You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
Overview
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis also is extremely… Read More
08 Mar 2022
Online
Event Details
Want to take a tour of this powerful power estimation tool and gear up so you understand the Joules flow?
Join Cadence Training and Sr Principal Education Application Engineer Neha Joshi for this free technical Training Webinar.
Built on a multi-threaded frame-based architecture, the Cadence
…
Read More
The old phrase that the cure is worse than the disease is apropos when discussing MBIST for large SOCs where running many MBIST tests in parallel can exceed power distribution network (PDN) capabilities. Memory Built-In Self-Test (MBIST) usually runs automatically during power on events. Due to the desire to speed up test and … Read More
We used to be comfortable with the idea that the worlds of logical design and physical implementation could be largely separated. Toss the logical design over the wall, and the synthesis and P&R teams would take care of the rest. That idea took a bit of a hit when we realized that synthesis had to become physically aware. The synthesis… Read More
Electronic design automation (EDA) has come a long way from its beginnings. It has enabled chip engineers from specifying designs directly in layout format during the early days to today’s capture in RTL format. Every advance in EDA has made the task of designing a chip easier and increased the design team productivity, enabling… Read More
The most obvious question here is “why do I need netlist CDC?” A lot of what you’re looking for in CDC analysis is really complex behaviors, like handshakes between different clock domains, correct gray coding in synchronizing FIFOs, eliminating quasi-static signals and the like. Deeply functional, system-level intent stuff.… Read More
I attended a session on 2.5D silicon interposer analysis at DesignCon 2020. Like many presentations at this show, ecosystem collaboration was a focus. In this session, Jinsong Hu (principal application engineer at Cadence) and Yongsong He (senior staff engineer at Enflame Tech) presented approaches for interposer power modeling… Read More
If you are designing an SOC for an IoT application and looking to minimize power consumption, there are a lot of choices. However, more often than not, looking at reducing SRAM power is a good place to start. SRAMs can consume up to 70% of an IC’s power. SureCore, a leading memory IP supplier, offers highly optimized SRAM instances … Read More
I think we’re all familiar with the cloud/edge debate on where intelligence should sit. In the beginning the edge devices were going to be dumb nodes with just enough smarts to ship all their data to the cloud where the real magic would happen – recognizing objects, trends, need for repair, etc. Then we realized that wasn’t the best… Read More
Moshe Sheier, VP Marketing at CEVA, recently got back from MWC Shanghai and commented that robots are clearly trending. He saw hordes of robots from dozens of companies, begging for someone to brand and offer them in any one of many possible applications: in an airport to guide you to a connecting flight, for elder care, in hospitals… Read More
