It was back in July of 2012 that the acquisition of Sigrity by Cadence was announced. Although Cadence is a dominant player in both IC and board layout tools, they did not have an electromagnetic (EM) signal integrity solution in their portfolio. This acquisition marks a turning point for the EM/SI sector – tight integration… Read More
eSilicon engages with customers in many different ways, from providing a full menu of design services down to simply manufacturing parts. Increasingly, they have been automating a lot of this on their website. It started with automatic quotes for MPW shuttles and more recently they have a full production quote system for parts… Read More
Synopsys have been gradually broadening their portfolio of verification IP (VIP). It is 100% native SystemVerilog with native debug using Verdi (that was acquired from SpringSoft last year, now fully integrated into Verification Compiler). It has native performance with VCS. Going forward there are source code test suites.… Read More
There is never enough memory bandwidth. Well, occasionally there is but many SoCs have lots of blocks that communicate through memory, typically off-chip DRAM. In 2001 Sonics created their first solution to this problem with MemMax technology that was incorporated into their SonicsSX product. This has been used in over 100 designs… Read More
One of Coventor’s flagship products is SEMulator3D, and at Semicon West they announced a new version, 2014.100.
SEMulator3D is a powerful 3D semiconductor and MEMS process modeling platform. It uses highly efficient physics-driven voxel modeling technology. It models the physical effects of process steps, which is… Read More
When people discuss capabilities of leading edge process nodes they tend to focus on digital logic. Microprocessors in particular. But a process requires more than just digital logic and standard cells to be successful. In particular, pretty much every SoC contains a lot of memory so the memory capabilities of a process are important.… Read More
eMMC is the standard for mobile memory used in smartphones and tablets. The latest standard, released just this year, is eMMC 5.0. The previous standard, 4.51, was only released last year so things are moving quickly.
Arasan have a webinar next week to bring you up to speed on eMMC 5.0 in general and, of course, their own IP offering… Read More
The GSA Memory+ conference Taiwan will take place on (Halloween!) October 31, 2013 at the Regent Taipei, Taiwan. The main theme of this year is highlighting Memory—the Critical Enabler for Prominent and Emerging Applications in System Logic Solutions.
GSA Memory+ Conference is the global industry event dedicated to all memory… Read More
Today Micron announced that it is shipping 2GB Hybrid Memory Cube (HMC) samples. The HMC is actually 5 stacked die connected with through-silicon-vias (TSVs). The bottom die is a logic chip and is actually manufactured for Micron in an IBM 32nm process (and doesn’t have any TSVs). The other 4 die are 4Gb DRAM die manufactured… Read More
Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More
