The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
Tag: memory
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More
Tech Connect 2026
Co-organized by CEA-Leti and Soitec, the event invites you to step inside their lab-to-fab pipeline and discover the next advances in semiconductors, embedded AI, sequential 3D, FeRAM memory.
In an executive-level format, you will have the opportunity to:
• Connect and network with your peers
• Exchange directly with leading… Read More
Device Packaging Conference 2027
ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS
Sheraton Grand at Wild Horse Pass
Phoenix, Arizona
March 1-4, 2027
The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International… Read More
Future of Memory and Storage (FMS) 2026: 20th Anniversary
What is FMS?
Our over-arching mission is to help accelerate the move towards a world where advanced memory and storage technologies enable AI systems, data centers, hyperscalers and enterprises to operate at unprecedented scale, speed and efficiency. All the while supporting the engineers and architects building the infrastructure… Read More
Live Webinar: Considerations When Architecting Your Next SoC: NoC with Arteris and Aion Silicon
The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More
TCAD for 3D Silicon Simulation
Semiconductor fabs aim to have high yields and provide processes that attract design firms and win new design starts, but how does a fab deliver their process nodes in a timely manner without having to run lots of expensive silicon through the line? This is where simulation and TCAD tools come into play, and to learn more about this… Read More
Expedera Proposes Stable Diffusion as Benchmark for Edge Hardware for AI
A recent TechSpot article suggests that Apple is moving cautiously towards release of some kind of generative AI, possibly with iOS 18 and A17 Pro. This is interesting not just for Apple users like me but also for broader validation of a real mobile opportunity for generative AI. Which honestly had not seemed like a given, for multiple… Read More
LAM Not Yet at Bottom Memory Worsening Down 50%
-Lam reported in line results on reduced expectations
-Guidance disappoints as memory decline continues
-Memory capex down 50% but still sees “further declines”
-Lam ties future to EUV maybe not good idea after ASML report
Lam comes in above grossly already reduced expectations
and misses on guidance
We always … Read More
Can Threshold Switches Replace Transistors in the Memory Cell?
The overwhelming majority of transistors produced in the world are used in memory cells, either as the memory itself (Flash, SRAM), or as the access device (DRAM). Yet, it is not necessary to have a transistor in every memory cell. In 2015, 3D XPoint, the first major product based on transistor-less memory cells, was announced [1].
