Podcast EP71: Critical Enablers for the Custom Silicon Revolution

Podcast EP71: Critical Enablers for the Custom Silicon Revolution
by Daniel Nenni on 04-15-2022 at 10:00 am

Dan is joined by Dr. Elad Alon, CEO and co-founder at Blue Cheetah Analog Design, Elad’s experience includes Professor of EECS at UC Berkeley, co-director of the Berkeley Wireless Research Center, and consulting or visiting positions with many global semiconductor companies.

Dan and Elad explore the trends for increasing … Read More


Analog Design Acceleration for Chiplet Interface IP

Analog Design Acceleration for Chiplet Interface IP
by Tom Simon on 03-24-2022 at 10:00 am

Analog Generators Boost Designer Productivity

Compared to the automation of digital design, the development of automation for analog has taken a much more arduous path. Over the decades there have been many projects both academic and commercial to accelerate and improve the process for analog design. One of the most interesting efforts in this area is being spearheaded by … Read More


Podcast EP54: Ventana Micro, RISC-V, HPC and Chiplets

Podcast EP54: Ventana Micro, RISC-V, HPC and Chiplets
by Daniel Nenni on 12-24-2021 at 10:00 am

Dan is joined by Balaji Baktha, founder and CEO of Ventana Micro. Balaji explores the application of RISC-V in high-performance applications and the specific advantages of a chiplet-based approach.

RISC-V Summit Panel: https://www.youtube.com/watch?v=duZaAhWxhWM

The views, thoughts, and opinions expressed in these… Read More


CEO Interview: Mo Faisal of Movellus

CEO Interview: Mo Faisal of Movellus
by Daniel Nenni on 12-01-2021 at 6:00 am

Mo Faisal Movellus

Prior to founding Movellus, Dr. Faisal held positions at semiconductor companies such as Intel and PMC Sierra. Faisal received his B.S. from the University of Waterloo, and his M.S. and Ph.D. from the University of Michigan, and holds several patents. Dr. Faisal was named a “Top 20 Entrepreneur” by the University of Michigan Zell… Read More


Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More


Blue Cheetah Technology Catalyzes Chiplet Ecosystem

Blue Cheetah Technology Catalyzes Chiplet Ecosystem
by Tom Simon on 09-09-2020 at 6:00 am

Blue Cheetah Ecosystem

There are many reasons today for dividing up large monolithic SoCs into chiplets that are connected together inside a single package. Let’s look at just some of these reasons. Many SoCs share a common processing core with application specific interfaces and specialized processing engines. Using chiplets would mean that it is… Read More


Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities

Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities
by Mike Gianfagna on 09-04-2020 at 10:00 am

Alchip machine learning design

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC.  This presentation is from Alchip, presented by James Huang,… Read More


Optimizing Chiplet-to-Chiplet Communications

Optimizing Chiplet-to-Chiplet Communications
by Tom Dillinger on 06-29-2020 at 6:00 am

bump dimensions

Summary
The growing significance of ultra-short reach (USR) interfaces on 2.5D packaging technology has led to a variety of electrical definitions and circuit implementations.  TSMC recently presented the approach adopted by their IP development team, for a parallel-bus, clock-forwarded USR interface to optimize power/performance/area… Read More


Webinar: An Intelligent System Design Platform for Chiplet-Based Architectures

Webinar: An Intelligent System Design Platform for Chiplet-Based Architectures
by Admin on 05-26-2020 at 11:33 pm

Date and Time

Wednesday, May 27, 2020
Time: 10:00am – 11:00am (PDT)

Providing the best alternative to advanced monolithic SoCs, multi-chiplet packages have become a very attractive option for the next generation of cost-sensitive designs. However, as many engineers begin to realize the benefits of a multi-chiplet packaging

Read More

TSMC – Solid Q3 Beat Guide- 5G Driver – Big Capex Bump – Flawless Execution

TSMC – Solid Q3 Beat Guide- 5G Driver – Big Capex Bump – Flawless Execution
by Robert Maire on 10-19-2019 at 6:00 am

TSMC puts up solid QTR, Capex increase for 5NM and capacity increase, 5G/mobile remains driver- HPC good 7NM, 27% of revs- Very nice margins!

In line quarter-Good guide
TSMC reported revenues of $9.4B and EPS of $0.62 , more or less in line with expectations, perhaps a touch below ” whisper” expectations which had been… Read More