The explosive growth of artificial intelligence is transforming the semiconductor industry, and nowhere is this more evident than in the memory sector. AI training and inference workloads are fundamentally memory-intensive, driving unprecedented demand for advanced DRAM architectures, High Bandwidth Memory (HBM), and… Read More
As semiconductor designs continue to grow in complexity, FPGA prototyping has become an essential component of modern pre-silicon validation strategies. While FPGA capacity and gate-count equivalence often dominate discussions around prototyping platforms, the true value of an FPGA prototype lies elsewhere: its ability… Read More
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More
Geoffrey Rodgers spent most of his career at the intersection of semiconductor technology and go-to-market execution, with a focus on scaling businesses and bringing complex solutions to market. He previously led the Analog Go-To-Market motion at Synopsys following the acquisition of Analog Design Automation and held leadership… Read More
Dr. Moh Kolbehdari is a Senior Lead Architect at Socionext, where he specializes in the industrialization of high-performance AI chiplets and 1.8-Tb/s interconnects. With over two decades of experience in SI/PI, electromagnetic field theory, and system-level architecture, he has been a pivotal force in bridging the gap between… Read More
Alchip Technologies has recently reported significant progress in the development of advanced 2nm ASICs, positioning itself as a leader in next-generation semiconductor design for AI and HPC. The announcement highlights Alchip’s efforts to commercialize cutting-edge chip technologies and deliver highly customized … Read More
The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
