system functionality and performance. They can help lower system power consumption while increasing throughput. By allowing re-use of proven designs/dies as part of a system implementation, they help reduce product risk and time-to-market. And, they help create new product variants rapidly and enable strategic development and management of a company’s product portfolio.

“SysMoore Era” Calls for Multi-Die Systems

Until recent years, Moore’s Law benefits delivered at the chip level translated well to satisfy the performance demands of systems. But as Moore’s Law benefits started to slow down, system performance demands have started to grow in leaps and bounds. Systems have been hitting the processing, memory and connectivity walls. Synopsys has coined the term “SysMoore Era” to refer to the future.

Take for example, the tremendous growth in artificial intelligence (AI) driven systems and advances in deep learning neural network models. The compute demand on systems have been growing at incredible rates every couple of years. As an extreme example, OpenAI’s ChatGPT application is powered by a Generative Pre-trained Transformer (GPT) model with 175 billion parameters. That is the current version (GPT3) and the next version (GPT4) is supposed to handle 100 trillion parameters. Just imagine the compute demand of such a system.

On average, the Transformer models have been growing in complexity by 750x over a two-year period and systems are hitting the processing wall. Domain Specific Architectures are being adopted to close the gap on performance demand. Multi-die systems are becoming essential to address the system demands of the “SysMoore Era.”

Multi-Die System Challenges

Heterogeneous die integration introduces a number of challenges. Die-to-die connectivity is at the heart of multi-die systems as different components need to properly communicate with each other. System pathfinding is a closely related challenge that involves determining the best data path between components in the system. Multi-die systems must be designed to also ensure that each component is supplied with adequate power and cooling, while also minimizing system level power consumption. Memory utilization and coherency are also important challenges as these systems must be designed to ensure efficient memory utilization and coherency across the different components. Software development and validation at the system level is yet another challenge as each component may have its own software stack. Design implementation has to be done for efficient die/package co-design with system signoff as the goal. And all this should be accomplished with cost-effective manufacturability and long-term reliability in mind.

Multi-Die System Solutions

Just as Design Technology Co-Optimization (DTCO) is very important in a monolithic SoC scenario, System Technology Co-Optimization (STCO) is imperative in a multi-die system scenario. To address multi-die system challenges, the solutions can be broadly categorized into the following areas of focus.

Architecture Exploration

A system level tool that allows early exploration and system partitioning for optimizing thermal, power and performance is imperative. Just as a chip-level platform architect tool was critical for a monolithic SoC scenario, so is a system-level platform architect tool for a multi-die system, if not more critical.

Software Development and Validation

High-capacity emulation and prototyping solutions are essential to support rapid software development and validation for the various components of a multi-die system.

Design Implementation

Access to robust and secure die-to-die IP and a unified exploration-to-signoff platform are key to an effective and efficient die/package co-design of the various components of a multi-die system.

Manufacturing & Reliability

Multi-die system hierarchical test, diagnostics and repair and holistic test capabilities are essential for manufacturability and long-term system reliability. Environmental, structural and functional monitoring are needed to enhance the operational metrics of a multi-die system. The solution comprises silicon IP, EDA software and analytics insights for the In-Design, In-Ramp, In-Production and In-Field phases of the product lifecycle.

Summary

As a leader in “Silicon to Software” solutions to enable system innovations, Synopsys offers a complete solution to design, manufacture and deploy multi-die systems. For solution-specific details, refer to their multi-die system page.

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March 7, 2023April 10, 2023

Calibre IC Manufacturing papers at SPIE 2023

Calibre IC Manufacturing papers at SPIE 2023
by Daniel Nenni on 03-07-2023 at 6:00 am
Categories: EDA, Events, Siemens EDA

The Siemens Calibre group was very busy last week at SPIE. Calling Calibre industry leading really is an understatement. Calibre is one of the reasons Moore’s Law has continued to this day. This tool is legendary. You can get more information on the Calibre landing page including product information, resource guide, blogs and much more:

Design with Calibre

The industry-leading Calibre toolsuite provides physical verification (DRC), circuit verification (LVS, PEX), and reliability verification (PERC), as well as Calibre DFM optimization, to ensure IC designs will deliver the power, performance, and foundry yield today’s markets demand. Across all process nodes and design styles, innovative functionality ensures the Calibre toolsuite provides accurate, efficient, comprehensive IC verification while minimizing resources and tapeout schedules.

SPIE Advanced Lithography + Patterning

SPIE is the international society for optics and photonics. We bring engineers, scientists, students, and business professionals together to advance light-based science and technology.

In case you missed SPIE or you missed some of the Calibre papers here they are. If you would like us to dig deeper on any one of them let me know, fascinating stuff, absolutely:

Join Calibre IC Manufacturing at SPIE Advanced Lithography 2023, Feb 26 – March 3, 2023, at the San Jose Convention Center. Siemens will be presenting 16 papers. (All presentations listed in Pacific Time.)

