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2023: Welcome to the Danger Zone

2023: Welcome to the Danger Zone
by Daniel Nenni on 11-18-2022 at 6:00 am

Silicon Catalyst Danger Zone Ad

I just got this notice from my good friend and fellow sailor Rich Curtin. The Silicon Catalyst events are the best open networking events in Silicon Valley, absolutely. And this one includes another good friend Wally Rhines, the most interesting man in semiconductors, so you don’t want to miss this. The live event will definitely fill up but there will be a follow-on virtual event so register now.

Silicon Catalyst is pleased to continue our collaboration with Silicon Valley Bank in hosting our 5th Annual Semiconductor Industry Forum, returning to an in-person event on December 6 at their auditorium in Santa Clara.

The Silicon Catalyst Semiconductor Industry Forum was launched in 2018, hosted at the TSMC Silicon Valley headquarters. The Forum’s charter is to enable a town-hall like event to discuss the broad impact of semiconductors on our world, beyond the traditional focus on technology and financial reviews and forecasts.

The topics discussed during that inaugural 2018 event covered the cost of fabs, IoT business opportunities, memory technology and foreshadowed the gathering storm clouds about the potential impact of China’s activities in the semiconductor sector. Clearly, the key take-away was that the semiconductor industry was on the verge of major structural changes.

Looking back now as we close out 2022, wow, was that an understatement!

For a re-cap of the 2018 Forum, check out the IEEE Spectrum coverage at https://spectrum.ieee.org/semiconductor-industry-veterans-see-the-old-order-crumbling.

Zoom recordings of Forum 3 2020 and Forum 4 2021 are available for replay from our website.

Forum 5 – “2023: Welcome to the Danger Zone”

The coming year is shaping up as the perfect storm for our industry, as we look to adapt to the unprecedented challenges to be addressed across our businesses, along with our personal and national security. We’ve arranged a stellar panel of speakers, moderated by Don Clark, contributing journalist for the NY Times for our Forum 5 event.

Silicon Catalyst CEO, Pete Rodriguez, will kick things off with an insider’s view of his participation on the PCAST Semiconductor Working Group and the creation of the report to the President. For background information about the PCAST Group, I encourage you to read the details at:

https://www.whitehouse.gov/wp-content/uploads/2022/08/POTUS-letter_PCAST-Semiconductors_09AUG2022.pdf

https://www.whitehouse.gov/wp-content/uploads/2022/09/PCAST_Semiconductors-Report_Sep2022.pdf

https://www.nist.gov/chips/national-semiconductor-technology-center-update-community

The Forum 5 panel will discuss potential strategies and tactics to help us navigate through the danger zone and includes:

Navin Chaddha – Managing Director, Mayfield Fund

Navin is Managing Director at Mayfield. He has been named a Young Global Leader by the World Economic Forum and has ranked on the Forbes Midas List of Top 100 Tech Investors fourteen times, including being named in the Top Five in 2020 and 2022. His investments have created over $120 billion in equity value and over 40,000 jobs. During his venture capital career, Navin has invested in over 60 companies, of which 18 have gone public and 25 have been acquired. He believes the Renaissance of Silicon will create industry giants and has invested in semiconductor companies including Nuvia, Fungible, Alif Semiconductor, Frore Systems, and several others in stealth. As an entrepreneur, Navin has co-founded or led three startups, of which one went public and 2 were acquired. Navin holds an MS degree in electrical engineering from Stanford University and a B.Tech. degree in electrical engineering from IIT Delhi, where he was honored with a distinguished IIT Alumni Award.

Dr. Wally Rhines, President & CEO of Cornami;  GSA 2021 Morris Chang Exemplary Leadership award recipient

Dr. Rhines is President and CEO of Cornami, Inc., a fabless software/semiconductor company focused on intelligent computing for fully homomorphic encryption and machine learning. He was previously CEO of Mentor Graphics for 25 years and Chairman of the Board for 17 years. During his tenure at Mentor, revenue nearly quadrupled and market value of the company increased 10X. Prior to joining Mentor Graphics, Dr. Rhines was Executive Vice President, Semiconductor Group, responsible for TI’s worldwide semiconductor business. Dr. Rhines has served on the boards of Cirrus Logic, QORVO, TriQuint Semiconductor, Global Logic, PTK Corp. and as Chairman of the Electronic Design Automation Consortium (five two-year terms). He is a Lifetime Fellow of the IEEE. Additionally, his experience includes four years on the board of SEMATECH, three years on the board of SEMI-SEMATECH and twenty years on the board of SRC (Semiconductor Research Corporation). Dr. Rhines holds a Bachelor of Science degree in engineering from the University of Michigan, a Master of Science and PhD in materials science and engineering from Stanford University, an MBA from Southern Methodist University and Honorary Doctor of Technology degrees from the University of Florida and Nottingham Trent University.

