-New PUV light source will push litho into Angstrom Era
-Rare earth elements shortages add to supply chain woes
-Could strategic wafer reserve releases lower memory pricing
-Can we cut off/turn off Russian access to chip equipment?
DUV, EUV and now “PUV” to become next generation lithography
Lithography is the locomotive… Read More
I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.
If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More
Curvilinear Design Primer for Design, Packaging Communities
This interview was done by Bob Smith, Executive Director, ESD Alliance, a SEMI Technology Community.
Previously, Fujimura served as CTO at Cadence Design Systems and returned to Cadence for the second time through the acquisition of Simplex Solutions where he was… Read More
EUV lithography systems continue to be the source of much hope for continuing the pace of increasing device density on wafers per Moore’s Law. Recently, although EUV systems were originally supposed to help the industry avoid much multipatterning, it has not turned out to be the case [1,2]. The main surprise has been the
In previous articles, I had looked at EUV stochastic behavior [1-2], primarily in terms of the low photon density resulting in shot noise, described by the Poisson distribution [3]. The role of blur to help combat the randomness of EUV photon absorption and secondary electron generation and migration was also recently considered… Read More
KLA- great quarter driven by continued strong foundry/logic
No supply chain hiccups- Riding high in the cycle
Wafer inspection remains driver with rest along for the ride
Financials remain best in industry
A superb quarter
There was little to complain about in the quarter. Revenues of $2.1B and EPS of $4.64, both nicely beating… Read More
Recently, a patent application from TSMC [1] revealed target EUV doses used in the range of 30-45 mJ/cm2. However, it was also acknowledged in the same application that such doses were too low to prevent defects and roughness. Recent studies [2,3] have shown that by considering photon density along with blur, the associated shot… Read More
Lithography has been the driving force for shrinking feature sizes for decades, and the most easily identified factor behind this trend is the reduction of wavelength. G-line (436 nm wavelength) was used for 0.5 um in the late 1980s [1], and I-line (365 nm wavelength) was used down to 0.3 um in the 1990s [2]. Then began the era of deep-ultraviolet… Read More
High-NA EUV has received a lot of attention ever since Intel put the spotlight on its receiving the first 0.55 NA EUV tool from ASML [1], expected in 2025. EUV itself has numerous issues which have been enumerated by myself and others, most notoriously the stochastic defects issue. There are also a host of issues related to the propagation… Read More
-KLA dominates process control like ASML dominates litho
-Industry in “panic mode” over capacity drives process control
-Like others, KLA tool supplies are in demand & tight supply
-Balance of 2021 “filled out” – now booking for 2022
Solid numbers and very solid guide for a better second … Read More