27 February 2023

27 February 2023 • 10:50 AM – 11:10 AM
Structured assist features in inverse lithography
Paper 12495-2

27 February 2023 • 4:20 PM – 4:40 PM
Resolution enhancement techniques @0.55 NA EUV applied for 6th generation of 10nm DRAM Joint paper of IMEC and Siemens EDA
Paper 12495-9

28 February 2023

28 February 2023 • 1:40 PM – 2:10 PM
Extending design technology co-optimization from technology launch to HVM (Keynote Presentation)
Paper 12495-14

28 February 2023 • 3:40 PM – 4:10 PM
EUV Full-chip curvilinear mask options for logic via and metal patterning (Invited Paper)
Paper 12495-18

1 March 2023

1 March 2023 • 10:30 AM – 10:50 AM
Stochastic aware EUV OPC on random logic via Joint paper of IMEC and Siemens EDA
Paper 12494-26

1 March 2023 • 10:50 AM – 11:10 AM
A ML based OPC model pattern down-selection method with mask and wafer contours
Paper 12499-17

1 March 2023 • 1:20 PM – 1:40 PM
IC layouts patterns topological profiling using directional geometrical kernels Joint paper of Ain Shams University and Siemens EDA
Paper 12495-29

1 March 2023 • 5:30 PM – 7:00 PM
CPU time prediction using machine learning for post-tapeout flow runs (PTOF)
Paper 12495-64

1 March 2023 • 5:30 PM – 7:00 PM
Design-aware virtual metrology and process recipe recommendation Joint paper of GlobalFoundries and Siemens EDA
Paper 12495-75

1 March 2023 • 5:30 PM – 7:00 PM
Impact of mask rule constraints on ideal SRAF placement
Paper 12494-54

1 March 2023 • 5:30 PM – 7:00 PM
EUV SRAFs printing modeling and verification in 2D hole array Joint paper of IMEC and Siemens EDA
Paper 12494-61

1 March 2023 • 5:30 PM – 7:00 PM
Design rule manual and DRC code qualification flows empowered by high coverage synthetic layouts generation Joint paper of SAMSUNG Electronics and Siemens EDA
Paper 12495-72

1 March 2023 • 5:30 PM – 7:00 PM
Application of Gaussian Random Field EUV stochastic model to quantification of stochastic variability of EUV vias Joint paper of IMEC and Siemens EDA
Paper 12494-67

1 March 2023 • 5:30 PM – 7:00 PM
AI-guided reliability diagnosis for 5,7nm automotive process Joint paper of SAMSUNG Electronics and Siemens EDA
Paper 12496-142

1 March 2023 • 5:30 PM – 7:00 PM
Hybrid deep learning OPC framework with generative adversarial network Joint paper of Institute of Microelectronics, Beijing Superstring Academy of Memory Technology, and Siemens EDA
Paper 12495-69

2 March 2023

2 March 2023 • 8:00 AM – 8:30 AM
Novel approach to solving systematic pattern yield limiters with volume scan diagnosis (Invited Paper) Joint paper of PDF Solutions and Siemens EDA
Paper 12495-39

2 March 2023 • 11:00 AM – 11:20 AM
Unsupervised ML classification driven process model coverage check Joint paper of SAMSUNG Electronics and Siemens EDA
Paper 12495-44

Also Read:

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Interconnect Choices for 2.5D and 3D IC Designs

The State of IC and ASIC Functional Verification

March 6, 2023March 26, 2023

Report from SPIE- EUV’s next 15 years- AMAT “Sculpta” braggadocio rollout

Report from SPIE- EUV’s next 15 years- AMAT “Sculpta” braggadocio rollout
by Robert Maire on 03-06-2023 at 10:00 am
Categories: Semiconductor Advisors, Semiconductor Services

-We attended the SPIE lithography Conference in San Jose
-No significant news or announcements on EUV
-Focus on 500WPM target and High & Hyper NA rollout
-AMAT overblown Sculpta-Not exactly what its cracked up to be

SPIE Lithography 2023

We have been attending SPIE for many years now and are happy to see a return to pre Covid levels with more people traveling from Asia than we had seen in a while.

However we did not see as many presentations from TSMC as there had been in past years when their presentations made headlines and riled he EUV community with their market leading news about EUV.

The conference continues to be a broad discussion of the entire lithography infrastructure which obviously revolves around EUV. Relatively few discussions about power and progress as EUV is obviously very commonplace and widely accepted. Delivery times and availability are the most common questions.

Martin Van Den Brink great presentation- the conference highlight

We thought the highlight of the conference was the keynote, opening presentation, by Martin van den Brink the long time CTO of ASML and life force behind EUV.

We had met him many years ago, in 1995, when we worked on ASML’s IPO when ASML was a distant third behind the powerhouses of Nikon and Canon. It is a prime example of persistence.

Martin spoke of the past 15 years and the next 15 years of EUV and where we are going and what ASML’s targets are.

