Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology

Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology
by Mike Gianfagna on 09-11-2020 at 6:00 am

Samtec Direct Connect to IC Package Technology

We all know the signal integrity and power integrity challenges of high-performance system design.  It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More


Si Photonics in a 300mm Fab – This is Getting Serious!

Si Photonics in a 300mm Fab – This is Getting Serious!
by Mitch Heins on 05-13-2016 at 7:00 am

Greater demand for more data exchange within data centers is being driven by mobile computing and the Internet-of-Everything. In 2011, it was estimated that over 1 Zettabytes (ZB) of data was pushed through the internet. That’s 1×10[SUP]21[/SUP] bytes of data. And, that amount has been doubling every 3 years since. Given… Read More


Channel Operating Margin (COM) — A Standard for SI Analysis

Channel Operating Margin (COM) — A Standard for SI Analysis
by Tom Dillinger on 05-12-2016 at 12:00 pm

There’s an old adage, attributed to renowned computer scientist Andrew Tannenbaum, one that perhaps only engineers find amusing: “The nice thing about standards is that you have so many to choose from.” Nevertheless, IEEE standards arise from customer requirements in the electronics industry. Many relate… Read More