I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).
In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More
As a long time semiconductor IP professional I can tell you for a fact that it is one of the most challenging segments of semiconductor design. Given the growing criticality of semiconductor IP, the challenges of being a leading edge IP provider are increasing and may be at a breaking point. The question now is: What does it take to … Read More
In early September of 2016 I published an article “The 2016 Leading Edge Semiconductor Landscape” that proved to be very popular with many views, comments and reposting’s. Since I wrote that article a lot of new data has become available enabling some projections to be replaced by actual values and new analysis… Read More
In the first session of IEDM on Monday, December 5th there were two papers presented on 7nm processes. The first paper was from TSMC and the second paper was from the Global Alliance of GLOBALFOUNDRIES, IBM and Samsung.… Read More
The cost trend for leading edge semiconductor technologies is a subject of some controversy in the industry. Cost is a complex issue with many interacting factors and much of the information out in the industry is in my opinion misleading or incorrect. In this article, I will discuss each of the factors as well as present a view of … Read More
Lam & Applied talked about “sustainable” growth Both expect share gains & growth in a flattish market. We examine the “new, lower, cyclicality”. Although Applied and Lam are fierce competitors , coming at things from different directions, they sounded awfully similar last week.
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The next IP-SoC conference will be held in Grenoble, France, on December 6-7, 2016 after Shanghai in September and Bangalore, India, in April. This will be the 20[SUP]th[/SUP] edition of this unique IP centric event, as well as the celebration of Design And Reuse 20[SUP]th[/SUP] anniversary. Creating in 1997 a company fully dedicated… Read More
Lam- in line qtr but guides above street over near term. As with ASML, foundry is driver with subdued memory, The Math implies biz peaking-Looking for DRAM in 2017.
Lam reported another great, record quarter, more or less in line with expectations with revenues coming in at $1.632B and shipments of $1.708B, generating EPS of $1.81.… Read More
ASML reported a quarter that was slightly below expectations coming in at Euro 1.815B in revenues and Euro 0.93 EPS. Orders were a bit soft at Euro 1.4B but well within the normal quarterly variation of a lumpy business. Euro 28M was lost in a currency adjustment associated with the Hermes acquisition.
The guidance for Q4 was between… Read More
Standard cell and memory IP are key enablers for new process node availability. These two items must be in place early and be completely ready for a process node to scale to volume. Development of both leaves no room for error and they require the highest performance possible. Foundries are extremely focused on this and spend a lot… Read More
