Tag: ansys

Webinar: Master’s Degree in Numerical Simulation with Ansys

Webinar: Master’s Degree in Numerical Simulation with Ansys
by Admin on 01-14-2025 at 3:02 am

Engineers solve today’s challenges by leveraging simulation, and the Technical University of Madrid (UPM) addresses this need with its Master’s Degree in Numerical Simulation. Developed in collaboration with Ansys, the program equips engineers to bridge the industry’s skills gap by fostering a deep understanding

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Webinar: Quickly Obtain Accurate Design of Surface Mount Filters with Ansys Nuhertz and Modelithics

Webinar: Quickly Obtain Accurate Design of Surface Mount Filters with Ansys Nuhertz and Modelithics
by Admin on 01-14-2025 at 3:00 am

Join us for a new approach to designing lumped-element filters and discover how easy such design can be while achieving the desired accuracy.

TIME:
January 28, 2025
11 AM EDT / 5 PM CET

Venue:
Virtual

Overview

Streamline the design of lumped-element and planar filters with Ansys Nuhertz Filter Solutions. For lumped-element filters,

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Webinar: Reduce Weight Using Optimal Material Selection

Webinar: Reduce Weight Using Optimal Material Selection
by Admin on 01-14-2025 at 2:56 am

From aerospace to automotive to medical to high technology, the right materials and design make a huge difference in a product’s performance, cost, and sustainability. But how do you choose the best material? Sign up for this webinar to find out.

TIME:
January 21, 2025
11 AM EST / 5 PM CET / 9:30 PM IST

Overview

Materials and design

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Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters

Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
by Daniel Nenni on 11-06-2024 at 10:00 am
Categories: 3D IC, Ansys, Inc., EDA, Events, Synopsys

banner for webinar

The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More

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Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am
Categories: 3D IC, AI, Chiplet, EDA, Foundries, IP, Synopsys, TSMC

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More

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Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products

Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products
by Marc Swinnen on 09-12-2024 at 10:00 am
Categories: Ansys, Inc., EDA

Probing

Integrated circuits, or chips, lie at the heart of today’s electronic systems that are mission critical for almost every sector of the economy – from healthcare, to banking, military equipment, cars, planes, telecommunications, and the internet itself. The data flowing through these systems is the lifeblood of modern… Read More

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Don’t Settle for Less Than Optimal – Get the Perfect Inductor Every Time

Don’t Settle for Less Than Optimal – Get the Perfect Inductor Every Time
by Bud Hunter on 05-09-2024 at 6:00 am
Categories: Ansys, Inc., EDA

Figure 1

The meaning of the word “Veloce” is “blazing fast”. It is the inspiration behind the name of the Ansys VeloceRF electromagnetic (EM) passive device synthesis platform that has been a favorite among RF and high-speed integrated circuit (IC) designers for more than 15 years. VeloceRF is a name that designers automatically connect… Read More

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Simulation World 2024 Virtual Event

Simulation World 2024 Virtual Event
by Daniel Nenni on 04-08-2024 at 10:00 am
Categories: Ansys, Inc., EDA, Events

ANSYS Inc Racecar Simulation

ANSYS Simulation World is an annual conference hosted by ANSYS, Inc., a leading provider of engineering simulation software. The event typically brings together engineers, designers, researchers, and industry experts from around the world to discuss the latest advancements, best practices, and case studies in engineering… Read More

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2024 Outlook with John Lee, VP and GM Electronics, Semiconductor and Optics Business Unit at Ansys

2024 Outlook with John Lee, VP and GM Electronics, Semiconductor and Optics Business Unit at Ansys
by Daniel Nenni on 03-21-2024 at 10:00 am
Categories: Ansys, Inc., EDA

John Lee Headshot

We have been working with Ansys since SemiWiki was founded in 2011. It has been a richly rewarding relationship in all regards. I always say the semiconductor industry is filled with the most intelligent people in the world and Ansys is an excellent proof point. I have known John Lee for 30+ years and he is one of my trusted few, absolutely.… Read More

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Unleash the Power: NVIDIA GPUs, Ansys Simulation

Unleash the Power: NVIDIA GPUs, Ansys Simulation
by Daniel Nenni on 03-19-2024 at 10:00 am
Categories: Ansys, Inc., Chiplet, EDA, Events

Electromagnatic PerceiveEM

In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.

Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More