Although there is a huge amount of work to be done to get to high NA EUV it is not nearly the same effort required as the original rollout of EUV. In his presentation he showed that there is significant reuse of existing EUV technology such that high NA will be more evolutionary than revolutionary. Obviously, some key components, such as lenses will be completely new but there is more engineering to be done and less pioneering.

He also spoke about a 1000 watt target power which seems so much more attainable now than previous power improvements. He made a few self effacing jokes about his prior power timeline estimates which were slightly off (which we well remember) and drew some laughs from the audience.

Part of the reason to get to 1000 watts is to get to 500 wafers per hour and importantly not just in EUV but DUV as well. ASML clearly understands the concern about price/productivity which is especially focused on high priced litho tools.

The productivity focus on DUV is well deserved in our view as it remains the workhorse of litho.

Productivity is the key element in ASML’s pricing strategy. Improved throughput is the value justification for higher pricing. ASML has long used this sort of “value” based pricing and the way to support increased pricing is to increase wafers per hour.

We could joke that a one wafer per hour increase in productivity equates to a million dollars in additional pricing and we may not be that far off….

The rest of Martin’s presentation was a firehose of excellent information and facts and figures which went by too fast to fully sink in….but worth a slower replay.

One of the key data points was 100KW (100 thousand watts) of power required per wafer processed through litho tools. This is an astounding number and its not just the laser power its also the power to accelerate and decelerate huge blocks of granite stages ever faster, at blinding speeds, as throughput increases.

We have pointed to power requirements of fabs before as an increasing issue. This is why Samsung is building its own power generation in Texas as it can’t use the unreliable grid there. Another interesting factoid, not mentioned by Martin, is that TSMC consumes roughly 10% of the entire island of Taiwan’s power grid for its fabs!

The keynote is well worth a replay or two……

AMAT’s “Sculpta”- Mea Culpa of braggadicio

Applied Materials did a lot of “stretching reality” in its rollout of its new Sculpta tool at SPIE.

First off, calling it “pattern shaping” is a bit of a stretch as we could just as easily call all existing etch and deposition “pattern shaping” as they both shape existing patterns by adding or subtracting materials.

It would be much more accurate and truthful to call it “selective etch” which is what it really is but perhaps AMAT thought it a bit too pedestrian and want to get in on the “litho luster” that they are missing.

The Sculpta selective etch is basically sidewall etch that removes material from a specific side of a feature to shorten it.

Selective etch is also neither new nor unique as suggested in the rollout. The technology described is quite similar to Tokyo Electron’s GCIB (gas cluster ion beam) technology from their Epion division thats has been around for many, many years whose key product is “Ultratrimmer” which does the same thing as AMATs Scuplta , that is “trimming” of features. The main difference we can see is directing the trim at an angle to hit the sidewall of a feature. There are also other ion beam type etch and deposition systems in the world.

To also suggest that Scuplta is a replacement for double patterning EUV is also a stretch as it only serves as a replacement in certain circumstances and far from all. So to suggest this will have some sort of significant impact, like eliminating double patterning, or EUV usage is also a long stretch.

This is just another etch tool in the arsenal of many different etch tools, it is NOT a patterning tool. It is not as enabling as Lam’s high aspect ratio etcher which enables stacked NAND. It is an alternate, apparently cheaper, way of producing features which are already produced today by a more complex method. It is certainly not an EUV replacement, just another etcher that etches what EUV prints.

It will take significant time for the industry to adopt it, if they do, so we don’t see any near term impact on valuation.

The general sense I got from talking to many participants at SPIE was “why are they announcing at etch tool at SPIE?”. Others just yawned. Not exactly a “breakthrough in patterning technology”, just more marketing hyperbole.

Announcing a truly competitive new reticle inspection tool or dry resist tool would have been much more appropriate at SPIE

The stocks

The negative reaction on ASML’s stock was an overreaction to overblown marketing hype.

Applied is trying to steal the thunder of a growing, strong and not slowing litho market dominated by ASML instead of being part of the currently shrinking deposition and etch markets that AMAT is in. By relabeling a selective etch tool as a “patterning” tool there is hope to get some of the litho luster they lack.

But being just another etch tool doesn’t help the stock as much. We don’t see significant near term impact on anyone from SPIE and certainly not Applied.

We still remain very cautious on the group as the semiconductor market remains oversupplied and we have yet to see a real bottom. Those who suggest we have seen a bottom have instead seen a mirage.

We continue to look for real signs of a turn especially in the still falling memory market.

About Semiconductor Advisors LLC
Semiconductor Advisors is an RIA (a Registered Investment Advisor),
specializing in technology companies with particular emphasis on semiconductor and semiconductor equipment companies. We have been covering the space longer and been involved with more transactions than any other financial professional in the space. We provide research, consulting and advisory services on strategic and financial matters to both industry participants as well as investors. We offer expert, intelligent, balanced research and advice. Our opinions are very direct and honest and offer an unbiased view as compared to other sources.

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