A Comprehensive Automated Assertion Based Verification

A Comprehensive Automated Assertion Based Verification
by Pawan Fangaria on 02-13-2015 at 4:00 pm

Using an assertion is a sure shot method to detect an error at its source, which may be buried deep within a design. It does not depend on a test bench or checker, and can fire automatically as soon as a violation occurs. However, writing assertions manually is very difficult and time consuming. To do so require deep design and coding… Read More


Measuring Metastability

Measuring Metastability
by Jerry Cox on 01-24-2015 at 7:00 am

Measuring metastability is just 50 years old this year. In 1965 my colleague Tom Chaney took a sampling ‘scope picture of an ECL flip-flop going metastable. S. Lubkin had made mention of the phenomenon over a decade before that, but at that time most engineers were unaware of the phenomenon or did not believe it actually existed. … Read More


Its a bouncing baby IEEE standard!

Its a bouncing baby IEEE standard!
by Beth Martin on 11-04-2014 at 12:00 am

Pass the cigars! On November 3rd, 2014, the IEEE-SA Standards Board finally approved IEEE P1687 as a new standard. From now on, you can drop the “P” and just call it 1687, or to its friends, IJTAG. Now would be a good time to sign up for an IJTAG technical workshop.

The new IEEE 1687 Internal JTAG (IJTAG) standard is changing… Read More


SEMI Breakfast Forums: the Internet of Things

SEMI Breakfast Forums: the Internet of Things
by Paul McLellan on 03-21-2014 at 4:29 pm

Coming up on April 10th is the SEMI Silicon Valley Breakfast Forum Internet of Things—Driving the Microelectronics Revolution. It runs from 7am to 10.45am and will be held at SEMI Headquarters which is at 3081 Zanker Road in San Jose.

Widespread adoption of the Internet of Things will take time, but the movement is advancing thanks… Read More


Grid Vision 2050 – Unified & Open Across The Globe

Grid Vision 2050 – Unified & Open Across The Globe
by Pawan Fangaria on 02-02-2014 at 10:30 am

Whenever there is good momentum in a particular technology, IEEEtakes major initiative to standardize the procedures, formats, methods, measurements etc. involved in the technology to proliferate it for the advantage of wider community. And that becomes successful by active participation and collaboration of both producers… Read More


TSMC ♥ Synopsys (HSPICE)

TSMC ♥ Synopsys (HSPICE)
by Daniel Nenni on 10-24-2013 at 5:05 am

In case you haven’t noticed, Synopsys has been in the press lately talking about their relationship with TSMC. Since I’m an internationally recognized industry expert they gave me a call for a briefing and I was happy to do it. Staying connected with the #1 EDA company is important and fun since I get to ask questions that most people… Read More


ICCAD at 30: Alberto Looks Back and Forward

ICCAD at 30: Alberto Looks Back and Forward
by Paul McLellan on 11-08-2012 at 8:10 pm

At ICCAD earlier this week, CEDA sponsored a talk by Alberto Sangiovanni-Vincentelli looking back over the last 30 years (it is the 30th anniversary of ICCAD) and looking to the future. As is always the case in these sorts of presentations, the retrospective contained a lot more detail than the going forward part. Clayton Christensen… Read More


ISSCC 2012: Silicon Systems for Sustainability!

ISSCC 2012: Silicon Systems for Sustainability!
by Daniel Nenni on 02-26-2012 at 4:00 pm


What can we do for Earth’s sustainability? Besides sorting our garbage and recycling our lawn clippings? Sustainability must be the paramount theme for the future of human society! Semiconductors for a better life! Well, according to my kids, if you take away their smart phones there is no life!… Read More


3D-IC Physical Design

3D-IC Physical Design
by Pawan Fangaria on 02-22-2012 at 10:00 am

When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More


Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA

Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA
by Daniel Payne on 11-19-2011 at 4:42 pm

The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More