Shipments of semiconductor wafer fab equipment are expected to grow 2.5% in 2016 after 0.5% growth in 2015 according to the December forecast from Semiconductor Equipment and Materials International (SEMI). Gartner is more pessimistic, with its October forecast calling for fab equipment to decline 0.5% in 2015 and drop 2.5%… Read More
Tag: tsmc
The Twists and Turns of Xilinx vs Altera!
The battle between Xilinx and Altera continues to be one of the more interesting stories to cover. It really is the semiconductor version of a reality TV show. In the beginning it was two fabless companies partnered with rival foundries going head-to-head controlling a single market that touches a variety of industries.
Then things… Read More
When Talking About IoT, Don’t Forget Memory
Memory is a big enough topic that it has its own conference, Memcon, which recently took place in October. While I was there covering the event for SemiWiki.com I went to the TSMC talk on memory technologies for the IoT market. Tom Quan, Director of the Open Innovation Platform (OIP) at TSMC was giving the talk. IoT definitely has special… Read More
IP-SoC Rebound in 2015 !
Going to IP-SoC every year since 2006, I have enjoyed the conference as it’s the only one 100% IP focused and a very good opportunity to network within this rather small ecosystem of IP vendors… but I must admit that, since 2012, the attendance tend to be lower than before. Because of the well-known “chicken & egg” theorem, low … Read More
GlobalFoundries Visit – Part 1 – It’s All About Execution
Fabless companies and the need for foundries
The success of fabless semiconductor companies is well documented with companies such as Qualcomm, Broadcom, MediaTek, AMD, Avago and others selling semiconductors made using the fabless model (see Fabless: The Transformation of the Semiconductor Industry by Daniel Nenni and … Read More
Are FinFETs too Expensive for Mainstream Chips?
One of the most common things I hear now is that the majority of the fabless semiconductor business will stay at 28nm due to the high cost of FinFETs. I wholeheartedly disagree, mainly because I have been hearing that for many years and it has yet to be proven true. The same was said about 40nm since 28nm HKMG was more expensive, which … Read More
Who Will Get the Next Bite of Apple Chip Business?
Recent reports have Intel displacing Qualcomm as the modem supplier and TSMC as the foundry for the next Apple A10 SoC. That is if you call this a credible report: … Read More
Wafer-Level Chip-Scale Packaging Technology Challenges and Solutions
At the recent TSMC OIP symposium, Bill Acito from Cadence and Chin-her Chien from TSMC provided an insightful presentation on their recent collaboration, to support TSMC’s Integrated FanOut (InFO) packaging solution. The chip and package implementation environments remain quite separate. The issues uncovered in bridging… Read More
Cadence Outlines Automotive Solutions at TSMC OIP Event
I used to joke that my first car could survive a nuclear war. It was a 1971 Volvo sedan (142) that was EMP proof because it had absolutely no semiconductors in the ignition system, just points, condensers and a coil. If you go back to the Model T in 1915 you will see that the “on-board electronics” were not that different. However, today’s… Read More
A FinFET BSIM-CMG model update from UC-Berkeley
Every designer relies upon an underlying “compact” device model for circuit simulations – these models are the lifeblood of the IC industry. Designers may not be aware that there is an organization that qualifies models – the Compact Model Coalition – which operates under the umbrella of the Si2 Consortium: http://www.si2.org/cmc_index.php… Read More