Maryam Rofougaran – CEO and Founder, Movandi

Maryam Rofougaran is founder and CEO of Movandi, a leader in new 5G RF and millimeter wave technology that is commercializing multi-gigabit, 5G millimeter wave networks. Movandi is breaking through coverage and network challenges of 5G millimeter wave networks. Their BeamXR active repeater and system solutions solves today’s real world 5G deployment challenges – by increasing 5G coverage and capacity, while reducing infrastructure costs by 50%, accelerating large-scale 5G commercialization. Prior to co-founding Movandi, Maryam was the Sr Vice president of Radio Engineering at Broadcom and was instrumental in starting and building the wireless business at Broadcom and in growing it to annual revenues of more than $3 billion. She is an Inventor and co-inventor on 300 U.S. issued patents, 85 U.S. filed patents and is co-author to many publications. Her first startup, Innovent Systems was acquired by Broadcom Corporation and was the entrance of Broadcom in wireless business.

All Forum 5 registrants will be able to summit questions to the panelists in advance, for potential discussion during the Q&A portions of Forum 5.

Registration details can be found at:

https://www.eventbrite.com/e/5th-semi-industry-forum-2023-welcome-to-the-danger-zone-tickets-453034838397

Also Read:

Silicon Catalyst Angels Turns Three – The Remarkable Backstory of This Semiconductor Focused Investment Group

Silicon Catalyst Fuels Worldwide Semiconductor Innovation

Silicon Catalyst Hosts an All-Star Panel December 8th to Discuss What Happens Next?


Ask Not How FPGA Prototyping Differs From Emulation – Ask How FPGA Prototyping and Emulation Can Benefit You

Ask Not How FPGA Prototyping Differs From Emulation – Ask How FPGA Prototyping and Emulation Can Benefit You
by Daniel Nenni on 11-17-2022 at 10:00 am

Figure 1 Proto vs. Emu Dan 161122

The differences between commercial FPGA Prototyping (“Prototyping”) and Emulation have been well documented by the purveyors of commercial Prototyping and Emulation solutions, and the technical media.  What has received less coverage is how Prototyping benefits differ from Emulation benefits.  Both are intended to reduce the time and resources required to achieve comprehensive verification of chip-based electronic systems – both run much faster than software simulation for verification, in a modeled context of the end-product executing software, with high internal design-node visibility during operation.

Both are forms of hardware-accelerated simulation that originated, in part, out of Intel’s desperate attempt in the mid-1980’s to cope with the skyrocketing engineering resource requirements projected for future processor chip design complexity.  Both deliver their greatest value when they are used to enable early hardware/software co-development that shifts-left development schedules by months vs. sequential hardware/software development.  In fact, it was the risk of being late to market that motivated many early product developers to invest millions of dollars in Emulation to manage the time-to-market risks.  At the time, it was proposed that a chip-based product with an expected lifetime revenue of say $50M, and a product lifetime of say 3 years, would suffer $8M of lost revenue if market entry was delayed by 2 months – and an equation was proposed for modeling the lost revenue.

Figure 1: Lost Revenue Due to Delayed Time-To-Market

Prototyping vs. Emulation Spider Chart

One way to visualize the difference between Prototyping and Emulation is with a “spider chart” (named for its resemblance to a spider’s web).  The Prototyping vs. Emulation spider chart below highlights the differences between these two verification methods, which may be distilled down to runtime speed, design capacity, and affordability – all other differences, sometimes not insignificant, are “artifacts” of these three fundamental differences.  Compilation speed is a function of design capacity – the larger the design the longer the compilation time.  Any verification platform can be connected in-circuit to a hardware target-system with the appropriate interface speed-buffers, but the verification runtime speed is limited by the verification platform – Emulation runtime speed is much faster than software simulation, and achievable Prototyping runtime speeds are much higher than achievable Emulation runtime speeds.

Likewise, any verification platform can be used for software debug for periods of software execution – and the higher runtime speeds of Prototyping enable much longer periods of software execution, therefor are capable of more comprehensive software debug sessions which are usually sufficient for earlier software development.  And debug visibility could include every internal design node in a Prototype or an Emulator – but each design node debug probe requires another internal interconnect wire connection in FPGA-based Prototyping and Emulation implementations, which impacts design capacity and runtime speed.

Finally, reusability is a function of how unique the Prototyping or Emulation platform needs to be to achieve the desired verification design capacity, runtime speed, and in-circuit operation goals – the more “bespoke” the platform is to fit the specific verification requirements, the less reusable the platform will be.  The underlying Prototyping or Emulation hardware itself is highly reusable, but the design compilations, internal IP block adaptations, and target-system “external” connections will have limited reusability for the next design and design context – unless the next design is a close derivation of the previous design where much of the verification platform does not need to change and can be reused.

Figure 2: FPGA Prototyping vs. Emulation

You’ve Come a Long Way Baby

Early commercial Emulators (circa 1990’s) were not even as capable as today’s commercial Prototyping solutions, and what was referred to as “prototyping” in those days was still the domain of adventurous do-it-yourself FPGA-jockeys.  Today’s Emulators have evolved to buttoned-up, “big-iron” solutions that appear to be special-purpose simulation hardware-accelerators, implemented with commercial FPGAs or custom silicon, that have traded performance for improved deployment time/effort.  Today’s Emulators also come with restrictive methodologies tailored to specific Emulation hardware implementations that enable design deployment to be more automatic, more predictable, with high design internal-node visibility – and for this automation and more predictable deployment, users are willing to sacrifice “some” runtime speed.

