Can Intel Catch Samsung? Can Anybody Catch Samsung?

Can Intel Catch Samsung? Can Anybody Catch Samsung?
by Daniel Nenni on 11-08-2013 at 5:00 pm

As a professional conference attendee I see a lot of keynotes, some good and some bad. I saw a great one from Kurt Shuler at the SEMICO IP Impact Conference last week. Why this conference was not standing room only I do not know. Kurt’s characterization of the semiconductor industry was well worth the price of admission. I didn’t actually… Read More


Xilinx and TSMC: Volume Production of 3D Parts

Xilinx and TSMC: Volume Production of 3D Parts
by Paul McLellan on 11-07-2013 at 1:23 pm

A couple of weeks ago, Xilinx and TSMC announced the production release of the Virtex-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS)… Read More


TSMC on Semiconductor IP Quality

TSMC on Semiconductor IP Quality
by Daniel Nenni on 11-07-2013 at 9:00 am

It is important to note that the System On Chip (SoC) revolution that is currently driving mobile electronics has one very important enabling technology and that is Semiconductor Intellectual Property. Where would we be without the commercial IP market segment? Computers and phones would still be on our desks for one thing, and… Read More


Can Intel Compete in the IoT?

Can Intel Compete in the IoT?
by Daniel Nenni on 11-05-2013 at 5:00 pm

Kevin Ashton, a British technology pioneer, is credited for the term “The Internet of Things” to describe an ecosystem where the Internet is connected to the physical world via ubiquitous sensors. Simply stated: rather than humans creating content for the internet IoT devices create the content. To be clear, this… Read More


TSMC ♥ Mentor (Calibre PERC)

TSMC ♥ Mentor (Calibre PERC)
by Daniel Nenni on 10-29-2013 at 8:00 am

As semiconductors become more integrated into our lives reliability is becoming a critical issue. As IP consumes more of our die, IP reliability is becoming a critical issue. As we pack more transistors into a chip, reliability is becoming a critical issue. As we move from 28nm to 20nm to 16nm, reliability is becoming a critical … Read More


TSMC Continues To Fire On All Cylinders

TSMC Continues To Fire On All Cylinders
by Ashraf Eassa on 10-17-2013 at 5:03 pm

Taiwan Semiconductor Manufacturing Corporation is the world’s leading semiconductor foundry by revenue and, by extension, profitability. While I am deeply saddened that current CEO Morris Chang will be retiring (again) shortly, I am hopeful that his successor will be able to continue the legacy of foundry industry leadership… Read More


How Asia Works, phase 2/3

How Asia Works, phase 2/3
by Paul McLellan on 10-17-2013 at 2:19 am

Success in manufacturing has two conditions: tariff barriers to shield the infant industries from external competition, and a rigorous focus on exports to ensure that manufacturing cannot just shelter behind the tariff barriers and reap monopoly profits inside the country. Each industry needs to have several companies enter,… Read More


A Mixed-Signal IC Summit in San Jose

A Mixed-Signal IC Summit in San Jose
by Daniel Payne on 10-03-2013 at 9:26 am

Analog and mixed-signal ICs are tougher to design and verify compared to digital, so if you want to learn more about best practices from actual AMS engineers then consider attending a summitthat is sponsored by Cadence Design Systems next Thursday, October 10th in San Jose from 8:00AM until 6:30PM.

They’ve lined up an interesting… Read More


TSMC Awards Berkeley Design Automation

TSMC Awards Berkeley Design Automation
by Daniel Nenni on 10-02-2013 at 11:00 am


One of the highlights of the TSMC 2013 Open Innovation Platform® Forum was the Partner Award Ceremony. TSMC awarded Berkeley Design Automation (BDA) with the TSMC Open Innovation Platform’s Partner of the Year Award 2013 for joint development of 16nm FinFET design infrastructure. I talked with Ravi Subramanian, BDA CEO,… Read More


Another Negative Year for Semiconductor CapEx

Another Negative Year for Semiconductor CapEx
by Bill Jewell on 09-29-2013 at 11:00 pm

Global semiconductor capital spending is headed for another decline in 2013, following a 12% decline in 2012. Gartner’s September forecast called for a 7% decline in 2013. Most of the major spenders expect flat to declining expenditures in 2013. Intel in July estimated 2013 spending of $11 billion, flat with 2012 and down from … Read More