At #61DAC, I love it when an exhibitor booth uses a descriptive tagline to explain what they do, like when the Blue Cheetah booth displayed Advancing Chiplet Interconnectivity. Immediately, I knew that they were an IP provider focusing on chiplets. I learned what sets them apart is how customizable their IP is to support specific… Read More
DAC starts June 24th and I can already feel the buzz of excitement building up as I receive updates from EDA vendors like Keysight EDA. Talking with Scott Seiden, Director Strategic Marketing, Keysight EDA Portfolio, I learned that they have the largest booth on the first floor, now that’s a statement that caught my attention. This… Read More
Multiple Sessions – All English Language:
14:00 JST (APAC)
10:00 EDT, 16:00 CET (AMER and EUR)
Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics… Read More
Artificial Intelligence (AI) continues to revolutionize industries, from healthcare and finance to automotive and manufacturing. AI applications, such as machine learning, deep learning, and neural networks, rely on vast amounts of data for training, inference, and decision-making processes. As AI algorithms become … Read More
GenAI, the most talked-about manifestation of AI these days, imposes two tough constraints on a hardware platform. First, it demands massive memory to serve large language model with billions of parameters. Feasible in principle for a processor plus big DRAM off-chip and perhaps for some inference applications but too slow … Read More
Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industry… Read More
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
