Introduction
When I designed DRAM chips at Intel I wanted to simulate at the worst case process corners to help make my design as robust as possible in order to improve yields. My manager knew what the worst case corners were based on years of prior experience, so that’s what I used for my circuit simulations.… Read More
Sorry to disappoint but my 2 hours at the Intel RNB was a very positive experience. It is much more fun writing negative things about industry leaders because I enjoy the resulting hate mail and personal attacks, but the candor and transparency of the Intel guys won me over. They even asked ME questions which was a bit telling. I also… Read More
While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor… Read More
TSMC continues to drive the economic recovery with impressive Q1 numbers and an even more impressive Q2 and Q3 outlook. TSMC is my economic bellwether due to its diverse customer base and shear volume of consumer electronics silicon. The big surprise in the 1 hour Q1 conference call is a new Giga Fab (#15) ground breaking this year… Read More
The recent announcement from Tabula about the $108 million raised in its Series D round of funding is putting the focus on FPGA technology, and FPGA startups in particular. Who are these FPGA startups, what is their differentiation, where is the innovation, in the product or the business model?
When you say FPGA, you first think:… Read More
This blog was posted 10 months ago, and the comments have made it much more interesting! Don’t miss the various comments at the back. Also feel free to let us know if you think the status, in this ARM vs Intel “war” has changed a lot since March 2011. Do you really think Intel has catch up with ARM in the mobile industry?… Read More
The earthquake and subsequent tsunami that devastated Japan on March 11[SUP]th[/SUP], 2011 will have far reaching ramifications around the world for years to come. People have asked me how this disaster will affect the semiconductor industry so I will try and summarize it in this blog.
First the foundries:
According to TSMC: … Read More
The semiconductor design and manufacturing challenges at 40nm and 28nm are a direct result ofMoore’s Law, the climbing transistor count and shrinking geometries. It’s a process AND design issue and the interaction is at the transistor level. Transistors may be shrinking, but atoms aren’t. So now it actually matters when even… Read More
The 17[SUP]th[/SUP] Annual TSMC Technology Symposium will be held in San Jose California on April 5[SUP]th[/SUP], 2011. Dr. Morris Chang will again be the keynote speaker. The theme this year is “Trusted Technology and Capacity Provider”and I think it’s important to not only hear what people are saying but also understand why… Read More
For IC designers creating full-custom or AMS designs there are plenty of challenges to getting designs done right on the first spin of silicon. Let me give you a sneak peek into what’s being discussed at the EDA Tech Forum in Santa Clara, CA on March 10th that will be of special interest to you:
3D TSV (Through Silicon Vias) are… Read More
