Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More


Integrating High Speed IP at 5nm

Integrating High Speed IP at 5nm
by Pavan Patel on 11-10-2022 at 6:00 am

Figure 1

Introduction:

The advancements in deep submicron technology and adding multiple functionalities to reduce costs combined with scaling existing operations means that SoC designs become ever more complex. The biggest driving factors to go below the 16nm process node are the decrease in power and the increase in performance … Read More


The CHIPS and Science Act, Cybersecurity, and Semiconductor Manufacturing

The CHIPS and Science Act, Cybersecurity, and Semiconductor Manufacturing
by Simon Butler on 10-13-2022 at 10:00 am

CHIPS Act Logo

This year is proving to be a momentous one for U.S. semiconductor manufacturing. During a global chip shortage and record inflation, President Biden signed into effect the CHIPS and Science Act – which so far is the greatest boon to U.S. semiconductor manufacturing in history, with $52 billion in subsidies for chip manufacturers… Read More


WEBINAR: A Revolution in Prototyping and Emulation

WEBINAR: A Revolution in Prototyping and Emulation
by Daniel Nenni on 08-23-2022 at 6:00 am

MimicPro Picture

This webinar will introduce to you a revolutionary new way to do prototyping and emulation at best-in-class performance, productivity, and pricing by unifying the hardware and a new software stack so one system is capable of prototyping and delivering essential emulation functionality.

Register Here

The speed of Moore’s law… Read More


SoC Verification Flow and Methodologies

SoC Verification Flow and Methodologies
by Sivakumar PR on 08-18-2022 at 6:00 am

Electronic System

We need more and more complex chips and SoCs for all new applications that use the latest technologies like AI. For example, Apple’s 5nm SoC A14 features 6-core CPU, 4 core-GPU and 16-core neural engine capable of 11 trillion operations per second, which incorporates 11.8 billion transistors, and AWS 7nm 64-bit Graviton2 custom… Read More


Podcast EP92: The Impact of a Specification-Driven Correct-by-Construction Approach on Design and Verification with Agnisys

Podcast EP92: The Impact of a Specification-Driven Correct-by-Construction Approach on Design and Verification with Agnisys
by Daniel Nenni on 07-01-2022 at 10:00 am

Dan is joined by Anupam Bakshi, founder and CEO of Agnisys. Anupam has more than two decades of experience implementing a wide range of products and services in the high tech industry. Prior to forming Agnisys, he held various management and technical lead roles at companies such as Avid Technology Inc., PictureTel, Blackstone,… Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More


Balancing Test Requirements with SOC Security

Balancing Test Requirements with SOC Security
by Tom Simon on 03-17-2022 at 6:00 am

Secure Test for SOCs

Typically, there is an existential rift between the on-chip access requirements for test and the need for security in SoCs. Using traditional deterministic scan techniques has meant opening up full read and write access to the flops in a design through the scan chains. Having this kind of access easily defeats the best designed… Read More


Webinar: Beyond the Basics of IP-based Digital Design Management

Webinar: Beyond the Basics of IP-based Digital Design Management
by Daniel Payne on 03-08-2022 at 10:00 am

Digital Design Flow

According to the ESD Alliance, the single biggest revenue category in our industry is for semiconductor IP, so the concept of IP reuse is firmly established as a way to get complex products to market more quickly and reducing risk. On the flip side, with hundreds or even thousands of IP blocks in a complex SoC, how does a team, division… Read More


Power Analysis in Advanced SoCs. A Siemens EDA Perspective

Power Analysis in Advanced SoCs. A Siemens EDA Perspective
by Bernard Murphy on 02-23-2022 at 6:00 am

Power verification methods min

The success of modern battery-powered products depends as much on useful operating time between charges as on functionality. FinFET process technologies overtook earlier planar CMOS in part because they significantly reduce leakage power. But they exacerbate dynamic power consumption thanks to increased pin capacitances.… Read More