You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
I’ve worked with Solido for 5 years, and it’s been a pleasure to watch the world’s top semiconductor companies and foundries adopt Solido software for their SPICE simulation flows.
Sub-28nm design starts are accelerating, growing from 150 in 2012 to 900 this year. The move to sub-28nm design nodes is being driven by consumer electronic… Read More
This is the third part of a series answering the most frequently asked questions I get from Wall Street. Please read the previous two articles on Intel’s Manufacturing Lead and Intel’s SoC Challenge before flaming me in the comment section. First let’s look at why there is a foundry business and go from there.
The big… Read More
The calls from Wall Street keep coming with basically the same set of questions: “Does Intel really have a 2-3 year process lead? Can Intel lead the foundry segment? Can Intel Lead the Mobile SoC Segment?” The feeling amongst the buy and sell side investment people is that unless Intel can lead a market they will not stay in it… Read More
When I was reading the recent Daniel Payne article “Designing Change Into Semiconductor Techonomics” with commentary on a recent presentation from Aart de Geus of Synopsys, one chart jumped out at me: the most popular process node for new design starts today is 180nm.
Upon mentioning that to a few of my IoT counterparts, they quickly… Read More
In fact, as of today, nobody can refer to an official statement made by any STM executive about name of the foundry able to process FD-SOI wafers in 28nm. We just know that the agreement is about to (or has been) signed… But we may speculate, and try to use our rational thinking. For example, the Semiwiki readers had the opportunity to… Read More
In my quest to uncover the future of the semiconductor industry I was quite impressed by the executive presentations at the TSMC Symposium last week. Rick Cassidy opened the 20[SUP]th[/SUP] Annual TSMC Technology Symposium followed by Dr. Mark Liu, Dr. Jack Sun, Dr. Cliff Hou, J.K Wang, Dr. V.J. Wu, and Suk Lee. A variety of topics… Read More
There are moments in one’s career that are memorable beyond others, and last night was one of those moments for me, absolutely:
Stanford University President John L. Hennessy will lead a discussion with Stanford Engineering Hero Morris Chang, an innovator and entrepreneur who revolutionized the semiconductor industry by creating… Read More
Spending on semiconductor manufacturing equipment is headed for healthy growth in 2014. The latest data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) shows March 2014 three-month-average billings for semiconductor manufacturing equipment were up 16% from February 2014 and up 31% from a year ago. Bookings… Read More
At Mentor’s U2U this afternoon I attended a presentation on TSMC’s use of Calibre PERC (it is a programmable electrical rule checker) for qualification of IP in TSMC’s IP9000 program. I’ve written about this before here. Basically IP providers at N20SOC, N16FF, and below are required to use PERC to guarantee… Read More
I’m at the GSA Silicon Summit today, at the computer history museum. The first panel session this morning was about future process technology. It was moderated by Joe Sawicki of Mentor with a panel consisting of Rob Aitken from ARM, Paul Farrar of G450C, Peter Huang of TSMC, John Kibarian of PDF Solutions and someone from Applied… Read More