Modern Emulators tend to focus on providing highly automated and versatile verification – support for multiple programming languages, high design under test (“DUT”) model capacity (1 billion gate equivalent, and more), high levels of bring-up automation (a few weeks) that minimizes manual intervention, support for multiple verification modes such as transaction-based acceleration (“TBA”), in-circuit emulation (“ICE”), and Quick Emulator (“QEMU”) mode, targeting multiple usage scenarios for system-level functional verification of chip and IP designs and embedded software verification.

Prototyping, on the other hand, is more affordable, and is capable of much faster runtime speeds than Emulation – so Prototyping may be a better choice than Emulation for certain verification environments.  If a “personal verification platform” is preferred – desktop design tools, geographically dispersed development sites, etc. – the affordability of Prototyping makes it practical for each developer to have a personal verification platform.  Prototyping also enables developers to ship a verification platform to customers prior to the availability of the silicon under development.

Rapid advances in single-package FPGA logic capacity (usable gate density) and performance have encouraged more chip developers to consider Prototyping as an essential part of their verification strategy, especially if the entire design can be made to “fit” into a single FPGA.  Today’s leading-edge FPGAs (Xilinx Virtex UltraScale+ VU19P, and Intel Stratix GX 10M) have usable logic capacities of up to about 50 million equivalent ASIC gates per FPGA.

Figure 3: Intel Stratix GX 10M (10.2M Logic Elements) and Xilinx VU19P FPGAs (3.8M System Logic Cells)

If the entire design to be Prototyped can be fit into a single FPGA, many of the Prototype deployment challenges, and the runtime speed limitations of inter-FPGA interconnect, can be avoided.  Once the design spills over into multiple FPGAs, the design must be partitioned into blocks for each FPGA, the multi-FPGA timing must be assured, and the inter-FPGA signals must be connected with high-performance cables between the FPGAs.  Unfortunately, the I/O pin counts of the leading commercial FPGAs have not increased as fast as the FPGA logic capacities – I/O pin counts are still limited to a couple thousand inter-connections, and multi-million gate logic partitioned blocks often require 10’s of thousands of block-block inter-connections.  Fortunately, requirements for more inter-FPGA interconnect is not insurmountable for Prototyping projects because of the availability of leading-edge pin-multiplexing automation that can be applied to create “virtual” FPGA I/O inter-connection pins, but this solution comes at a cost of lower runtime speeds.

So, How Can Prototyping and Emulation Benefit You?

To summarize, FPGA Prototyping today is generally more affordable than Emulation, it can achieve much higher runtime speeds, and design capacity has been greatly expanded by today’s leading-edge FPGA technology.  Emulation, on the other hand comes with a higher cost of ownership, higher automation of deployment, and provides more simulation-like verification for design debug.  In fact, if you can afford both Prototyping and Emulation, debug with Prototyping is usually limited to identifying and isolating design hardware/software problems over long periods of design operation which are then reproduced in Emulation for detailed debug.  It is recommended that you be clear at project outset about your verification goals (what is sufficient to approve sign-off, etc.?), your verification priorities (e.g. runtime speed vs. design visibility vs. deployment time, etc.), the skill-set of your design team with respect to getting the best value from Prototyping and/or Emulation platforms, a quick ROI calculation for your verification tool investment – and then budget accordingly.  Only then should you proceed with a choice and deployment of FPGA Prototyping and/or Emulation.

S2C Can Help

S2C is a leading global supplier of FPGA prototyping solutions for today’s innovative SoC and ASIC designs, now with the second largest share of the global prototyping market. S2C has been successfully delivering rapid SoC prototyping solutions since 2003. With over 500 customers, including 6 of the world’s top 15 semiconductor companies, our world-class engineering team and customer-centric sales team are experts at addressing our customer’s SoC and ASIC verification needs. S2C has offices and sales representatives in the US, Europe, mainland China, Hong Kong, Korea and Japan. Visit S2C’s website at s2ceda.com for more details.

Also Read:

A faster prototyping device-under-test connection

Stand-Out Veteran Provider of FPGA Prototyping Solutions at #59DAC

Multi-FPGA Prototyping Software – Never Enough of a Good Thing


It’s Always About the Yield

It’s Always About the Yield
by Kalar Rajendiran on 11-17-2022 at 6:00 am

yieldHUB Box Plot

Whether it is the stock market or the semiconductor market, the name of the game is yield. In semiconductors, yield has to do with minimizing scrap costs in all phases of manufacturing. This means squeezing as many good dies from a wafer as well as maximizing the number of good assembled/packaged chips that pass system level testing. Naturally, the field of semiconductor yield management is a well-established space with a number of solutions offered by various vendors. One such vendor, solely focused on yield management and enhancement is yieldHUB. It is one thing for a vendor to tout their wares but when customers tout a vendor’s platform, it raises more attention.

A couple of customers recently shared with yieldHUB, detailed feedback about their experience with yieldHub’s platform. One of them is Infineon, a multi-national semiconductor technology company that develops products for commercial, industrial, automotive, aerospace and defense applications. Their products include high-performance memories, micro-controllers, energy efficient and intelligent power modules, sensors, charging devices, lighting, audio, connectivity and hardware-based security devices. The other customer is Clas-SiC Wafer Fab Ltd, the first open foundry to develop and prototype silicon carbide (SiC) diode and MOSFET devices. The use cases from these two customers is bound to face as many of the yield management challenges there are.

