Chiplets at the Design Automation Conference with OpenFive

Chiplets at the Design Automation Conference with OpenFive
by Daniel Nenni on 08-02-2022 at 10:00 am

OpenFive Chiplet 59DAC

SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets at DAC#59 was OpenFive, a 17+ year spec-to-silicon… Read More


Alchip Technologies Offers 3nm ASIC Design Services

Alchip Technologies Offers 3nm ASIC Design Services
by Kalar Rajendiran on 07-14-2022 at 10:00 am

Alchip Design Technology Roadmap

Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More


Stop-For-Top IP Model to Replace One-Stop-Shop by 2025

Stop-For-Top IP Model to Replace One-Stop-Shop by 2025
by Eric Esteve on 06-17-2022 at 6:00 am

ALL Interface 2021 2026

…and support the creation of successful Chiplet business

The One-Stop-Shop model has allowed IP vendors of the 2000’s to create a successful IP business, mostly driven by consumer application, smartphone or Set-Top-Box. The industry has dramatically changed, and in 2020 is now driven by data-centric application (datacenter,… Read More


Standardization of Chiplet Models for Heterogeneous Integration

Standardization of Chiplet Models for Heterogeneous Integration
by Tom Dillinger on 06-09-2022 at 10:00 am

Chiplets

The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects.  Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes.  The power, performance, and cost for each unit may be optimized separately.… Read More


Die-to-Die IP enabling the path to the future of Chiplets Ecosystem

Die-to-Die IP enabling the path to the future of Chiplets Ecosystem
by Kalar Rajendiran on 05-30-2022 at 6:00 am

Die to Die Interface Figure of Merit

The topic of chiplets is getting a lot of attention these days. The chiplet movement has picked up more momentum since Moore’s law started slowing down as process technology approached 5nm. With the development cost of a monolithic SoC crossing the $500M and wafer yields of large die-based chips dropping steeply, the decision … Read More


IP Subsystems and Chiplets for Edge and AI Accelerators

IP Subsystems and Chiplets for Edge and AI Accelerators
by Daniel Payne on 05-02-2022 at 10:00 am

Scalable Chiplet Platform min

From a business viewpoint we often read in the technical press about the virtues of applying AI, and in the early days most of the AI model building was done in the cloud, because of the high computation requirements, yet there’s a developing trend now to use AI accelerators at the Edge. The other mega-trend in the past decade… Read More


Podcast EP71: Critical Enablers for the Custom Silicon Revolution

Podcast EP71: Critical Enablers for the Custom Silicon Revolution
by Daniel Nenni on 04-15-2022 at 10:00 am

Dan is joined by Dr. Elad Alon, CEO and co-founder at Blue Cheetah Analog Design, Elad’s experience includes Professor of EECS at UC Berkeley, co-director of the Berkeley Wireless Research Center, and consulting or visiting positions with many global semiconductor companies.

Dan and Elad explore the trends for increasing … Read More


Analog Design Acceleration for Chiplet Interface IP

Analog Design Acceleration for Chiplet Interface IP
by Tom Simon on 03-24-2022 at 10:00 am

Analog Generators Boost Designer Productivity

Compared to the automation of digital design, the development of automation for analog has taken a much more arduous path. Over the decades there have been many projects both academic and commercial to accelerate and improve the process for analog design. One of the most interesting efforts in this area is being spearheaded by … Read More


Podcast EP54: Ventana Micro, RISC-V, HPC and Chiplets

Podcast EP54: Ventana Micro, RISC-V, HPC and Chiplets
by Daniel Nenni on 12-24-2021 at 10:00 am

Dan is joined by Balaji Baktha, founder and CEO of Ventana Micro. Balaji explores the application of RISC-V in high-performance applications and the specific advantages of a chiplet-based approach.

RISC-V Summit Panel: https://www.youtube.com/watch?v=duZaAhWxhWM

The views, thoughts, and opinions expressed in these… Read More


CEO Interview: Mo Faisal of Movellus

CEO Interview: Mo Faisal of Movellus
by Daniel Nenni on 12-10-2021 at 6:00 am

Mo Faisal Movellus

Prior to founding Movellus, Dr. Faisal held positions at semiconductor companies such as Intel and PMC Sierra. Faisal received his B.S. from the University of Waterloo, and his M.S. and Ph.D. from the University of Michigan, and holds several patents. Dr. Faisal was named a “Top 20 Entrepreneur” by the University of Michigan Zell… Read More