Bridging the Gap between Foundry and IC Design at #53DAC

Bridging the Gap between Foundry and IC Design at #53DAC
by Daniel Payne on 06-23-2016 at 12:00 pm

In our semiconductor ecosystem we often specialize the engineers and therefore EDA tools into separate silos like Foundry, front-end design, back-end design, tapeout, etc. What I discovered at #53DAC a few weeks ago was that some EDA companies actually bridge the gap between foundry engineers and IC designers with their tools.… Read More


Process Development, CAD and Circuit Design

Process Development, CAD and Circuit Design
by Daniel Payne on 04-29-2016 at 7:00 am

Working at Intel as a circuit designer I clearly remember how there were three distinct groups: Process Development, CAD and Circuit Design. Each of the groups sat in a different part of the building in Aloha Oregon, we had different job titles, different degrees, spoke with different acronyms and yet we all had to work together … Read More


Fast Monte Carlo and Analog Fast SPICE

Fast Monte Carlo and Analog Fast SPICE
by Daniel Payne on 06-08-2012 at 10:25 am

Britto Vincent of ProPlus Design Solutions met with me at DAC on Monday morning to talk about Design For Yield (DFY) and Analog Fast SPICE.

In 2011 ProPlus announced DFY tools where the technology came from IBM, it provides fast Monte Carlo results up to 3 sigma, then added NanoSpice for faster simulation results. Similar in approach… Read More