The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More
The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More
From a business viewpoint we often read in the technical press about the virtues of applying AI, and in the early days most of the AI model building was done in the cloud, because of the high computation requirements, yet there’s a developing trend now to use AI accelerators at the Edge. The other mega-trend in the past decade… Read More
Dan is joined by Dr. Elad Alon, CEO and co-founder at Blue Cheetah Analog Design, Elad’s experience includes Professor of EECS at UC Berkeley, co-director of the Berkeley Wireless Research Center, and consulting or visiting positions with many global semiconductor companies.
Dan and Elad explore the trends for increasing … Read More
Compared to the automation of digital design, the development of automation for analog has taken a much more arduous path. Over the decades there have been many projects both academic and commercial to accelerate and improve the process for analog design. One of the most interesting efforts in this area is being spearheaded by … Read More
Dan is joined by Balaji Baktha, founder and CEO of Ventana Micro. Balaji explores the application of RISC-V in high-performance applications and the specific advantages of a chiplet-based approach.
RISC-V Summit Panel: https://www.youtube.com/watch?v=duZaAhWxhWM
The views, thoughts, and opinions expressed in these… Read More
Prior to founding Movellus, Dr. Faisal held positions at semiconductor companies such as Intel and PMC Sierra. Faisal received his B.S. from the University of Waterloo, and his M.S. and Ph.D. from the University of Michigan, and holds several patents. Dr. Faisal was named a “Top 20 Entrepreneur” by the University of Michigan Zell… Read More
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. This presentation is from Alchip, presented by James Huang,… Read More
