Chiplets are hot now as a way to extend Moore’s Law, dividing functionality across multiple die within a single package. It’s no longer practical to jam all functionality onto a single die in the very latest processes, exceeding reticle limits in some cases and in others straining cost/yield. This is not an academic concern. Already… Read More
The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More
It was nice to be at a live conference again. DesignCon was held at the Santa Clara Convention Center, my favorite location, which to me there was a back to normal crowd. The sessions I attended were full and the show floor was busy. Masks and vaccinations were not required, maybe that was it. Or there was a pent-up demand to get back engaged… Read More
