Webinar – AI/ML SoC Memory and Interconnect IP Perspectives

Webinar – AI/ML SoC Memory and Interconnect IP Perspectives
by Tom Simon on 10-08-2019 at 10:00 am

For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More


What are SOTIF and Fail-Operational and Does This Affect You?

What are SOTIF and Fail-Operational and Does This Affect You?
by Bernard Murphy on 05-22-2019 at 7:00 am

Standards committees, the military and governmental organizations are drawn to acronyms as moths are drawn to a flame, though few of them seem overly concerned with the elegance or memorability of these handles. One such example is SOTIF – Safety of the Intended Function – more formally known as ISO/PAS 21448. This is a follow-on… Read More


Supporting ASIL-D Through Your Network on Chip

Supporting ASIL-D Through Your Network on Chip
by Bernard Murphy on 09-20-2018 at 7:00 am

The ISO 26262 standard defines four Automotive Safety Integrity Levels (ASILs), from A to D, technically measures of risk rather than safety mechanisms, of which ASIL-D is the highest. ASIL-D represents a failure potentially causing severe or fatal injury in a reasonably common situation over which the driver has little control.… Read More


SEMICON West – Advanced Interconnect Challenges

SEMICON West – Advanced Interconnect Challenges
by Scotten Jones on 07-28-2017 at 12:00 pm

At SEMICON West I attended the imec technology forum where Zsolt Tokei presented “How to Solve the BEOL RC Dilemma” and the SEMICON Economics of Density Scaling session where Larry Clevenger of IBM presented “Interconnect Scaling Strategic for Advanced Semiconductor Nodes”. I also had the opportunity… Read More


Automation for managed system-of-systems design

Automation for managed system-of-systems design
by Don Dingee on 10-26-2016 at 4:00 pm

Anybody who has done any bus & board system design knows the problem. Merchant boards typically have standardized pinouts (after years of haggling in standards organizations) for the backplane bus, and a group of user-defined pins for daughtercard I/O. Homegrown systems usually have a just-as-carefully defined proprietary… Read More


Electrical-Optical Design, A Bridge to Terabitsia

Electrical-Optical Design, A Bridge to Terabitsia
by Mitch Heins on 07-19-2016 at 12:00 pm

If you don’t get the tongue in cheek reference of the title, you probably don’t have children who liked to watch Disney movies. All four of my daughters loved Disney and so, I am forever shaped by the Wonderful World of Disney. In 2007 Disney adapted to the screen a novel called, ‘A Bridge to Terabithia’, in which two adolescents escape… Read More


New CoreLink IP ties in mobile GPU coherently

New CoreLink IP ties in mobile GPU coherently
by Don Dingee on 10-29-2015 at 7:00 am

A mobile GPU is an expensive piece of SoC real estate in terms of footprint and power consumption, but critical to meeting user experience demands. GPU IP tuned for OpenGL ES is now a staple in high performance mobile devices, rendering polygons with shading and texture compression at impressive speeds.

Creative minds in the desktop… Read More


SEMI SMC: Atoms Still Don’t Scale

SEMI SMC: Atoms Still Don’t Scale
by Paul McLellan on 09-24-2015 at 7:00 am

Image RemovedLast Tuesday was the SEMI’s annual Strategic Materials Conference (SMC). The opening keynotes were given by Gary Patton, the CTO of GlobalFoundries, and Mark Thirsk, Managing Partner of Linx Consulting. This year it was held in the Computer History Museum (which always makes the commute interesting since… Read More


What’s Behind Carbon System Exchange – How Will it Scale?

What’s Behind Carbon System Exchange – How Will it Scale?
by Pawan Fangaria on 10-01-2014 at 4:00 pm

Earlier this year, when I was looking at Carbon’spast year performance which provided record breaking revenue with whopping jump in bookings, one thing was certain that Carbon Performance Analysis Kits (CPAKs) would drive major growth in future, not only for Carbon, but also for the semiconductor industry. It will initiate … Read More


Optimize Your Interconnect & Design at System Level for Best Results

Optimize Your Interconnect & Design at System Level for Best Results
by Pawan Fangaria on 09-16-2014 at 7:00 am

As the SoC design size, complexity and functionality keeps on increasing with multiple IPs packed together and design time and time-to-market keeps on decreasing amid critical constraints on PPA, there is no other alternative than to do the design first-time-right not to miss the window of opportunity. And that could be possible… Read More