ESD Alliance and Silicon Assurance Host Industry Panel Discussion on Chiplet Security

ESD Alliance and Silicon Assurance Host Industry Panel Discussion on Chiplet Security
by Bob Smith on 02-13-2024 at 6:00 am

Phishing,,E mail,,Network,Security,,Computer,Hacker,,Cloud,Computing,Cyber,Security

Security threats are a hot topic of discussion today as they can have a profound impact on the electronic infrastructure and devices that are the backbone of our global economies. It is also clear that these threats can be introduced during the design of the very devices that we rely on in our daily lives.

Chiplet-based design is … Read More


Podcast EP207: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis

Podcast EP207: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis
by Daniel Nenni on 02-09-2024 at 10:00 am

Dan is joined by Nick Ilyadis, vice president of product planning at Achronix. Prior to Achronix, Nick was vice president of portfolio and technology strategy at Marvell Semiconductor and vice president and group CTO at Broadcom. Nick has also held many engineering roles during his career, starting as a chip designer and moving… Read More


What ChatGPT has to say about the Chiplet Summit

What ChatGPT has to say about the Chiplet Summit
by Daniel Nenni on 02-04-2024 at 12:00 pm

Chiplet

Quite a few of the articles I now see about the semiconductor industry use AI. It is not hard to tell, especially for someone like myself, a 40 year experienced semiconductor professional who also writes. In the last 13 years (yes SemiWiki is now a teenager) we have published 9,058 blogs. SemiWiki was the first of now many semiconductor… Read More


Podcast EP206: An assessment of the Chiplet Ecosystem Movement with Alphawave’s Tony Chan Carusone

Podcast EP206: An assessment of the Chiplet Ecosystem Movement with Alphawave’s Tony Chan Carusone
by Daniel Nenni on 02-02-2024 at 10:00 am

Dan is joined by Tony Chan Carusone, Chief Technology Officer of Alphawave Semi. Tony has been a professor of Electrical and Computer Engineering at the University of Toronto since 2001 and has served as a Distinguished Lecturer for the IEEE Solid-State Circuits Society and on the Technical Program Committees of the world’s leading… Read More


Chiplets Open Pandora’s Box

Chiplets Open Pandora’s Box
by Daniel Nenni on 01-31-2024 at 6:00 am

Chiplet

Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More


Chiplet Summit 2024 Preview

Chiplet Summit 2024 Preview
by Daniel Nenni on 01-22-2024 at 10:00 am

Chiplet Summit 2024 Logo

The second annual Chiplet Summit is coming up and if it is anything like the first one it will not disappoint. Chiplets are a disruptive semiconductor technology that are already being used by the top semiconductor companies like Intel, Nvidia, AMD and others. These companies design their own chiplets so they are blazing the trail… Read More


2024 Outlook with Matt Burns of Samtec

2024 Outlook with Matt Burns of Samtec
by Daniel Nenni on 01-04-2024 at 6:00 am

Matt Burns Samtec

Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. It has been an honor working with Matt and his team for the last 3 years and I value… Read More


Prototyping Chiplets from the Desktop!

Prototyping Chiplets from the Desktop!
by Daniel Nenni on 12-05-2023 at 10:00 am

S2C PLM Mini

S2C has been successfully delivering rapid SoC prototyping solutions since 2003 with over 600 customers, including 6 of the world’s top 10 semiconductor companies. I personally have been involved with the prototyping market for a good part of my career and know S2C intimately.

S2C is the leading independent global supplier… Read More


Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration

Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration
by Kalar Rajendiran on 10-25-2023 at 10:00 am

3D IC Cross Section Illustration

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More


Intel Ushers a New Era of Advanced Packaging with Glass Substrates

Intel Ushers a New Era of Advanced Packaging with Glass Substrates
by Mike Gianfagna on 09-18-2023 at 10:00 am

Intel Ushers a New Era of Advanced Packaging with Glass Substrates


Intel recently issued a press announcement that has significant implications for the future of semiconductors.  The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rulesRead More