Infineon’s Feedback:

Charbel Abi Samra Product Engineering Manager at Infineon and a long-time yieldHUB user provides the following feedback.

yieldHUB as an all-in-one platform eliminates the need for use of various point tools to get the same results. With yieldHUB, problems can be quickly identified and solved by searching its database and analyzing in just a few clicks. The earlier solution that Infineon used to use for yield management wasn’t efficient. Engineers had to jump back and forth between the query program, analysis program and data management in-between. As an example, on a customer request to tighten a limit, the analysis was done in less than 2 minutes with yieldHUB. Using the earlier solution, it would have taken two hours to locate the data and plot it.

yieldHUB’s custom reporting tools allow Infineon to reduce customer returns and field failures. Another yieldHUB tool increases our customers’ satisfaction levels by simplifying the test data sent to them in a consolidated fashion as one file. Another valuable feature in yieldHUB that product engineers will greatly appreciate is creating box plots and grouping multiple lots together. This feature allows the engineers to review the product’s history and the failure pareto.

Clas-SiC Wafer Fab Ltd’s Feedback:

Clas-SiC Wafer Fab Ltd manufactures SiC wafers through Junction Barrier Schottky (JBS) diode [also known as Merged PN Schottky (MPS) diode] and MOSFET process flows. The amount of data that needs to be analyzed to make sure everything is functioning properly is more than Excel can handle time efficiently. We needed a yield management platform to enable us to meet our customers’ functional requirements as well as turnaround time requirements. Clas-SiC needed a solution that provides for a quick graphical representation of the analytical results in a format easy to convey to our customers.

yieldHUB onboarding is very fast and straightforward. According to Graeme Morland, Clas-SiC Manufacturing Excellence Engineering and Quality Manager, Clas-SiC was online the very next day after yieldHUB was installed. Rae Hyndman, Clas-SiC Managing Director says the speed at which yieldHUB’s wafer yield analysis software integrated with Clas-SiC’s test system’s results was remarkable.

What used to take a couple of hours of an engineer’s time now takes just a couple of minutes when using yieldHUB. The yieldHUB platform has certainly fast tracked things for Clas-SiC. While it usually takes four to eight weeks to make a customer’s product, yieldHUB has helped get the information to the end-customers faster on several occasions.

Summary

yieldHUB makes the task of yield management, data analysis and reporting easier, effective and efficient. Anyone tasked with the responsibility of ensuring product performance and yields of semiconductor products could benefit from using the yieldHUB platform.

To gain more insight into yieldHub’s products and services, visit yieldHub website.

Also Read:

The Six Signs That You Need a Yield Management System

yieldHUB – Helping Semiconductor Companies be More Competitive

yieldHUB – A Yield Management Checklist for Startups and a New Look


Podcast EP122: IMEC’s Unique Imaging Technology for Medical Apllications

Podcast EP122: IMEC’s Unique Imaging Technology for Medical Apllications
by Daniel Nenni on 11-16-2022 at 10:00 am

Dan is joined by Dr. Xavier Rottenberg, who has been at IMEC Leuven since 2000, where he contributes to research in the field of RF, RF-MEMS, photonics and microsystems modelling integration.

Dan explores some of the unique imaging technology being developed at IMEC. Manufacturing methods to implement large sensors cost effectively are explored, as well as a varied set of applications for these sensor arrays.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


Configurable Processors. The Why and How

Configurable Processors. The Why and How
by Bernard Murphy on 11-16-2022 at 6:00 am

ARC Configurability min

Configurable processors are hot now, in no small part thanks to RISC-V. Which is an ISA rather than a processor, but let’s not quibble. Arm followed with configurability in Cortex-X. Both were considerably preceded (a couple of decades) by Synopsys ARC® RISC CPUs and CEVA DSPs. Each stressed configurability as a differentiator over other embedded processors and have enjoyed continued success in leading with that capability. A few months ago, Synopsys hosted a useful backgrounder on the Why and How of configurability, centered naturally around ARC processors.

Why Configure?

There are multiple drivers. Earbuds and more generally wearables need to be ultra-low power with processing maximally optimized down to or below the instruction level. In the cloud and network infrastructure, compute is becoming disaggregated to reduce latencies and power. Also demanding optimization to deliver to those goals. In datacenters, servers now offload initial database searches to smart SSDs, for search and wear prediction. Open RAN networks distribute intelligence and storage across the network to be fast and responsive yet must be super cost effective.

Support for car to infrastructure (V2X) communication is a fascinating example worth a little more backstory. The US Secure Credential Management System (SCMS) is a leading candidate for V2X certification and builds on a public/private key technique called unified butterfly keys. This allows a second party to generate a sequence of public keys for which only the originator knows the private keys. Unsurprisingly, this system heavily stresses performance. There are loop operations in the process which would prevent meeting those goals using conventional software algorithms running on a processor. These performance-critical sections must be accelerated in some manner.

Extending the Processor ISA

Part of the reason these loops are slow is the overhead in the CPU pipeline for each instruction. Fetch, decode, dispatch, speculation, execute, write-back. If an instruction sequence is compressible into one or a few instructions, that can save significant time by minimizing this overhead. There can also be other advantages such as special processing for very long word arithmetic.

