The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation

The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
by Kalar Rajendiran on 08-15-2024 at 6:00 am

Comparative Analysis of Chiplet Interconnect Standards (Physical Layer)

The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More


On Standards and Open-Sourcing. Verification Talks

On Standards and Open-Sourcing. Verification Talks
by Moshe Zalcberg on 07-05-2021 at 6:00 am

Meetup panel min 1

At Veriest we host VERIFICATION MEETUPS periodically to share verification wisdom. In our virtual meetings we’ve had hundreds of attendants from the US, Europe, Israel, India, and China. Most recently we were able to host a live event in Israel – I want to share feedback from that meeting.

We started with two presentations:… Read More


Innovation in Verification – January 2020

Innovation in Verification – January 2020
by Bernard Murphy on 01-09-2020 at 6:00 am

Innovation

I’m kicking off a blog series which should appeal to many of us in functional verification. Paul Cunningham (GM of the Verification Group at Cadence), Jim Hogan (angel investor and board member extraordinaire) and I (sometime blogger) like to noodle from time to time on papers and other verification articles which inspire us.… Read More


Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling

Optimizing High Performance Packages calls for Multidisciplinary 3D Modeling
by Tom Simon on 10-16-2019 at 10:00 am

For all the time we spend thinking and talking about silicon design, it’s easy to forget just how important package design is. Semiconductor packages have evolved over the years from very basic containers for ICs into very specialized and highly engineered elements of finished electronic systems. They play an important role … Read More


China Winning the Future of the semiconductor industry?

China Winning the Future of the semiconductor industry?
by Bart van Hezewijk on 09-01-2019 at 11:00 am

In this second article about China’s role in the global semiconductor industry I analyse the impact of the Chinese government’s Big Fund and compare Chinese investments in semiconductor R&D with those in other countries. In my previous article, I looked at the possible effects of a US-China decoupling in theRead More


What if this is as good as the iPhone gets?

What if this is as good as the iPhone gets?
by Don Dingee on 03-23-2016 at 4:00 pm

How do I write about Apple so well? “I think of Steve Jobs, and I take away vision and creativity.” Please recognize that is a bit tongue in cheek, but I do think we are at a turning point where Apple is having a very hard time moving its loyal customers toward continued upgrades, and it is forcing them into unusual compromises.… Read More


Intel reaches for all-new experience at CES2016

Intel reaches for all-new experience at CES2016
by Don Dingee on 01-06-2016 at 1:30 pm

When Gary Shapiro introduced Brian Krzanich for Intel’s keynote at #CES2016, he just possibly may have been the last person to say “Moore’s Law” outside of a museum ever again. Krzanich was about to take Intel into new territory, where “Copy Exactly” and tick-tock also don’t matter.… Read More


Semiconductor Mergers – Innovation or Consolidation?

Semiconductor Mergers – Innovation or Consolidation?
by Pawan Fangaria on 08-02-2015 at 8:00 pm

About 3 years ago, I had written an article about consolidation in the semiconductor landscape where I had articulated 4 main reasons of consolidation – Macroeconomics, Business Leadership, Technology Leadership, and IP leadership. Back then, based on the state of affairs in the semiconductor industry, I had also mentioned… Read More


SEMICON Day 3: Leti, Intel Keynote, 450mm (Pic!) and Innovation Keynote

SEMICON Day 3: Leti, Intel Keynote, 450mm (Pic!) and Innovation Keynote
by Paul McLellan on 07-15-2015 at 11:59 am

Let’s start with yesterday evening, so technically yesterday. It was July 14th, which is the equivalent of Independence Day in France. So the perfect day for Leti, based in Grenoble, to present a lot of the work that they are doing on 3D “more than Moore” type technologies, including photonics. Also, wafer-scale… Read More