The world of SPICE simulators is one filled with compromises. Typically, it is possible to choose the highest accuracy and pay a performance and capacity penalty, or to choose high speed and capacity but give up accuracy in the process. Many semiconductor companies have been turning to Primarius Technologies to help escape these… Read More
Bridging the Gap between Foundry and IC Design at #53DAC
In our semiconductor ecosystem we often specialize the engineers and therefore EDA tools into separate silos like Foundry, front-end design, back-end design, tapeout, etc. What I discovered at #53DAC a few weeks ago was that some EDA companies actually bridge the gap between foundry engineers and IC designers with their tools.… Read More
Process Development, CAD and Circuit Design
Working at Intel as a circuit designer I clearly remember how there were three distinct groups: Process Development, CAD and Circuit Design. Each of the groups sat in a different part of the building in Aloha Oregon, we had different job titles, different degrees, spoke with different acronyms and yet we all had to work together … Read More
SPICE update from ProPlus at DAC
With EDA tool development in San Jose, Beijing and China, ProPlusis probably best known for their device modeling software called BSIMProPlus. At DAC I met with Lianfeng Yang, Ph.D. the VP of Marketing to hear about what’s new.
Lianfeng Yeng, ProPlus
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Fast Monte Carlo and Analog Fast SPICE
Britto Vincent of ProPlus Design Solutions met with me at DAC on Monday morning to talk about Design For Yield (DFY) and Analog Fast SPICE.
In 2011 ProPlus announced DFY tools where the technology came from IBM, it provides fast Monte Carlo results up to 3 sigma, then added NanoSpice for faster simulation results. Similar in approach… Read More