Fabless to OIP

Fabless to OIP
by Paul McLellan on 04-10-2013 at 7:22 pm

Suk Lee drew the short straw at the TSMC Symposium yesterday, with the 5pm slot. Not only late in the day but between all the attendees and free beer. The morning sessions had been standing room only, with several hundred standees (as they call them on muni around here, but isn’t a standee really someone being stood on?). But … Read More


How Long Does it Take to Go From a Muddy Field to Full 28nm Capacity?

How Long Does it Take to Go From a Muddy Field to Full 28nm Capacity?
by Paul McLellan on 04-09-2013 at 4:02 pm


TSMC has a lot of capacity. Not just that, it has a lot more under construction. It currently has 3 300mm Gigafabs, fabs 12,14 and 15 (there doesn’t seem to be a 13). This morning, Dr Wang, who is TSMC’s VP of 300mm operations told us about the expansion plans. Currently fab 15 phase 3 and 4, and fab 12 phase 3 are to be ramped… Read More


Cell Level Reliability

Cell Level Reliability
by Paul McLellan on 04-03-2013 at 6:06 pm

I blogged last month about single event effects (SEE) where a semiconductor chip behaves incorrectly due to being hit by an ion or a neutron. Since we live on a radioactive planet and are bombarded by cosmic rays from space, this is a real problem, and it is getting worse at each process node. But just how big of a problem is it?


TFIT is … Read More


TSMC to Talk About 10nm at Symposium Next Week

TSMC to Talk About 10nm at Symposium Next Week
by Daniel Nenni on 04-02-2013 at 8:05 pm

Given the compressed time between 20nm and 16nm, twelve months versus the industry average twenty four months, it is time to start talking about 10nm, absolutely. Next Tuesday is the 19th annual TSMC Technology Symposium keynoted of course by the Chairman, Dr. Morris Chang.

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TSMC Tapes Out First 64-bit ARM

TSMC Tapes Out First 64-bit ARM
by Paul McLellan on 04-02-2013 at 2:15 am

TSMC announced today that together with ARM they have taped out the first ARM Cortex-A57 64-bit processor on TSMC’s 16nm FinFET technology. The two companies cooperated in the implementation from RTL to tape-out over six months using ARM physical IP, TSMC memory macros, and a commercial 16nm FinFET tool chain enabled by… Read More


Samsung 28nm Still Does Not Yield?

Samsung 28nm Still Does Not Yield?
by Daniel Nenni on 03-31-2013 at 7:00 pm

As if Samsung didn’t have enough to worry about with their new neighbor to the North (Korea) declaring war, Samsung 28nm is still NOT yielding. In my previous blog “Can Samsung Deliver as Promised?” I wondered what will power the new Galaxy S4 phones that Samsung has been aggressively marketing. You would think it would be a 28nm version… Read More


Mentor at TSMC Technology Symposium

Mentor at TSMC Technology Symposium
by glforte on 03-29-2013 at 11:41 am

TSMC will host their annual technology symposium at several locations in the U.S. on April 9th in San Jose, April 16th in Austin, and April 23rd in Boston. TSMC will discuss the market outlook, design enablement, and technology for high-speed computing, mobile communications, connectivity and storage, CIS, embedded flash, … Read More


TSMC on Collaboration: JIT Ecosystem Development

TSMC on Collaboration: JIT Ecosystem Development
by Paul McLellan on 03-27-2013 at 2:02 pm

Cliff Hou of TSMC gave the keynote today at SNUG on Collaborate to Innovate: a Foundry’s Perspective. Starting around 45nm the way that a foundry has to work with its ecosystem fundamentally changed. Up until then, each process generation was similar enough to the previous one, apart obviously from size, that it could be … Read More


Moore and Beyond: Global Semiconductor Primer

Moore and Beyond: Global Semiconductor Primer
by Daniel Nenni on 03-24-2013 at 8:10 pm

There are a couple of new analyst reports out that are interesting enough to blog about. I talk to the financial types on the phone every week or so explaining the semiconductor business and answering questions about the foundries and the top fabless companies. We don’t always agree on the outlook but there is always something to … Read More


Unlocking the Full Potential of Soft IP

Unlocking the Full Potential of Soft IP
by Daniel Payne on 03-22-2013 at 11:32 am

EDA vendors, IP suppliers and Foundries provide an eco-system for SoC designers to use in getting their new electronic products to market quicker and at a lower cost. An example of this eco-system are three companies (TSMC, Atrenta, Sonics) that teamed up to produce a webinar earlier in March called: Unlocking the Full PotentialRead More