The Synopsys ARC APEX technology enables adding custom instructions to meet this need. A developer builds (through APEX) Verilog for those instructions. This can connect to standard processor resources like condition codes, registers, and signals. APEX will insert the Verilog in the ARC core, essentially parallel to the ALU. When an instruction decodes to this special operation, it will be directed to the custom logic rather than the ALU. Otherwise, the rest of the CPU and compiler flows work the same. An easy way to fold custom instructions natively into the core.

I should add that Synopsys provides other options for optimization: configurability in the core processor and parallelism through muti-core implementations. Also support for closely coupled customer accelerators which can connect directly to shared cache and share memory.

Is it Worth the Effort?

Rich Collins (Director of Product Marketing) highlighted one example in the talk: an optimization for a red-black tree algorithm (balancing trees) for a storage application. Here, designers were able to reduce execution time (and correspondingly power) by 50% with little added area. I don’t have numbers for the SCMS design (referenced earlier in this article); these are too difficult to disentangle from their algorithm improvements. Clearly, they depended heavily on ARC and APEX to make their design feasible.

Interesting stuff. You can watch the webinar HERE.


Architectural Planning of 3D IC

Architectural Planning of 3D IC
by Daniel Payne on 11-15-2022 at 10:00 am

3D IC min

Before chiplets arrived, it seemed like designing an electronic system was a bit simpler, as a system on chip (SoC) methodology was well understood, and each SoC was mounted inside a package, then the packages for each component were interconnected on a printed circuit board (PCB). The emerging trend to design a 3D IC using chiplets has been shown for central processing units (CPU), application processors (AP), graphical processing units (GPU), and even AI chips. With a 3D IC approach there is a promise of higher systems integration, performance improvements, and at a lower cost than using a single SoC.

New challenges arise with a 2.5D or 3D IC design, like knowing how to divide up the system features into chiplets, and then choosing an architecture that will meet requirements: power, performance, area, time to market, cost. Siemens EDA has written a 14 page eBook: Launching the full potential of 3D IC with front-end architectural planning, and I’ll share the major points learned.

Source: NanoElec

Design-technology co-optimization (DTCO) has been a collaborative process between foundry engineers and IC design engineers to optimize IC metrics, although this is reaching diminishing returns with the slowing of Moore’s Law on the process side. System-technology co-optimization (STCO) takes into account architectural and technology trade-offs earlier in time, and with predictive analysis there are more design scenarios looked at.

Using STCO there is partitioning of hardware and software, where hardware is divided into SoCs or system in package (SIP) using 2.5D or 3D assembly. Heterogenous integration is when multiple chiplets are combined. Collaboration for a chiplet-based approach require early discussions between engineering groups:

  • System
  • RTL
  • Packaging
  • Silicon
  • Testing
STCO

Partitioning hardware into chiplets brings new technical challenges, like:

  • Signal Integrity (SI) between chiplets
  • Power Integrity (PI) inside the packaging
  • Electro-Migration (EM) of interconnect between chiplets
  • Thermo-Mechanical stress analysis
  • Substrate Verification
  • Assembly Verification

Siemens EDA has a design flow for systems using chiplets and STCO, where you can make early trade-offs and explore how a system is composed. Testbenches can be automatically generated, in only minutes, making your design verification team productive. Verification IP helps engineering teams validate compliance to many industry standards, like:

  • PCI Express Gen 6
  • Compute Express Link (CXL)
  • DDR5
  • HBM memory interface protocols
  • Flash
  • MIPI
  • USB
  • Ethernet
  • Serial
  • USB
Verification Framework

UCIe

In March 2022 the Universal Chiplet Interconnect Express (UCIe) consortium was announced to support chiplet standards, and the 10 founding member companies are: AMD, Arm, Advanced Semiconductor Engineering, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and TSMC. UCIe maps PCI Express (PCIe) and CXL protocols, and a standard way for die-to-die communication. Chiplet teams do not have to reinvent the wheel with their own, one of a kind interconnect, instead they can adopt the UCIe standard. There are other interconnects to consider: XSR, USR, AIB, BOW.

Apple M1 Ultra

Apple is at the vanguard of using chiplets for their laptops and tablets, as the M1 Ultra processor chip includes two M1 Max chiplets, connecting 10,000 signals along a single edge. This level of system integration in a package supports 2.5 TB/s of bandwidth, along with eight memory chips, plus an application processor and GPU included.

Summary

Siemens EDA has long been in the systems engineering space, and the 2.5D and 3D trend is also supported for SIP, including architectural design, RTL verification, IP for verification, and support for standards like UCIe. Heterogeneous integration is making the news, and design teams can also catch the wave by choosing a vendor like Siemens EDA.

View the 14 page eBook online.

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proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface

proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
by Kalar Rajendiran on 11-15-2022 at 6:00 am

proteanTecs D2D Monitoring Hardware Block Diagram

An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power of proteanTecs’ technology extends beyond the development phase and benefits semiconductor device testing as well. Another SemiWiki blog discussed how the economics of testing can be enhanced by leveraging proteanTecs’ platform. The blog showcased how defective parts can be weeded out earlier in the assembly process to minimize scrap cost.  You can review that blog here.

