We all know the signal integrity and power integrity challenges of high-performance system design. It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More
Greater demand for more data exchange within data centers is being driven by mobile computing and the Internet-of-Everything. In 2011, it was estimated that over 1 Zettabytes (ZB) of data was pushed through the internet. That’s 1×10[SUP]21[/SUP] bytes of data. And, that amount has been doubling every 3 years since. Given… Read More
There’s an old adage, attributed to renowned computer scientist Andrew Tannenbaum, one that perhaps only engineers find amusing: “The nice thing about standards is that you have so many to choose from.” Nevertheless, IEEE standards arise from customer requirements in the electronics industry. Many relate… Read More
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Turnkey solution to simplify Body Bias implementation in FDSOI technology
SPICE Simulator 2X/3X Faster than FastSPICE on Full Chip Simulation
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Hybrid-Prototyping with the New ProtoBridge 3.0 Transactor
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