Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI

Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI
by Bernard Murphy on 02-05-2024 at 6:00 am

Stable diffusion image min

A recent TechSpot article suggests that Apple is moving cautiously towards release of some kind of generative AI, possibly with iOS 18 and A17 Pro. This is interesting not just for Apple users like me but also for broader validation of a real mobile opportunity for generative AI. Which honestly had not seemed like a given, for multiple… Read More


Webinar: Pushing the Speed Envelope for Memory System Designs

Webinar: Pushing the Speed Envelope for Memory System Designs
by Admin on 11-15-2023 at 4:31 pm

Time

November 28, 2023 | 1:00 PM EST

About

Memory interface speeds keep increasing to meet performance demand. For instance, DDR5 is 275% faster than DDR4, reaching 8800 MT/s or more. Higher speeds also complicate memory design and validation. To achieve the next memory standard, designers need a connected workflow that streamlines… Read More


The 25th Semiconductor Exhibition (SEDEX 2023)

The 25th Semiconductor Exhibition (SEDEX 2023)
by Admin on 08-08-2023 at 2:31 pm

Why SEDEX

The Semiconductor Exhibition will be held at COEX from October 25 to 27, 2023. It is among one of the most outstanding exhibitions that covers the full spectrum of the semiconductor industry supply chain. No other event in the world showcases a full range of semiconductor products including SoC, IP, Memory, sensor, equipment/components… Read More


LAM Not Yet at Bottom Memory Worsening Down 50%

LAM Not Yet at Bottom Memory Worsening Down 50%
by Robert Maire on 04-24-2023 at 10:00 am

LAM RESEARCH Vantex external chamber lrg 300x300

-Lam reported in line results on reduced expectations
-Guidance disappoints as memory decline continues
-Memory capex down 50% but still sees “further declines”
-Lam ties future to EUV maybe not good idea after ASML report

Lam comes in above grossly already reduced expectations
and misses on guidance

We always … Read More


Webinar: Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Webinar: Protocol and Memory Interface Verification in the Shrinking World of 3DIC
by Admin on 08-31-2022 at 1:57 pm

Summary

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM.

Packaging

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Learn How to Efficiently Achieve Accurate Experimental Etch Profiles in FinFET and Memory Applications with Victory TCAD Solution

Learn How to Efficiently Achieve Accurate Experimental Etch Profiles in FinFET and Memory Applications with Victory TCAD Solution
by Admin on 07-25-2022 at 2:40 pm

When: August 11, 2022
Where: Online
Time: 10:00am-10:30am-(PDT)
Language: English

When employing process simulation to generate a complex device structure, TCAD engineers often face the task of reproducing the exact etch profile that has been observed in semiconductor fabrication. Silvaco Victory Process offers several

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Flash Memory Summit Conference

Flash Memory Summit Conference
by Admin on 05-26-2022 at 4:26 pm

Why Attend Flash Memory Summit?

FMS is the best networking opportunity in the storage industry!

The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage.… Read More


Memory Bandwidth Races Higher with HBM3

Memory Bandwidth Races Higher with HBM3
by Admin on 03-03-2022 at 1:44 pm

March 15th @ 11am PT | 2pm ET

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3

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