With heterogeneous chiplets-based SoC implementations picking up momentum, GUC has been offering its GLink™ high-speed interface IP for connecting the different chiplets of an SoC. As the 2.5D/3D packaging assembly cost will be higher, it becomes even more important to weed out defective dies before they enter the assembly process. The proteanTecs technology not only makes this task easier but also makes in-field predictive maintenance possible, preventing catastrophic system failures.

GUC implemented the proteanTecs monitoring system into its 5nm GLink 2.0 test chip to assist in testing and characterizing the GLink Phy. proteanTecs recently published a whitepaper that goes into the details of this collaborative effort. This post will cover the salient points garnered from that whitepaper.

Chiplets Interconnect Challenge

Critical to the success of highly integrated Silicon In Package (SiP) products is the high-speed interface connectivity. High-speed parallel interfaces are being favored more over SerDes interfaces due to simplicity and flexibility for continuous scaling. As such, a number of implementations are in use such as HBM, OpenHBI, AIB, BoW, UCIe and GUC’s GLink. While these implementations offer significant comparative advantages over metrics such as BER, power efficiency, area efficiency and ASIC die area, they do introduce challenges in assembly. The microbumps used over the silicon interposer may suffer defects such as voids or cracks. On organic substrates, resistive shorts can cause signal integrity issues and performance degradation. Once assembled, there is no practical way to test and assure defect-free, fully functioning products. But assuring a 100% defect-free product is imperative for system stability over its guaranteed lifetime.

Current approach to handling this challenge is to implement spare lanes that can replace defective ones. But how to identify which lanes are candidates for replacement? BIST techniques detect gross failures such as opens and shorts but are often unable to detect small variations that may cause catastrophic system failures in the future. Probe points, X-ray or other imaging approaches are ineffective due to substrate covering the die interconnects.

proteanTecs Solution

The proteanTecs patent-protected solution is compromised of low footprint, digital-only sensors for monitoring the performance of the parallel interface. These sensors can be placed next to each pin inside the die-to-die (D2D) interconnect Phy to achieve 100% coverage without impacting the signal behavior. The I/O sensors are connected to and managed by a hierarchy of controllers designed to measure, collect and edge-process the data. These embedded agents can be controlled directly from the automatic test equipment (ATE) or by firmware running on an embedded CPU when connected to an APB port.

The measurement data from the monitoring system is extracted and processed for actionable analytics using dedicated machine learning algorithms.

Solution Offers Unprecedented Visibility

During characterization phase: Allows for per-pin eye diagram visualization and margin correlation to process, voltage levels, driver strength, receiver reference voltage, physical location on the die, substrate routing topology and more.

In mass production stage: Identifies marginal pins and recommends candidates for spare lane swapping.

During field operation: Makes predictive maintenance possible by alerting about pins that show signs of wear-out and suggesting as candidates for lane swapping before system fails.

All in all, system maintenance cost is reduced and system uptime is increased.

GUC GLink Test Chip Analysis

The proteanTecs-GUC collaborative effort involved implementation of a 5nm Test chip consisting of a single GLink Phy instance.

  • Eight slices, each containing 42 lanes:
    • 32 full-duplex data lanes
    • Four DBI (Data Bus Inversion) lanes
    • One “frame” and one parity lanes (for debug purposes only)
    • Two clock lanes (one differential pair)
    • Two spare lanes per (covering for data, DBI and parity lane redundancy)
  • Up to 16Gbps per lane
  • Built-in test pattern generator and checker (BIST)
  • proteanTecs I/O Sensor per lane, 42 per slice
  • proteanTecs monitoring control system
  • APB to JTAG bridge for external control

Key Findings

Measuring the jitter of all the pins on all available samples allows for unique ability of full coverage parametric pin characterization. The proteanTecs monitoring system made it easier to compare different transceiver circuitry implementations for margin differences. It also provided visibility into process corner effects on transceiver performance across all samples.

For full details, you can download the joint GUC-proteanTecs whitepaper from proteanTecs’ website.

For more details about the proteanTecs platform, visit https://www.proteantecs.com/solutions.

For more details about GUC’s GLink high-speed interface, visit GUC’s GLink product page.

Also Read:

Elevating Production Testing with proteanTecs and Advantest’s ACS Edge™ Platforms

How Deep Data Analytics Accelerates SoC Product Development

CEO Interview: Shai Cohen of proteanTecs


Selecting a flash controller for storage reliability

Selecting a flash controller for storage reliability
by Don Dingee on 11-14-2022 at 10:00 am

2.5 SSD with Hyperstone X1

Flash memory cards and solid-state drives (SSDs) provide high-performance storage in many devices and systems today. While the flash chips inside cards and SSDs provide raw capacity and performance, they must be combined with an intelligent flash controller to achieve the reliability system designers and consumers need. A new product guide from Hyperstone provides an overview of their high-reliability flash memory controllers, their accompanying feature sets, and available software tools.

Critical features of advanced flash controllers

When people think of flash storage, the first thing that comes to mind is capacity. Innovative fabrication techniques continue driving flash chip density higher. Stringing together flash chips to reach the required amount of storage in a memory card or SSD is the easy part. Flash controllers add critical features to make flash storage more efficient, durable, and reliable under real-world conditions.

