Blue Cheetah Advancing Chiplet Interconnectivity #61DAC

Blue Cheetah Advancing Chiplet Interconnectivity #61DAC
by Daniel Payne on 07-18-2024 at 10:00 am

blue cheetah 61dac min

At #61DAC, I love it when an exhibitor booth uses a descriptive tagline to explain what they do, like when the Blue Cheetah booth displayed Advancing Chiplet Interconnectivity. Immediately, I knew that they were an IP provider focusing on chiplets. I learned what sets them apart is how customizable their IP is to support specific… Read More


Keysight EDA at the 2024 Design Automation Conference

Keysight EDA at the 2024 Design Automation Conference
by Daniel Payne on 06-17-2024 at 8:00 am

DAC 2024 Banner

DAC starts June 24th and I can already feel the buzz of excitement building up as I receive updates from EDA vendors like Keysight EDA. Talking with Scott Seiden, Director Strategic Marketing, Keysight EDA Portfolio, I learned that they have the largest booth on the first floor, now that’s a statement that caught my attention. This… Read More


Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs

Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs
by Admin on 05-30-2024 at 4:11 pm

Multiple Sessions – All English Language:

14:00 JST (APAC)

10:00 EDT, 16:00 CET (AMER and EUR)

Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics… Read More


AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs

AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs
by Kalar Rajendiran on 05-27-2024 at 10:00 am

Alphwave Semi UCIe PHY Support for All Package Types

Artificial Intelligence (AI) continues to revolutionize industries, from healthcare and finance to automotive and manufacturing. AI applications, such as machine learning, deep learning, and neural networks, rely on vast amounts of data for training, inference, and decision-making processes. As AI algorithms become … Read More


Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI

Alphawave Semi Bridges from Theory to Reality in Chiplet-Based AI
by Bernard Murphy on 04-25-2024 at 10:00 am

Alphawave Semi min

GenAI, the most talked-about manifestation of AI these days, imposes two tough constraints on a hardware platform. First, it demands massive memory to serve large language model with billions of parameters. Feasible in principle for a processor plus big DRAM off-chip and perhaps for some inference applications but too slow … Read More


Synopsys & AMD Webinar – Final Frontier: The Next Generation of 3DIC Interposer/InFO Design

Synopsys & AMD Webinar – Final Frontier: The Next Generation of 3DIC Interposer/InFO Design
by Admin on 04-23-2024 at 1:34 pm

In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm,

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Webinar: Exploring the Advancement of Chiplet Technology and the Ecosystem

Webinar: Exploring the Advancement of Chiplet Technology and the Ecosystem
by Admin on 03-25-2024 at 1:24 pm

Semiconductor companies are making transistors smaller and cramming more into chips to meet the demands of today’s high-tech industries and applications. In fact, in a recent article from the Financial Times, technology industry consultants McKinsey forecast that semiconductors will become a trillion-dollar industryRead More


2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification

2024 DVCon US Panel: Overcoming the challenges of multi-die systems verification
by Daniel Nenni on 03-25-2024 at 10:00 am

Dvcon 2024

2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it.  Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More


How MZ Technologies is Making Multi-Die Design a Reality

How MZ Technologies is Making Multi-Die Design a Reality
by Mike Gianfagna on 03-04-2024 at 6:00 am

How MZ Technologies is Making Multi Die Design a Reality

The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More


ESD Alliance and Silicon Assurance Host Industry Panel Discussion on Chiplet Security

ESD Alliance and Silicon Assurance Host Industry Panel Discussion on Chiplet Security
by Bob Smith on 02-13-2024 at 6:00 am

Phishing,,E mail,,Network,Security,,Computer,Hacker,,Cloud,Computing,Cyber,Security

Security threats are a hot topic of discussion today as they can have a profound impact on the electronic infrastructure and devices that are the backbone of our global economies. It is also clear that these threats can be introduced during the design of the very devices that we rely on in our daily lives.

Chiplet-based design is … Read More