Cadence and DesignCon – Workflows and SI/PI Analysis

Cadence and DesignCon – Workflows and SI/PI Analysis
by Daniel Nenni on 04-02-2022 at 6:00 am

Clarity 3D solver 112Gbps

DesignCon 2022 is back to a live conference, from Tuesday, April 5th through Thursday, April 7th, at the Santa Clara Convention Center.

Introduction

DesignCon is a unique gathering in our industry.  Its roots incorporated a focus on complex design and analysis requirements of (long-reach) high-speed interfaces.  Technical… Read More


Podcast EP67: Corigine Combines Emulation and Prototyping

Podcast EP67: Corigine Combines Emulation and Prototyping
by Daniel Nenni on 03-18-2022 at 10:00 am

Dan is joined by Jeff Critten, VP of sales at Corigine. They discuss the unique capabilities of Corigine that allows support of both emulation and prototyping in one platform.

Jeff Critten has been in the EDA industy for over 25yrs.  He started with Cadence as a verification AE in 1997 and moved into a sales role where he was promoted… Read More


Leveraging Virtual Platforms to Shift-Left Software Development and System Verification

Leveraging Virtual Platforms to Shift-Left Software Development and System Verification
by Kalar Rajendiran on 03-15-2022 at 6:00 am

Extend Accuracy with Hybrid Platforms

Ever since the cost of development started growing exponentially, engineering teams have been deploying a shift-left strategy to software development and system verification. While this has helped contain cost and accelerated product development schedules, a shift-left strategy is not without challenges. A virtual platform… Read More


The Intel Foundry Ecosystem Explained

The Intel Foundry Ecosystem Explained
by Daniel Nenni on 02-15-2022 at 5:00 am

Intel Tower Semiconductor Acquisition

Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More


The Semiconductor Ecosystem Explained

The Semiconductor Ecosystem Explained
by Steve Blank on 02-06-2022 at 6:00 am

TSMC Ecosystem Explained

The last year has seen a ton written about the semiconductor industry: chip shortages, the CHIPS Act, our dependence on Taiwan and TSMC, China, etc.

But despite all this talk about chips and semiconductors, few understand how the industry is structured. I’ve found the best way to understand something complicated is to diagram… Read More


How System Companies are Re-shaping the Requirements for EDA

How System Companies are Re-shaping the Requirements for EDA
by Kalar Rajendiran on 01-24-2022 at 10:00 am

Panelists and Cadence Moderator

As the oldest and largest EDA conference, the Design Automation Conference (DAC) brings the best minds together to present, discuss, showcase and debate the latest and greatest advances in EDA. It accomplishes this in the form of technical papers, talks, company booths, product pavilions and panel discussions.

A key aspect … Read More


Methodology for Aging-Aware Static Timing Analysis

Methodology for Aging-Aware Static Timing Analysis
by Tom Dillinger on 12-28-2021 at 10:00 am

char STA flow

At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.)  This article reviews the highlights of their presentation.

BackgroundRead More


More Than Moore and Charting the Path Beyond 3nm

More Than Moore and Charting the Path Beyond 3nm
by Kalar Rajendiran on 12-22-2021 at 10:00 am

Cadence AIML Technologies

The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More


Battery Sipping HiFi DSP Offers Always-On Sensor Fusion

Battery Sipping HiFi DSP Offers Always-On Sensor Fusion
by Tom Simon on 11-11-2021 at 10:00 am

HiFi DSP

Earbuds are one of the fastest growing market segments, which is creating the need for audio DSPs with higher performance and a smaller energy footprint. More than just being wireless speakers – earbuds, and wearables for that matter, have become a sophisticated extension of the user interface of phones and laptops, etc.… Read More


Design Planning and Optimization for 3D and 2.5D Packaging

Design Planning and Optimization for 3D and 2.5D Packaging
by Tom Dillinger on 10-25-2021 at 6:00 am

platform

Introduction

Frequent SemiWiki readers are aware of the growing significance of heterogeneous multi-die packaging technologies, offering a unique opportunity to optimize system-level architectures and implementations. The system performance, power dissipation, and area/volume (PPA/V) characteristics of a multi-die… Read More