Webinar: Protocol and Memory Interface Verification in the Shrinking World of 3DIC

Webinar: Protocol and Memory Interface Verification in the Shrinking World of 3DIC
by Admin on 08-31-2022 at 1:57 pm

Summary

Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM.

Packaging

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Learn How to Efficiently Achieve Accurate Experimental Etch Profiles in FinFET and Memory Applications with Victory TCAD Solution

Learn How to Efficiently Achieve Accurate Experimental Etch Profiles in FinFET and Memory Applications with Victory TCAD Solution
by Admin on 07-25-2022 at 2:40 pm

When: August 11, 2022
Where: Online
Time: 10:00am-10:30am-(PDT)
Language: English

When employing process simulation to generate a complex device structure, TCAD engineers often face the task of reproducing the exact etch profile that has been observed in semiconductor fabrication. Silvaco Victory Process offers several

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Flash Memory Summit Conference

Flash Memory Summit Conference
by Admin on 05-26-2022 at 4:26 pm

Why Attend Flash Memory Summit?

FMS is the best networking opportunity in the storage industry!

The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage.… Read More


Memory Bandwidth Races Higher with HBM3

Memory Bandwidth Races Higher with HBM3
by Admin on 03-03-2022 at 1:44 pm

March 15th @ 11am PT | 2pm ET

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3

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Creating Reliable Memory Interfaces Fast and Easy

Creating Reliable Memory Interfaces Fast and Easy
by Admin on 01-26-2022 at 1:45 pm

Part of Keysight’s ‘Simulating for High-Speed Digital Insights’ webinar series

October 13, 2022 | 10:00 AM PT / 1:00 PM ET

Successful memory interface design is more than building and simulating one design that works to the given specification. As a designer, your success relies on making a robust implementation… Read More


Analyzing Memory Bus to Meet with DDR Specifications

Analyzing Memory Bus to Meet with DDR Specifications
by Admin on 01-26-2022 at 1:42 pm

Part of Simulating for High-Speed Digital Insights series

April 14, 2022 | 10:00 AM PT / 1:00 PM ET

Due to ever increasing data demand, the speed grade for memory is now in the multi-gigabit range. Memory bus design becomes a lot more complicated with tighter design margins due to higher crosstalk between vias and traces along with… Read More


How Synopsys Interface IP and Arm Interoperate to Accelerate System IO and Memory Performance

How Synopsys Interface IP and Arm Interoperate to Accelerate System IO and Memory Performance
by Admin on 08-13-2021 at 10:05 am

In this webinar, Synopsys and Arm describe how their recent collaboration helps maximize system performance and shorten Arm-based SoC design cycles. Learn how to minimize HPC/data center SoC design risk and ensure end-to-end IP integration, using available Arm reference designs and interoperability reports. Find out how… Read More


Can Threshold Switches Replace Transistors in the Memory Cell?

Can Threshold Switches Replace Transistors in the Memory Cell?
by Fred Chen on 06-08-2020 at 6:00 am

Threshold switch I V

The overwhelming majority of transistors produced in the world are used in memory cells, either as the memory itself (Flash, SRAM), or as the access device (DRAM). Yet, it is not necessary to have a transistor in every memory cell. In 2015, 3D XPoint, the first major product based on transistor-less memory cells, was announced [1].

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Lithography Resolution Limits – Arrayed Features

Lithography Resolution Limits – Arrayed Features
by Fred Chen on 04-17-2020 at 6:00 am

Lithography Resolution Limits Arrayed Features

State-of-the-art chips will always include some portions which are memory arrays, which also happen to be the densest portions of the chip. Arrayed features are the main targets for lithography evaluation, as the feature pitch is well-defined, and is directly linked to the cost scaling (more features per wafer) from generation… Read More