All Things Semiconductor!
For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More
Standards committees, the military and governmental organizations are drawn to acronyms as moths are drawn to a flame, though few of them seem overly concerned with the elegance or memorability of these handles. One such example is SOTIF – Safety of the Intended Function – more formally known as ISO/PAS 21448. This is a follow-on… Read More
The ISO 26262 standard defines four Automotive Safety Integrity Levels (ASILs), from A to D, technically measures of risk rather than safety mechanisms, of which ASIL-D is the highest. ASIL-D represents a failure potentially causing severe or fatal injury in a reasonably common situation over which the driver has little control.… Read More
At SEMICON West I attended the imec technology forum where Zsolt Tokei presented “How to Solve the BEOL RC Dilemma” and the SEMICON Economics of Density Scaling session where Larry Clevenger of IBM presented “Interconnect Scaling Strategic for Advanced Semiconductor Nodes”. I also had the opportunity… Read More
Anybody who has done any bus & board system design knows the problem. Merchant boards typically have standardized pinouts (after years of haggling in standards organizations) for the backplane bus, and a group of user-defined pins for daughtercard I/O. Homegrown systems usually have a just-as-carefully defined proprietary… Read More
If you don’t get the tongue in cheek reference of the title, you probably don’t have children who liked to watch Disney movies. All four of my daughters loved Disney and so, I am forever shaped by the Wonderful World of Disney. In 2007 Disney adapted to the screen a novel called, ‘A Bridge to Terabithia’, in which two adolescents escape… Read More
A mobile GPU is an expensive piece of SoC real estate in terms of footprint and power consumption, but critical to meeting user experience demands. GPU IP tuned for OpenGL ES is now a staple in high performance mobile devices, rendering polygons with shading and texture compression at impressive speeds.
Creative minds in the desktop… Read More
Image RemovedLast Tuesday was the SEMI’s annual Strategic Materials Conference (SMC). The opening keynotes were given by Gary Patton, the CTO of GlobalFoundries, and Mark Thirsk, Managing Partner of Linx Consulting. This year it was held in the Computer History Museum (which always makes the commute interesting since… Read More
Earlier this year, when I was looking at Carbon’spast year performance which provided record breaking revenue with whopping jump in bookings, one thing was certain that Carbon Performance Analysis Kits (CPAKs) would drive major growth in future, not only for Carbon, but also for the semiconductor industry. It will initiate … Read More
As the SoC design size, complexity and functionality keeps on increasing with multiple IPs packed together and design time and time-to-market keeps on decreasing amid critical constraints on PPA, there is no other alternative than to do the design first-time-right not to miss the window of opportunity. And that could be possible… Read More
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Choose the Right ASIC Manufacturing Model for Your Business
Prototyping with Intel's New 80M FPGA and S2C!
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
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Choose the Right ASIC Manufacturing Model for Your Business
Prototyping with Intel’s New 80M FPGA and S2C!
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REPLAY: PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
REPLAY: Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
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better_recent_comments-2
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Widget_Better_Recent_Comments
Is the ASIC Business Dead?