Frequent SemiWiki readers are aware of the growing significance of heterogeneous multi-die packaging technologies, offering a unique opportunity to optimize system-level architectures and implementations. The system performance, power dissipation, and area/volume (PPA/V) characteristics of a multi-die… Read More
During his keynote address at the CadenceLIVE 2021 conference, CEO Lip-Bu Tan made some market trend comments. He observed that most of the data nowadays is generated at the edge but only 20% is processed there. He predicted that by 2030, 80% of data is expected to be processed at the edge. And most of this 80% will be processed on edge… Read More
As processor architecture and design development becomes completely liberated with open-source RISC-V instruction set architecture (ISA), the race to get RISC-V silicon in our hands has increased massively. We have no doubt that in next 5 years, we will see RISC-V based laptops and desktops in the market. But would these processors… Read More
Cadence invests heavily in the development of their Tempus Timing Signoff Solution due to its importance in the SoC design flow. I recently had a discussion on the topic of the most recent Tempus update with Brandon Bautz, senior product management group director in the Digital & Signoff Group, and Hitendra Divecha, product… Read More
When I started in EDA the big three were Daisy, Mentor and Valid (DMV as we called them). Then came Synopsys in 1986 followed by Cadence, which was a clever merger between ECAD (Dracula DRC) and Solomon Design. Daisy and Valid were pushed aside and then there were, “Three dogs hovering over one bowl of dog food, not a pretty site.”… Read More
The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces. There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2] (Many of the configurations of interest … Read More
Dan and Mike are joined by industry luminary Jim Hogan. In a rare interview, Jim talks about his life – how he got into semiconductors, EDA and venture investing. Jim’s time at Cadence as well as his work at ARM are explored. Jim also provides a concise and informative overview of how venture investing works. The podcast… Read More
Despite the large role of place and route in IC design, there will always be a need for custom layout design. This is particularly true in radio frequency (RF), power management (PM) and power amplifier (PA) circuits, among others. Cadence Virtuoso is by far the leading tool for creating these custom designs. Virtuoso has a sophisticated… Read More
Hands down, without a doubt, the most interesting CEO in semiconductors is Lip-Bu Tan, founder of Walden Capitol and current CEO of Cadence Design Systems. If you want to talk about a man with a plan it’s Lip-Bu Tan.
Before we get into the fireside chat between Tom Caufield and Lip-Bu at the GTC 2020 Virtual event let’s do a quick biography:… Read More
In July, I explored the benefits of the new Cadence Tempus™ Power Integrity Solution. In that piece, I explored some of the unique capabilities of this new tool with Brandon Bautz, senior product management group director and Hitendra Divecha, product management director in the Digital & Signoff Group at Cadence. I recently… Read More
