VLSI-SoC 2023 is the 31st in a series of international conferences sponsored by the International Federation for Information Processing Technical Committee 10 Working Group 5, IEEE CEDA, and IEEE CASS, which explore the state-of-the-art in the areas of Very Large-Scale Integration (VLSI) and System-on-Chip (SoC) design.… Read More
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
D&R IP-SoC Silicon Valley 2023 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems.
IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next… Read More
Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More
The advancements in deep submicron technology and adding multiple functionalities to reduce costs combined with scaling existing operations means that SoC designs become ever more complex. The biggest driving factors to go below the 16nm process node are the decrease in power and the increase in performance … Read More
IP-SOC Conference 2022by Admin on 10-24-2022 at 2:28 pm
A worldwide connected Event!!
IP-SoC 2022 will be the 25th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems.
The event is the annual opportunity for IP providers and IP consumers to share information about technology trends, innovative IP SoC products, … Read More
Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories… Read More
This year is proving to be a momentous one for U.S. semiconductor manufacturing. During a global chip shortage and record inflation, President Biden signed into effect the CHIPS and Science Act – which so far is the greatest boon to U.S. semiconductor manufacturing in history, with $52 billion in subsidies for chip manufacturers… Read More