Smart Strategies for Efficient Testing of 3D-ICs

Smart Strategies for Efficient Testing of 3D-ICs
by Pawan Fangaria on 02-12-2014 at 6:30 am

3D-IC has a stack of dies connected and packaged together, and therefore needs new testing strategies other than testing a single die. It’s given that a single defective die can render the whole of 3D-IC unusable, so each die in the stack must be completely and perfectly tested before its entry into that stack. Looking at it from a … Read More


Designing an SoC with 16nm FinFET

Designing an SoC with 16nm FinFET
by Daniel Payne on 02-11-2014 at 9:35 pm

IC designers contemplating the transition to 16nm FinFET technology for their next SoC need to be informed about design flow and IP changes, so TSMC teamed up with Cadence Design Systems today to present a webinar on that topic. I attended the webinar and will summarize my findings.

Shown below is a 3D layout concept of an ideal FinFET… Read More


The Great Wall of TSMC

The Great Wall of TSMC
by Paul McLellan on 02-03-2014 at 5:27 pm

TSMC doesn’t just sell wafers, it sells trust. It’s the Colgate Ring of Confidence for fabless customers. This focus on trust started at the very beginning when Morris Chang founded TSMC over 25 years ago, and still today trust remains an essential part of their business.

When TSMC started, the big thing it brought … Read More


Why Intel 14nm is NOT a Game Changer!

Why Intel 14nm is NOT a Game Changer!
by Daniel Nenni on 02-02-2014 at 10:00 am

On one hand the Motley Fool is saying, “Intel 14nm could change the game” and on the other hand the Wall Street Cheat Sheet is saying, “Intel should shut down mobile”. SemiWiki says Intel missed mobile and should look to the future and focus on wearables and in this blog I will argue why.

Let’s look back to 2009 when Intel and TSMC signed… Read More


RTL Sign-off – At an Edge to become a Standard

RTL Sign-off – At an Edge to become a Standard
by Pawan Fangaria on 02-01-2014 at 10:00 am


Ever since I have seen Atrenta’s SpyGlass platform providing a comprehensive set of tools across the semiconductor design paradigm, I felt the need for a common set of standards to evolve for sign-off at RTL level. Last December, when I read an EE Times articleof Piyush Sancheti, VP, Product Marketing at Atrenta, where he talks … Read More


Wanna Build a Bitcoin Miner: GlobalFoundries Will Manufacture it For You

Wanna Build a Bitcoin Miner: GlobalFoundries Will Manufacture it For You
by Paul McLellan on 01-30-2014 at 11:00 am

You may know a bit about Bitcoin, the digital currency. One part of the system is “mining” new bitcoins, analogous to mining new gold when we were on the gold standard, creating “money” out of thin air but at a cost of doing the actual mining.

Here is an interesting aside. When I lived in France the father of… Read More


A Brief History of Qualcomm

A Brief History of Qualcomm
by Paul McLellan on 01-29-2014 at 12:48 pm

Qualcomm is the largest fabless semiconductor company in the world. If you have a smarphone there is a good chance you have a Qualcomm chip in your pocket. It is headquartered in San Diego with offices pretty much everywhere.

Qualcomm’s roots are in Linkabit, which was founded by Irwin Jacobs and Andrew Viterbi. They, along with … Read More


The Changing Semiconductor Foundry Landscape!

The Changing Semiconductor Foundry Landscape!
by Daniel Nenni on 01-29-2014 at 8:00 am

The foundry landscape is changing again and it is definitely something that should be discussed. There are some people, mostly influenced by Intel, that feel the foundry business has hit the wall at 20nm which couldn’t be further from the truth. After spending 30 years working in Silicon Valley, I have experienced a lot of change… Read More


TSMC OIP presentations available!

TSMC OIP presentations available!
by Beth Martin on 01-27-2014 at 6:27 pm

Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference:

Read More

TSMC projects $800 Million of 2.5/3D-IC Revenues for 2016

TSMC projects $800 Million of 2.5/3D-IC Revenues for 2016
by Herb Reiter on 01-27-2014 at 11:00 am

At TSMC’s latest earnings call held mid January 2014, an analyst asked TSMC for a revenue forecast for their emerging 2.5/3D product line. C.C. Wei, President and Co-CEO answered: “800 Million Dollars in 2016 ”. TSMC has demonstrated great vision many times before. For me, an enthusiastic supporter of this technology, this statement… Read More