Here are five necessary flash memory controller features:

  • Wear leveling. Flash chips specify a minimum write cycle endurance – how many write cycles each cell can withstand. The entire storage card wears out prematurely if a subset of flash cells is used repeatedly. Wear-leveling techniques distribute the use of flash cells across all the chips, providing even wear and extending life for the entire card.
  • Power fail protection. Interrupting a flash write before completion can corrupt data and leave cells temporarily unusable. Power fail protection helps write cycles complete using brief capacitive hold-up mechanisms.
  • Write management. Flash write cycles are a delicate dance of power supply changes and signal timing constraints to set a physical state in a cell. A flash controller offloads the host processor from managing the details, completing the cycle from a simple write command, and allowing the host to move on to other tasks.
  • Error correction coding. Various encoding schemes enabled with extra stored bits with words can help detect and correct bit errors on the fly. BCH is a commonly used code, alongside algorithms such as LDPC.
  • Data refresh. Flash storage is regarded as non-volatile, where cells retain their programmed state with power off. However, cell programming tends to degrade if power is left off for extended periods. Data refresh cycles read and re-write cell states in the background, restoring their full retention strength.

A range of flash controllers for different applications

Other variables come into play for NAND-based flash solutions, including cost, maintenance (considering onboard embedded flash versus a card that can be easily exchanged), and system-level redundancy. It’s essential for OEMs choosing a flash controller to be able to tune both the hardware and the firmware to their needs.

Hyperstone’s portfolio of NAND flash memory controllers targets a wide range of demanding solutions across various interfaces. From Serial ATA (SATA) and Parallel ATA (PATA) solid-state disks (SSDs), Disk-on-Module (DoM), Disk-on-Board (DoB), embedded flash solutions, USB and flash cards such as CompactFlash, SD, and microSD, Hyperstone is constantly developing and optimizing both their hardware and firmware. The hyMap® firmware comes with many standard features and is customized for each flash application. Additionally, an API is available alongside specific controllers, allowing  customers to add extra security features to those controllers. Software tools to assist in life expectancy estimation, factory pre-configuration of flash, and in-use performance analysis complete the Hyperstone portfolio.

To learn more about Hyperstone flash controller products for reliable storage solutions, visit the NAND Flash Memory Controllers product portfolio page – the product guide is downloadable by clicking a button shown.

Also Read:

CEO Interview: Jan Peter Berns from Hyperstone


Why Intel may be the first casualty if Beijing retaliates over Biden’s export controls

Why Intel may be the first casualty if Beijing retaliates over Biden’s export controls
by admin on 11-14-2022 at 6:00 am

Intel Bejing

After the Biden administration upped the ante in the tech war by restricting China’s access to advanced US semiconductor technology, the $64,000 question was “How might Beijing respond?”

Punishing American companies in China (like Apple and Tesla) was not considered likely given the employment they generate – Apple contractor Foxconn employs more than 1 million Chinese – not to mention the technology transfer benefits that Beijing craves from foreign companies.

However, a hint of how the Chinese Communist Party may strike back has emerged – and it’s not so much an “action” as a form of “inaction”. The first casualty may be America’s biggest chipmaker.

On February 15 this year, Intel announced an agreement to acquire Israel-based foundry Tower Semiconductor for $5.4 billion.

The deal was seen as key to the long term success of Intel Foundry Services (IFS), as Tower’s strength in analog complemented Intel’s in digital.

“Tower’s specialty technology portfolio, geographic reach, deep customer relationships and services-first operations will help scale Intel’s foundry services and advance our goal of becoming a major provider of foundry capacity globally,” Intel CEO Pat Gelsinger said at the time.

However, that deal may be at the mercy of Beijing , according to some commentators.

“The United States is directly trying to stop China’s semiconductor independence and pulled out all the stops with its recent export controls. Meanwhile, Intel is trying to bolster domestic production and reduce the United State’s reliance on Taiwan. Why would China let Intel, and by extension, the United States government, do this? They will almost certainly block the deal,” wrote semiconductor analyst Doug O’Laughlin in a blog titled “China’s revenge: The Tower Semiconductor deal is in a tough place”.

How could Beijing scupper the deal? The same way it stopped Qualcomm from acquiring NXP Semiconductors in 2018.

Big global M&A deals require the approval of various regulatory agencies, such as the Federal Trade Commission in the US. In China, the antitrust body is the State Administration for Market Regulation (SAMR).

SAMR killed Qualcomm/NXP by not issuing regulatory approval for the deal, and Qualcomm – reliant on the Chinese market for major revenues – had to play along. Some predict that the same may happen with Intel/Tower.

“[In China] every regulatory agency is just an extension of the [communist] party’s will, so I think the clear way to hinder the United States and its companies is to block every deal in the approval process,” said O’Laughlin.

Last month, SAMR applied the same tactic to another US merger deal, though not related to the semiconductor industry. DuPont’s $5.2-billion deal to acquire Arizona-based speciality materials supplier Rogers Corp, which was announced over a year ago, was terminated on November 2 because SAMR failed to approve it.

Companies above a certain annual revenue threshold are subject to SAMR review, but if they don’t have any business in China, it’s a moot point. However, Intel derives a significant portion of its revenue from China – and operates a 300mm wafer fab in the country.

