The most viewed blogs I write for SemiWiki are consistently blogs comparing the four leading edge logic producers, GLOBALFOUNDRIES (GF), Intel, Samsung (SS) and TSMC. Since the last time I compared the leading edge new data has become available and several new processes have been introduced. In this blog I will update the current… Read More
This year the Advanced Lithography Conference felt very different to me than the last couple of years. I think it was Chris Mack who proclaimed it the year of Stochastics. EUV has dominated the conference for the last several years but in the past the conversation has been mostly centered on the systems, system power and uptime.
I … Read More
I was invited to present at Nikon’s LithoVision event held the day before the SPIE Advanced Lithography Conference in San Jose. The following is a write up of the talk I gave. In this talk I discuss the three main segments in the semiconductor industry, NAND, DRAM and Logic and how technology transitions will affect lithography.… Read More
At IEDM in December I had a chance to interview Thomas Ernst about the paper “Performance and Design Considerations for Gate-All-around Stacked-NanoWires FETs” by Leti and STMicroelectonics.
Leti published the first stacked nanowire in 2006, it was very new then, now stacked nanowire/nanosheets are starting… Read More
As I have said many times, IEDM is one of the premier conferences for semiconductor technology. On Sunday before the formal conference started I took the “Boosting Performance, Ensuring Reliability, Managing Variation in sub-5nm CMOS” short course. The second module in the course was “Multi-Vt Engineering… Read More
I was invited to give a talk at the ISS conference on the Impact of EUV on the Semiconductor Supply Chain. The ISS conference is an annual gathering of semiconductor executives to review technology and global trends. In this article I will walk through my presentation and conclusions.… Read More
As I have discussed in previous blogs, IEDM is one of the premier conferences to learn about the latest developments in semiconductor technology. … Read More
The challenges of 7nm are well documented. Lithography artifacts create exploding design rule complexity, mask costs and cycle time. Noise and crosstalk get harder to deal with, as does timing closure. The types of applications that demand 7nm performance will often introduce HBM memory stacks and 2.5D packaging, and that creates… Read More
This week Dr. Eric Esteve, Dr. Bernard Murphy, and I will be blogging live from Arm TechCon. It really looks like it will be a great conference so you should see some interesting blogs in the coming days. One of the topics I am interested in this year is foundation IP and I will tell you why.
During the fabless transformation of the semiconductor… Read More
“Mobile is the largest platform ever built by humanity”, Christiano Amon, Executive Vice President, Qualcomm Technologies, Inc. and President, Qualcomm CDMA Technologies speaking at the GLOBALFOUNDRIES Technologies Conference (GTC) 2017.… Read More
