There is a lot of interest right now in how Intel compares to the leading foundries and what the future may hold.
Several years ago, I published several extremely popular articles converting processes from various companies to “Equivalent Nodes” (EN). Nodes were at one time based on actual physical features of processes but had… Read More
When I think about servers and data centers, I think about multiple-core/high-power CPUs, Intel’s domination over the years and GPUs coming on strong in recent years. I think about very fast digital interfaces, such as PCI Express connections and the latest DDR memory interface. Precision analog isn’t something that first comes… Read More
-Intel good results had a little extra help to be great
-New CEO commits to remaining an IDM versus fabless
-Claims of strong progress on 7NM fuel optimism inside
-Outsourcing to TSMC will not go away but will increase
A good quarter but with some silicon enhancements from ICAP
Intel reported Revenues of $20B and EPS of $1.52, which… Read More
I had a chance to catch up with Arun Iyengar, CEO of Untether AI. Untether AI recently unveiled its tsunAImi accelerator cards powered by the company’s runAI devices. Using at-memory computation, Untether AI breaks through the barriers of traditional von Neumann architectures, offering industry-leading compute density … Read More
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention. Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More
There are significant advances in communication protocols happening all around us. The Peripheral Component Interconnect Express (PCIe) Gen 5 standard is delivering the needed device-to-device performance to support artificial intelligence and machine learning applications as well as cloud-based workloads. The rapidly… Read More
The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. [1]
The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin. The “gate-all-around” characteristics… Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More
Bloomberg did an interview with my favorite semiconductor analyst Stacy Rasgon on “How the Number One U.S. Semiconductor Company Stumbled” that I found interesting. Coupled with the Q&A Bob Swan did at the Credit Suisse Annual Technology Conference I thought it would be good content for a viral blog.