“It’s possible to merge without Chinese approval, but then China could restrict Intel’s right to sell products in China,” O’Laughlin said. “Tower Semi is a quick way to make the IFS dream a reality and has to be at the top of Intel’s strategic priorities. But this is how China can strike back.”

Ben Thompson, a tech analyst who pens the Stratechery newsletter, believes it would be “devastating” for Intel if SAMR blocked the Tower acquisition.

“While it is fair to be skeptical of Intel’s ability to catch-up, that task will be far more difficult without the sort of transformation in culture around foundry services that Tower was acquired to provide,”  Thompson said.

If China blocks the deal, Intel could decide to go ahead anyway. Worst case, Beijing may ban the company from selling in China, but given the Chinese government’s vociferous opposition to its lack of access to US chips, that would be a self-inflicted wound.

The national security implications of the case have also not been lost on commentators.

Thompson said that if Intel sacrificed the China market it would “at least be in line with [CEO Pat] Gelsinger’s rhetoric on the matter,” while O’Laughlin said “not getting Tower Semi to kickstart IFS feels like a national security travesty”.

Also Read:

Why China hates CHIPS

How TSMC Contributed to the Death of 450mm and Upset Intel in the Process

The Evolution of Taiwan’s Silicon Shield

US Supply Chain Data Request Elicits a Range of Responses, from Tight-Lipped to Uptight

Losing Lithography: How the US Invented, then lost, a Critical Chipmaking Process

Why Tech Tales are Wafer Thin in Hollywood


Requiem for a Self-Driving Prophet

Requiem for a Self-Driving Prophet
by Roger C. Lanctot on 11-13-2022 at 4:00 pm

Requiem for a Self Driving Prophet

In a few short years, self-driving tech enfant terrible George Hotz managed to get a rebuff from Tesla CEO Elon Musk and a brush back from both the California Department of Motor Vehicles and the National Highway Traffic Safety Administration (NHTSA) while single-handedly inventing the aftermarket for autonomous vehicle technology. Today, an average consumer with a little bit of ingenuity can add SAE Level 2 autonomous driving capability to a wide range of vehicles from Toyota, Honda, Subaru and others. Anyone can do it.

Two weeks ago, Hotz published a blog indicating that he was taking a break from the slog of chasing investor cash and struggling with supply chain issues in order to pursue other interests. He simply said he’d had enough of the Comma.ai rat race. It’s a shame.

We pat ourselves on the back here in the U.S. for having a vibrant startup industry. Hotz’s experience is a testament to both the vibrance of that eco-system and its limitations.

Hotz’s OpenPilot software implemented in the Comma devices – 1,2, and 3 – has clearly proven its merit with the endorsement of Consumer Reports and the support of thousands of tinkerers who have bought the necessary hardware (Panda or Giraffe devices directly from Comma), downloaded the open source code and installed the system into their own personal cars. Hotz cleverly won over the CR editors with the combination of the system’s impressive performance along with the integrated driver monitoring technology.

The willingness of average consumers to take on the formidable task of more or less “hacking into” their own vehicle controls with an aftermarket device that will clearly void any manufacturer’s warranty is perhaps most amazing. More amazing still is the fact that the couple thousands of consumers who have gone to the trouble of installing devices using OpenPilot software have yet to report a single unhappy experience using the device. Also, thankfully, no ugly headlines regarding crashes or fatalities.

The performance of Hotz’s open sourced OpenPilot software (open sourced in order to avoid NHTSA sanction) has been sufficient to attract a host of companies seeking to build upon the technology with solutions of their own. These companies include Epilog AI, Kommu, BlueBox, and Merlin Mobility, which offers a solution to assist drivers with various disabilities or limitations.

Consumers can take the OpenPilot challenge with the help of a wide range of aftermarket kits available from Websites such as AliExpress.com: https://www.aliexpress.com/store/1101868933

Part of Hotz’s recent frustrations that led to his (temporary?) departure from the self-driving development circus was the inability to source a particular Qualcomm chipset. He mused about alternatives and alleged that Qualcomm was deliberately blocking his efforts.

It’s interesting to consider the implications of Qualcomm standing in Hotz’s path preventing further progress. Qualcomm, of course, has its own self-driving ambitions.

Hotz’s allegations are reminiscent of Mobileye walking away from Tesla following the famous fatal Florida crash in 2017. Musk blamed Mobileye for the failure of his forward-facing camera system to recognize a tractor trailer blocking the highway. Months later, Mobileye disclosed that it was Mobileye that had parted company with Musk.

This development was not unlike Nvidia’s decision, following Uber’s fatal Phoenix-area crash, to pause its own self-driving testing.  Suppliers do not want to be associated with AV system failures especially when they have AV ambitions of their own.

It’s interesting to ponder the prospect of a nascent self-driving aftermarket emerging – especially just two months before the opening of CES 2023. It will be interesting to see whether the seeds planted by Hotz bear fruit with or without his ongoing participation.

Also Read:

MIPI in the Car – Transport From Sensors to Compute

Musk: The Post-Truth Messiah

Flash Memory Market Ushered in Fierce Competition with the Digitalization of Electric Vehicles