A recent TechSpot article suggests that Apple is moving cautiously towards release of some kind of generative AI, possibly with iOS 18 and A17 Pro. This is interesting not just for Apple users like me but also for broader validation of a real mobile opportunity for generative AI. Which honestly had not seemed like a given, for multiple… Read More
Why Attend Flash Memory Summit?
Flash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest technologies, see the hottest products, and learn about what’s happening and where the latest trends… Read More
November 28, 2023 | 1:00 PM EST
Memory interface speeds keep increasing to meet performance demand. For instance, DDR5 is 275% faster than DDR4, reaching 8800 MT/s or more. Higher speeds also complicate memory design and validation. To achieve the next memory standard, designers need a connected workflow that streamlines… Read More
The Semiconductor Exhibition will be held at COEX from October 25 to 27, 2023. It is among one of the most outstanding exhibitions that covers the full spectrum of the semiconductor industry supply chain. No other event in the world showcases a full range of semiconductor products including SoC, IP, Memory, sensor, equipment/components… Read More
-Lam reported in line results on reduced expectations
-Guidance disappoints as memory decline continues
-Memory capex down 50% but still sees “further declines”
-Lam ties future to EUV maybe not good idea after ASML report
Lam comes in above grossly already reduced expectations
and misses on guidance
We always … Read More
Nov 29th, 2022 | 8:00 AM PST
Nov 30th, 2022 | 8:00 AM GMT+8
Join this Virtual Event
Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, … Read More
Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM.
When: August 11, 2022
When employing process simulation to generate a complex device structure, TCAD engineers often face the task of reproducing the exact etch profile that has been observed in semiconductor fabrication. Silvaco Victory Process offers several
Why Attend Flash Memory Summit?
FMS is the best networking opportunity in the storage industry!
The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage.… Read More
March 15th @ 11am PT | 2pm ET
With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3